Technical Program Committee (TPC) (143 Members)

Group 1: Medical Ultrasonics
  Vice Chair of TPC:
  Jan D'hooge, Ph.D.
  Catholic University of Leuven
  Leuven, Belgium

  Members:
  1. Olivier Basset: CREATIS, Université Lyon I, France
  2. Ayache Bouakaz: INSERM, Université Tours, France
  3. Charles Cain: University of Michigan, USA
  4. Jean-Yves Chapelon: INSERM, France
  5. Greg Clement: Harvard Medical School,USA
  6. Paul Dayton: UNC Chapel Hill and NC State University, USA
  7. Emad Ebbini: University of Minnesota, USA
  8. Stanislav Emelinov: University of Texas at Austin, USA
  9. David Evans: University of Leicester, UK
  10. Kathy Ferrara: University of California Davis, USA
  11. Stuart Foster: University of Toronto, Canada
  12. James Greenleaf: Mayo Clinic College of Medicine, USA
  13. Anne Hall: General Electric Medical Systems, USA
  14. Christopher Hall: Philips Research North America, USA
  15. Peter Hoskins: The University of Edinburgh, UK
  16. John Hossack: University of Virginia, USA
  17. Kullervo Hynynen: University of Toronto, Canada
  18. Jorgen Jensen: Technical University of Denmark, Denmark
  19. Nico de Jong: Erasmus Medical Centre and University of Twente, The Netherlands
  20. Hiroshi Kanai: Tohoku University, Japan
  21. Jeff Ketterling: Riverside Research Institute, USA
  22. Michael Kolios: Ryerson University, Canada
  23. Chris de Korte: Radboud University Nijmegen Medical Centre, The Netherlands
  24. Nobuki Kudo: Hokkaido University, Japan
  25. Pai-Chi Li: National Taiwan University, Taipei, Taiwan
  26. Jian-yu Lu: University of Toledo, USA
  27. Leonardo Masotti: Università degli Studi di Firenze, Italy
  28. Tom Matula: University of Washington, USA
  29. James G. Miller: Washington University in Saint Louis, USA
  30. Kathy Nightingale: Duke University, USA
  31. Svetoslav Nikolov: BK Medical, Denmark
  32. William O'Brien: University of Illinois, Urbana-Champaign, USA
  33. Georg Schmitz: Ruhr-Universität Bochum, Germany
  34. Ralf Seip: Philips Research North America, USA
  35. Mickael Tanter: Laboratoire Ondes et Acoustique, ESPCI, France
  36. Tom Thomas: Boston Scientific, Inc., USA
  37. Kai Thomenius: General Electric's Corporate R&D, USA
  38. Hans Torp: Norwegian University of Science and Technology, Norway
  39. Piero Tortoli: Università degli Studi di Firenze, Italy
  40. Ton van der Steen: Erasmus Medical Centre, Rotterdam, The Netherlands
  41. Kendall Waters: Silicon Valley Medical Instruments,USA
  42. Keith Wear: US Food and Drug Administration, USA

Group 2: Sensors, NDE, and Industrial Application
  Vice Chair of TPC:
  Jafar Saniie, Ph.D.
  Illinois Institute of Technology
  Chicago, Illinois, U.S.A.

  Members:
  1. Robert C. Addison: Rockwell Science Center, USA
  2. Walter Arnold: Fraunhofer Institute for Nondestructive Testing, Germany
  3. Michal Bezdek: Endress+Hauser Flowtec AG, Switzerland
  4. Ramazan Demirli: Villanova University, USA
  5. Eric S. Furgason: Purdue University, USA
  6. David Greve: Carnegie Mellon University, USA
  7. Edward Haeggstrom: University of Helsinki, Finland
  8. Mitsutaka Hikita: Kogakuin University, Japan
  9. Jacqueline Hines: Applied Sensor Research and Development Corporation, USA
  10. Fabien J. Josse: Marquette University, USA
  11. Lawrence W. Kessler: Sonoscan Inc., USA
  12. Pierre T. Khuri-Yakub: Stanford University, USA
  13. Mario Kupnik: Stanford University, USA
  14. Jun-ishi Kushibike: Tohoku University, Japan
  15. Roman Maev: University of Windsor, Canada
  16. Kentaro Nakamura: Tokyo Institute of Technology
  17. Massimo Pappalardo: University di Roma TRE, Italy
  18. Tony Sinclair: University of Toronto, Canada
  19. Bernhard Tittman: Pennsylvania State University, USA
  20. Jiromaru Tsujino: Kanagawa University, Japan
  21. John F. Vetelino: University of Maine, USA
  22. Paul Wilcox: University of Bristol, UK
  23. William Wright: University College Cork, Ireland
  24. Donald E. Yuhas: Industrial Measurement Systems, Inc., USA

Group 3: Physical Acoustics
  Vice Chair of TPC:
  Yook-Kong Yong, Ph.D.
  Rutgers University
  Piscataway, New Jersey, U.S.A.

  Members:
  1. Manabu Aoyagi: Muroran Institute of Technology, Japan
  2. Art Ballato: U.S. Army, USA
  3. Jan Brown: JB Consulting, USA
  4. Fred Hickernell: Retired from Motorola, USA
  5. Eun Sok Kim: U.S. Army, USA
  6. Yonkee Kim: U.S. Army, USA
  7. Minoru Kuribayashi Kurosawa: Tokoy Institute of Technology, Japan
  8. Amit Lal: Cornell University, USA
  9. John Larson: Avago Technologies, USA
  10. Vincent Laude: Institut FEMTO-ST, France
  11. George Mansfeld: Russian Academy of Sciences, Russia
  12. Valeri Proklov: Institute of Radio Engineering & Electricity, Russia
  13. Edgar Schmidhammer: EPCOS, Germany
  14. Susan Schneider: Marquette University, USA
  15. Bikash Sinha: Schlumberger-Doll Research, USA
  16. Ji Wang: Ningbo University, China
  17. Jiun Der Yu: Epson Research and Development, USA

Group 4: Microacoustics - SAW, FBAR, MEMS
  Vice Chair of TPC:
  Clemens Ruppel
  EPCOS AG
  Munich, Germany

  Members:
  1. Ben Abbott: Triquint, USA
  2. Robert Aigner: Triquint, USA
  3. Ivan Avramov: Institute of Solid State Physics, Bulgaria
  4. Sylvain Ballandras: LPMO, France
  5. Kushal Bhattacharjee: RF Micro Devices, USA
  6. Sunil Bhave: Cornell University, USA
  7. Sergey Biryukov: Leibniz Institute for Solid State and Materials Research Dresden (IFW), Germany
  8. Paul Bradley: Avago, USA
  9. Jidong Dai: RF Monolithics, USA
  10. Omar Elmazria: Universie' de Nancy--CNRS, France
  11. Gernot Fattinger: Sawtek, USA
  12. James Friend: Monash University, Australia
  13. Ken-ya Hashimoto: Chiba University, Japan
  14. Shitang He: IACAS, China
  15. Chunyun Jian: Nortel Networks, Canada
  16. Michio Kadota: Murata, Japan
  17. Jyrki Kaitila: Infineon, Germany
  18. Ilia Katardjiev: Uppsala University, Sweden
  19. Kimmo Kokkonen: Helsinki University of Technology, Finland
  20. Jan Kuypers: University of California, USA
  21. Ken Lakin: Consultant, USA
  22. Don Malocha: University of Central Florida, USA
  23. Hiroyuki Odagawa: Kumamoto National College of Technology, Japan
  24. Tuomas Pensala: VTT, Finland
  25. Mauricio Pereira da Cunha: University of Maine, USA
  26. Maximilian Pitschi: EPCOS AG, Germany
  27. Viktor Plessky: GVR Trade SA, Switzerland
  28. Leonard Reindl: Albert-Ludwigs-University Freiburg, Germany
  29. Richard Ruby: Avago Tech, USA
  30. Takahiro Sato: Samsung, Japan
  31. Marc Solal: Sawtek, USA
  32. Karl Wagner: EPCOS AG, Germany
  33. Robert Weigel: Friedrich-Alexander University, Germany
  34. Sergei Zhgoon: Moscow Power Engineering Institute, Russia

Group 5: Transducers and Transducer Materials
  Vice Chair of TPC:
  Jian Yuan
  Boston Scientific, USA

  Members:
  1. Sandy Cochran: University of Dundee, UK
  2. Christopher Daft: Siemens Medical Solutions, USA
  3. Levent Degertekin: Georgia Institute of Technology, USA
  4. Charles Emery: Mirabilis Medica, USA
  5. John Fraser: Philips Medical Systems, USA
  6. Jean-Francois Gelly: GE Healthcare, France
  7. Reinhard Lerch: Friedrich-Alexander-Universität Erlangen-Nuremberg, Germany
  8. Geoff Lockwood: Queen's University, Canada
  9. Clyde Oakley: W. L. Gore, USA
  10. Omer Oralkan: Stanford University, USA
  11. Paul Reynolds: Weidlinger Associates, USA
  12. Yongrae Roh: Kyungpook National University, Korea
  13. Arne Ronnekleiv: Norwegian University od Science & Technology, Norway
  14. Ahmad Safari: Rutgers University, USA
  15. Mark Schafer: Sonic Tech Inc., USA
  16. Kirk Shung: University of Southern California, USA
  17. Scott Smith: GE Global Research, USA
  18. Stephen Smith: Duke University, USA
  19. Wallace Smith: Office of Naval Research, USA
  20. Yasuhito Takeuchi: Kagoshima University, Japan
  21. Qiming Zhang: Pennsylvania State University, USA
  22. Qifa Zhou: University of Southern California, USA

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