Invited Speakers

 

Tadahiro Kuroda
Professor, Keio University

Title: 3D System Integration in a Package for Artificial Intelligence

Abstract: The connection problem of the early large-scale computers, the tyranny of numbers, was solved by the invention of the von Neumann computer, integrated circuit and solderless connection. However, the advance that has been achieved in all these technologies has made them the victim of their own success, with Moore’s Law scaling and connector miniaturization each reaching its limits, and von Neumann bottleneck exacerbating. Furthermore, the adoption of neural network and deep learning for Artificial Intelligence (AI) has once again brought to the forefront the challenges of scale and wiring in building hardwired computers. The solutions can be found in near-field coupling integration technologies – ThruChip Interface (TCI) and Transmission Line Coupler (TLC). TCI, a magnetic coupling technology, enables stacking DRAMs with an SoC to alleviate the von Neumann bottleneck. The same technology also enables stacking SRAMs with a neural network SoC to solve the challenges of scale and wiring in an AI computer. On the other hand, TLC, an electromagnetic coupling technology, enables a contactless connector that overcomes the scaling limits of its electro-mechanical counterpart. This talk will cover 3D SiP for AI with TCI and TLC.

Biography: Tadahiro Kuroda received the Ph.D. degree in electrical engineering from the University of Tokyo. In 1982, he joined Toshiba Corporation. In 2000, he moved to Keio University, where he has been a professor since 2002. He was a Visiting MacKay Professor at the University of California, Berkeley in 2007. His research interests include low-power CMOS design, near-field-coupling integration technology and artificial intelligence. He has published more than 440+ papers, including 38 ISSCC papers, 28 VLSI Symposia papers, 19 CICC papers and 17 A-SSCC papers. He wrote 29 books/chapters and filed >200 patents. He is an IEEE Fellow and an IEICE Fellow. He is currently serving as committee chair of VLSI Symposia and A-SSCC.