Organizing Committee:

 

General Chair
Andrei Shkel, University of California, Irvine, USA

 

General Vice-Chair (past General Chair)
Michiel Vellekoop, Vienna University of Technology, Austria
General Vice-Chair (future General Chair)
Sukhan Lee, Samsung Electronics
Finance Chair (Treasurer)
Chris Schober, Honeywell, Inc., Minneapolis, USA
Local Chair
Goran  Matijasevic, University of California, Irvine, USA
Tutorials Chair
Michael Kraft, Southampton University, UK
Publications Chair
Tara Hutchinson, University of California, Irvine, USA

Publicity Chair
John Vig, US Army Communications-Electronics Command, Ft. Monmouth, NJ, USA

Communications Chair and Web Editor

Cenk Acar, BEI Systron Donner Inertial Division, USA

 

Technical Program Committee (TPC) Chair
William Tang, University of California, Irvine, USA

TPC Co-Chair Europe and Africa
Bernhard Jakoby, Vienna University of Technology, Austria
TPC Co-Chair Americas
Ruby Ghosh, Michigan State University, USA
TPC Co-Chair Asia
Masayoshi Esashi, Tohoku University, Japan

TPC Members:

First	Last	Institution	Country
Cenk	Acar	BEI Technologies, Inc.	USA
Francisco J.	Arregui	Public University of Navarre	Spain
Massood	Atashbar	Western Michigan University	USA
Kris	Baert	Interuniversity Micro Electronics Center	Belgium
Istvan	Barsony	Hungarian Academy of Sciences	Hungary
Ewald	Benes	Vienna University of Technology	Austria
Karl	Böhringer	University of Washington	USA
Andre	Bossche	Delft University of Technology	The Netherlands
Giovanni	Breglio	University of Naples "Federico II"	Italy
Danick	Briand	University of Neuchatel	Switzerland
Victor M.	Bright	University of Colorado, Boulder	USA
Peter	Burke	University of California, Irvine	USA
Cleo	Cabuz	Honeywell	USA
Carles	Cane	National Microelectronics Center	Spain
Richard	Cavicchi	National Institute of Science & Technology	USA
Pei-Zen	Chang	National Taiwan University	Taiwan
Chang Wen	Chen	Florida Institute of Technology	USA
Benjamin T.	Chorpening	National Energy Technology Laboratory	USA
Kukjin	Chun	Seoul National University	Korea
Marina	Cole	University of Warwick	United Kingdom
Jose	Correia	University of Minho	Portugal
Mauricio	da Cunha	University of Maine	USA
Peter	DeBarber	Metrolaser	USA
Jeffrey	DeNatale	Rockwell Science Company	USA
Bernard	Diem	Atomic Energy Commission (CEA)	France
Amy E.	Duwel	Draper Laboratory	USA
Masayoshi	Esashi	Tohoku University	Japan
Vittorio	Ferrari	University of Brescia	Italy
Paddy	French	Delft University of Technology	The Netherlands
Gerald	Gerlach	Dresden University of Technology	Germany
Bahram	Ghodsian	XCom Wireless, Inc.	USA
Ruby	Ghosh	Michigan State University	USA
Martin	Gijs	Swiss Federal Institute of Technology Lausanne	Switzerland
Pedro	Girão	Lab Medidas Electricas	Portugal
Sheila	Grant	University of Missouri-Columbia	USA
Otto	Gregory	University of Rhode Island	USA
Anne-Marie	Gue	Laboratory for Analysis and Architecture of Systems	France
Yasar	Gurbuz	Sabanci University	Turkey
Peter	Hauptmann	University of Magdeburg	Germany
Robert	Hauser	Carinthian Tech Research	Austria
Andreas	Hierlemann	Swiss Federal Institute of Technology Zurich	Switzerland
Eiji	Higurashi	University of Tokyo	Japan
Bob	Horning	Honeywell	USA
Evagelos	Hristoforou	National Technical University of Athens	Greece
Qing-An	Huang	Southeast University	China
Stanley H.	Huang	Industrial Technology Research Institute	Taiwan
Star	Huang	National Tsing Hua University	Taiwan
Wing Cheong	Hui	Institute of Microelectronics	Singapore
Makoto	Ishida	Toyohashi Institute of Technology	Japan
Ryszard	Jachowicz	Warsaw University of Technology	Poland
Bernhard	Jakoby	Vienna University of Technology	Austria
Jesper-Bo	Jensen	Technical University of Denmark	Denmark
Hongrui	Jiang	University of Wisconsin, Madison	USA
Shoji	Kawahito	Shizuoka University	Japan
Chang-Soo	Kim	University of Missouri-Rolla	USA
Eun Sok	Kim	University of Southern California	USA
Tae Song	Kim	Korea Institute of Science and Technology	Korea
Jan	Korvink	University of Freiburg	Germany
Chee Yee	Kwok	The University of New South Wales	Australia
Dong-Weon	Lee	Chonnam National University	Korea
Reinhard	Lerch	University of Erlangen	Germany
Wen J.	Li	Chinese University of Hong Kong	China
Xinxin	Li	Shanghai Institute of Metallurgy	China
Yu-Cheng	Lin	National Cheng Kung University	Taiwan
Chang	Liu	University of Illinois, Urbana-Champaign	USA
Anita	Lloyd Spetz	University of Linkoping	Sweden
Ralf	Lucklum	University of Magdeburg	Germany
Roya	Maboudian	University of California, Berkeley	USA
Asad	Madni	BEI Technologies, Inc.	USA
Kofi	Makinwa	Delft University of Technology	The Netherlands
Franco	Maloberti	University of Texas, Dallas	USA
Andrew	Mason	Michigan State University	USA
Chris	Merveille	Inasmet	Spain
Phan Ngoc	Minh	Institute of Material Science	Vietnam
Boris	Mizaikoff	Georgia Institute of Technology	USA
Wilfried	Mokwa	RWTH Aachen University	Germany
Sung	Moon	Korea Institute of Science and Technology	Korea
Robert	Okojie	NASA-Glenn Research Center	USA
Gary	Pickrell	Virginia Polytechnic Institute of Technology	USA
Jaques	Pistre	University of Bordeaux 1	France
Konandur	Rajanna	Indian Institute of Science	India
Michael	Rapp	Forschungszentrum Karlsruhe	Germany
Paul	Regtien	University of Twente	The Netherlands
Pavel	Ripka	Czech Technical University in Prague	Czech
Patrick	Ruther	University of Freiburg	Germany
Tapani	Ryhänen	Nokia	Finland
Lina	Sarro	Delft University of Technology	The Netherlands
Kazuo	Sato	Nagoya University	Japan
Giorgio	Sberveglieri	University of Brescia	Italy
Oliver	Schatz	Robert Bosch	Germany
Petra	Schindler-Bauer	Infineon	Germany
Pietro	Siciliano	Italian National Research Council	Italy
Priptal	Singh	University of Villanova	USA
Sameer	Sonkusale	Tufts University	USA
Martin	Stutzmann	Munich University of Technology	Germany
Kanakasabapathi  (Subra)	Subramanian	General Electric	USA
Hiroaki	Suzuki	University of Tsukuba	Japan
Yu-Chong	Tai	California Institute of technology	USA
Svetlana	Tatic-Lucic	Lehigh University	USA
Francis	Tay	National University of Singapore	Singapore
Adisorn	Tuantranont	National Electronics and Computer Technology Center	Thailand
Kimberly	Turner	University of California, Santa Barbara	USA
Gerald	Urban	University of Freiburg	Germany
Chris	Van Hoof	Interuniversity Micro Electronics Center	Belgium
Michiel	Vellekoop	Vienna University of Technology	Austria
Jaco	Visser	Ford Motor Company	USA
Ulrike	Wallrabe	University of Freiburg	Germany
Yuelin	Wang	Shanghai Institute of Metallurgy	China
Denise	Wilson	University of Washington	USA
EH	Yang	Jet Propulsion Laboratory	USA
Xiongying	Ye	Tsinghua University	China
Darren	Young	Case Western Reserve University	USA