| In this paper, we will report novel method to realize small packaged size SAW device and functional SAW devices, in which two SAW devices are bonded by face to face bonding (FFB). We propose several kinds of FFB SAW devices and package structure of FFB SAW devices. We propose fabrication process such as via holes formation, bonding and dicing, we fabricated test devices using Quartz substrate and estimate basic characteristics of device and experiment results verify the possibility of this packaging method. We investigated effect of various parameters such as adhesive material thickness, dimension of package. |