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Technical Program Committee (TPC) (150 Members)
Group 1: Medical Ultrasonics
Vice Chair of TPC:
Jan D'hooge, Ph.D.
Catholic University of Leuven
Leuven, Belgium
Members:
- Olivier Basset: CREATIS, Université Lyon I, France
- Ayache Bouakaz: INSERM, Université Tours, France
- Lori Bridal: Univ. Pierre and Marie Curie, France
- Charles Cain: University of Michigan, USA
- Jean-Yves Chapelon: INSERM, France
- Greg Clement: Harvard Medical School,USA
- Paul Dayton: UNC Chapel Hill and NC State University, USA
- Emad Ebbini: University of Minnesota, USA
- Stanislav Emelinov: University of Texas at Austin, USA
- David Evans: University of Leicester, UK
- Kathy Ferrara: University of California Davis, USA
- Stuart Foster: University of Toronto, Canada
- James Greenleaf: Mayo Clinic College of Medicine, USA
- Anne Hall: General Electric Medical Systems, USA
- Christopher Hall: Philips Research North America, USA
- Peter Hoskins: The University of Edinburgh, UK
- John Hossack: University of Virginia, USA
- Kullervo Hynynen: University of Toronto, Canada
- Jorgen Jensen: Technical University of Denmark, Denmark
- Nico de Jong: Erasmus Medical Centre and University of Twente, The Netherlands
- Hiroshi Kanai: Tohoku University, Japan
- Jeff Ketterling: Riverside Research Institute, USA
- Michael Kolios: Ryerson University, Canada
- Elisa Konofagou: Columbia University, USA
- Chris de Korte: Catholic Univ. of Nijmegen, The Netherlands
- Nobuki Kudo: Hokkaido University, Japan
- Pai-Chi Li: National Taiwan University, Taipei, Taiwan
- Jian-yu Lu: University of Toledo, USA
- Leonardo Masotti: Universittà degli Studi di Firenze, Italy
- Tom Matula: University of Washington, USA
- James G. Miller: Washington University in Saint Louis, USA
- Kathy Nightingale: Duke University, USA
- Svetoslav Nikolov: BK Medical, Denmark
- William O'Brien: University of Illinois, Urbana-Champaign, USA
- Georg Schmitz: Ruhr-Universität Bochum, Germany
- Ralf Seip: Philips Research North America, USA
- Mickael Tanter: INSERM, France
- Tom Thomas: Boston Scientific, Inc., USA
- Kai Thomenius: General Electric's Corporate R&D, USA
- Hans Torp: Norwegian University of Science and Technology, Norway
- Piero Tortoli: Univerniversità degli Studi di Firenze, Italy
- Ton van der Steen: Erasmus Medical Centre, Rotterdam, The Netherlands
- Kendall Waters: Silicon Valley Medical Instruments,USA
- Keith Wear: US Food and Drug Administration, USA
- Wilko Wilkening: Siemens Medical Solution, USA
Group 2: Sensors, NDE, and Industrial Application
Vice Chair of TPC:
Jafar Saniie, Ph.D.
Illinois Institute of Technology
Chicago, Illinois, U.S.A.
Members:
- Robert C. Addison: Rockwell Science Center, USA
- Walter Arnold: Fraunhofer Institute for Nondestructive Testing, Germany
- Michal Bezdek: Endress+Hauser Flowtec AG, Switzerland
- Ramazan Demirli: Villanova University, USA
- James Friend: Monash University, Australia
- Eric S. Furgason: Purdue University, USA
- David Greve: Carnegie Mellon University, USA
- Edward Haeggstrom: University of Helsinki, Finland
- Mitsutaka Hikita: Kogakuin University, Japan
- Jacqueline Hines: Applied Sensor Research and Development Corporation, USA
- Patrick Johnston: NASA Langley Research Center, USA
- Fabien J. Josse: Marquette University, USA
- Lawrence W. Kessler: Sonoscan Inc., USA
- Pierre T. Khuri-Yakub: Stanford University, USA
- Mario Kupnik: Stanford University, USA
- Jun-ichi Kushibiki: Tohoku University, Japan
- Roman Maev: University of Windsor, Canada
- Kentaro Nakamura: Tokyo Institute of Technology
- Massimo Pappalardo: University di Roma TRE, Italy
- Tony Sinclair: University of Toronto, Canada
- Bernhard Tittman: Pennsylvania State University, USA
- Jiromaru Tsujino: Kanagawa University, Japan
- John F. Vetelino: University of Maine, USA
- Paul Wilcox: University of Bristol, UK
- William Wright: University College Cork, Ireland
- Donald E. Yuhas: Industrial Measurement Systems, Inc., USA
Group 3: Physical Acoustics
Vice Chair of TPC:
Vincent Laude
Institut FEMTO-ST
France
Members:
- Manabu Aoyagi: Muroran Institute of Technology, Japan
- Art Ballato: U.S. Army, USA
- Jan Brown: JB Consulting, USA
- Fred Hickernell: Retired from Motorola, USA
- Takefumi Kanda: Okayama University, Japan
- Eun Sok Kim: U.S. Army, USA
- Yonkee Kim: U.S. Army, USA
- Minoru Kuribayashi Kurosawa: Tokoy Institute of Technology, Japan
- Amit Lal: Cornell University, USA
- John Larson: Avago Technologies, USA
- George Mansfeld: Russian Academy of Sciences, Russia
- Roy H. Olsson III: Sandia National Laboratories, USA
- Mihir Patel: Schlumberger-Doll Research, USA
- Edgar Schmidhammer: TDK-EPC, Germany
- Susan Schneider: Marquette University, USA
- Bikash Sinha: Schlumberger-Doll Research, USA
- Ji Wang: Ningbo University, China
- Tsung-Tsong Wu: National Taiwan Universityi, Taiwan R.O.C.
- Yook-Kong Yong, Ph.D.: Rutgers University, USA
- Jiun Der Yu: Epson Research and Development, USA
Group 4: Microacoustics - SAW, FBAR, MEMS
Vice Chair of TPC:
Karl Wagner
TDK-EPC
Munich, Germany
Members:
- Ben Abbott: Triquint, USA
- Robert Aigner: Triquint, USA
- Ivan Avramov: Institute of Solid State Physics, Bulgaria
- Sylvain Ballandras: FEMTO-ST, France
- Kushal Bhattacharjee: RF Micro Devices, USA
- Sunil Bhave: Cornell University, USA
- Sergey Biryukov: IFW Dresden, Germany
- Paul Bradley: Avago, USA
- Jidong Dai: RF Monolithics, USA
- Omar Elmazria: Universié de Nancy--CNRS, France
- Gernot Fattinger: Triquint, USA
- Gerhard Fischerauer: University of Bayreuth, Germany
- James Friend: Monash University, Australia
- Ken-ya Hashimoto: Chiba University, Japan
- Shitang He: IACAS, China
- Chunyun Jian: Ericsson, Canada
- Michio Kadota: Murata, Japan
- Jyrki Kaitila: Avago, Germany
- Ilia Katardjiev: Uppsala University, Sweden
- Kimmo Kokkonen: Aalto University, Finland
- Jan Kuypers: Sands 9, Inc., USA
- Ken Lakin: Consultant, USA
- Don Malocha: University of Central Florida, USA
- Natalya Naumenko: Technological University Moscow, Russia
- Hiroyuki Odagawa: Kumamoto National College of Technology, Japan
- Takeo Oita: Retired from NDK, Japan
- Tuomas Pensala: VTT, Finland
- Mauricio Pereira da Cunha: University of Maine, USA
- Maximilian Pitschi: TDK-EPC AG, Germany
- Viktor Plessky: GVR Trade SA, Switzerland
- Leonard Reindl: Albert-Ludwigs-University Freiburg, Germany
- Richard Ruby: Avago Tech, USA
- Clemens Ruppel: TDK-EPC, Germany
- Takahiro Sato: Samsung, Japan
- Marc Solal: Sawtek, USA
- Masanori Ueda, TAIYO YUDEN CO., LTD, Japan
- Robert Weigel: Friedrich-Alexander University Erlangen-Nuremberg, Germany
- Sergei Zhgoon: Moscow Power Engineering Institute, Russia
Group 5: Transducers and Transducer Materials
Vice Chair of TPC:
Paul Reynolds
Weidlinger Associates
USA
Members:
- Sandy Cochran: University of Dundee, UK
- Christopher Daft: Siemens Medical Solutions, USA
- Levent Degertekin: Georgia Institute of Technology, USA
- Charles Emery: Mirabilis Medica, USA
- John Fraser: Philips Medical Systems, USA
- Steven Freear: University of Leeds, UK
- Jean-Francois Gelly: GE Healthcare, France
- Reinhard Lerch: Friedrich-Alexander-University Erlangen-Nuremberg, Germany
- Geoff Lockwood: Queen's University, Canada
- Richard O’Leary: University of Strathclyde, UK
- Omer Oralkan: Stanford University, USA
- Yongrae Roh: Kyungpook National University, Korea
- Ahmad Safari: Rutgers University, USA
- Mark Schafer: Sonic Tech Inc., USA
- Scott Smith: GE Global Research, USA
- Stephen Smith: Duke University, USA
- Wallace Smith: Office of Naval Research, USA
- Yasuhito Takeuchi: Kagoshima University, Japan
- Jian Yuan: Boston Scientific, USA
- Qiming Zhang: Pennsylvania State University, USA
- Qifa Zhou: University of Southern California, USA
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