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Technical Program Committee
IUS

Group 1: Medical Ultrasonics

Vice Chair:

Georg Schmitz, Ruhr–Universitaet Bochum, Germany

Members:

  1. Olivier Basset, CREATIS, Universite Lyon I, France
  2. Ayache Bouakaz, INSERM, Universite Tours, France
  3. Lori Bridal, Univ. Pierre and Marie Curie, France
  4. Charles Cain, University of Michigan, USA
  5. Jean–Yves Chapelon, INSERM, France
  6. Greg Clement, Harvard Medical School,USA
  7. Paul Dayton, UNC Chapel Hill and NC State University, USA
  8. Jan D’hooge, Catholic University of Leuven, Belgium
  9. Emad Ebbini, University of Minnesota, USA
  10. Stanislav Emelianov, University of Texas at Austin, USA
  11. Kathy Ferrara, University of California Davis, USA
  12. Stuart Foster, University of Toronto, Canada
  13. Steven Freear, University of Leeds, UK
  14. Caterina Gallippi, UNC Chapel Hill and NC State University, USA
  15. James Greenleaf, Mayo Clinic College of Medicine, USA
  16. Anne Hall, General Electric Medical Systems, USA
  17. Christopher Hall, Philips Research North America, USA
  18. Peter Hoskins, The University of Edinburgh, UK
  19. John Hossack, University of Virginia, USA
  20. Kullervo Hynynen, University of Toronto, Canada
  21. Jorgen Jensen, Technical University of Denmark, Denmark
  22. Nico de Jong, Erasmus Medical Centre and University of Twente, Netherlands
  23. Hiroshi Kanai, Tohoku University, Japan
  24. Jeff Ketterling, Riverside Research Institute, USA
  25. Michael Kolios, Ryerson University, Canada
  26. Elisa Konofagou, Columbia University, USA
  27. Chris de Korte, Catholic Univ. of Nijmegen, Netherlands
  28. Nobuki Kudo, Hokkaido University, Japan
  29. Pai–Chi Li, National Taiwan University, Taipei, Taiwan
  30. JianYndash;Yu Lu, University of Toledo, USA
  31. Tom Matula, University of Washington, USA
  32. James G. Miller, Washington University in Saint Louis, USA
  33. Kathy Nightingale, Duke University, USA
  34. Svetoslav Nikolov, BK Medical, Denmark
  35. William O'Brien, University of Illinois, Urbana–Champaign, USA
  36. Michael Oelze, University of Illinois, Urbana–Champaign, USA
  37. Ralf Seip, Philips Research North America, USA
  38. Mickael Tanter, INSERM, France
  39. Tom Thomas, Boston Scientific, Inc., USA
  40. Kai Thomenius, General Electric's Corporate R&D, USA
  41. Hans Torp, Norwegian University of Science and Technology, Norway
  42. Piero Tortoli, Universita degli Studi di Firenze, Italy
  43. Ton van der Steen, Erasmus Medical Centre, Rotterdam, Netherlands
  44. Kendall Waters, Silicon Valley Medical Instruments,USA
  45. Keith Wear, US Food and Drug Administration, USA
  46. Wilko Wilkening, Siemens Medical Solution, USA
  47. Hairong Zheng, Zhenzhen Institutes of Advanced Technology, China

Group 2: Sensors, NDE, and Industrial Application

Vice Chair:

Jafar Saniie, Illinois Institute of Technology, Chicago, Illinois, USA

Members:

  1. Robert C. Addison, Rockwell Science Center, USA
  2. Walter Arnold, Fraunhofer Institute for NDT, Germany
  3. Michal Bezdek, Endress+Hauser Flowtec AG, Switzerland
  4. James Blackshire, Air Force Research Laboratory
  5. Ramazan Demirli, Villanova University, USA
  6. James Friend, Monash University, Australia
  7. Eric S. Furgason, Purdue University, USA
  8. David Greve, Carnegie Mellon University, USA
  9. Edward Haeggstrom, University of Helsinki, Finland
  10. Jacqueline Hines, Applied Sensor R&D Corporation, USA
  11. Patrick Johnston, NASA Langley Research Center, USA
  12. Fabien J. Josse, Marquette University, USA
  13. Lawrence W. Kessler, Sonoscan Inc., USA
  14. Pierre T. Khuri–Yakub, Stanford University, USA
  15. Mario Kupnik, Brandenburg University of Technology, Germany
  16. Roman Maev, University of Windsor, Canada
  17. Kentaro Nakamura, Tokyo Institute of Technology
  18. Erdal Oruklu, Illinois Institute of Technology, USA
  19. Massimo Pappalardo, University di Roma TRE, Italy
  20. Bernhard Tittman, Pennsylvania State University, USA
  21. Jiromaru Tsujino, Kanagawa University, Japan
  22. John F. Vetelino, University of Maine, USA
  23. Paul Wilcox, University of Bristol, UK
  24. William Wright, University College Cork, Ireland
  25. Donald E. Yuhas, Industrial Measurement Systems, USA

Group 3: Physical Acoustics

Vice Chair:

Vincent Laude, Centre National de la Recherche Scientifique, France

Members:

  1. Manabu Aoyagi, Muroran Institute of Technology, Japan
  2. Art Ballato, Clemson University, Clemson SC, USA
  3. Jan Brown, JB Consulting, USA
  4. Emmanuel Defay, CEA LETI, Minatec Campus, France
  5. Christine Demore, University of Dundee, UK
  6. Jianke Du, Ningbo University, China
  7. Tao Han, Shanghai Jiaotong University, China
  8. Fred Hickernell, Retired from Motorola, USA
  9. Takefumi Kanda, Okayama University, Japan
  10. Eun Sok Kim, University of Southern California, USA
  11. Minoru Kuribayashi Kurosawa, Tokoy Institute of Technology, Japan
  12. Amit Lal, Cornell University, USA
  13. John Larson, Avago Technologies, USA
  14. Andreas Mayer, Hochschule Offenburg, Germany
  15. Roy H. Olsson III, Sandia National Laboratories, USA
  16. Mihir Patel, Schlumberger–Doll Research, USA
  17. Yan Pennec, Universite de Lille 1, France
  18. Susan Schneider, Marquette University, USA
  19. Bikash Sinha, Schlumberger–Doll Research, USA
  20. Koen W.A. van Dongen, Delft University of Technology, Netherlands
  21. Joerg Wallaschek, Leibniz Universitaet Hannover, Germany
  22. Ji Wang, Ningbo University, China
  23. Tsung–Tsong Wu, National Taiwan University, Taiwan R.O.C.
  24. Yook–Kong Yong, Rutgers University, USA
  25. Jiun Der Yu, Epson Research and Development Inc., USA
  26. Sergei Zherlitsyn, Helmholtz–Zentrum Dresden–Rossendorf, Germany

Group 4: Sensors & Transducers

Vice Chair:

Karl Wagner, TDK Corporation, Germany

Members:

  1. Ben Abbott, Triquint Semiconductor, USA
  2. Robert Aigner, Triquint Semiconductor, USA
  3. Ivan Avramov, Institute of Solid State Physics, Bulgaria
  4. Sylvain Ballandras, FEMTO–ST—CNRS, France
  5. Kushal Bhattacharjee, RF Micro Devices, USA
  6. Sunil Bhave, Cornell University, USA
  7. Sergey Biryukov, IFW Dresden, Germany
  8. Paul Bradley, Avago Technologies, USA
  9. Jidong Dai, RF Monolithics, USA
  10. Omar Elmazria, Universite de Nancy—CNRS, France
  11. Gernot Fattinger, Triquint Semiconductor, USA
  12. Gerhard Fischerauer, University of Bayreuth, Germany
  13. James Friend, RMIT University, Australia
  14. Ken–ya Hashimoto, Chiba University, Japan
  15. Shitang He, IACAS, China
  16. Chunyun Jian, Ericsson, Canada
  17. Michio Kadota, Tohoku University, Japan
  18. Jyrki Kaitila, Avago Technologies, Germany
  19. Ilia Katardjiev, Uppsala University, Sweden
  20. Takaharu Kawakatsu, Murata Manufacturing, Japan
  21. Kimmo Kokkonen, Aalto University, Finland
  22. Jan Kuypers, Sand 9, Inc., USA
  23. Don Malocha, University of Central Florida, USA
  24. Natalya Naumenko, Technological University Moscow, Russia
  25. Hiroyuki Odagawa, Kumamoto National College of Technology, Japan
  26. Takeo Oita, University of Tokyo, Japan
  27. Tuomas Pensala, VTT, Finland
  28. Mauricio Pereira da Cunha, University of Maine, USA
  29. Maximilian Pitschi, TDK Corporation, Germany
  30. Leonard Reindl, Albert–Ludwigs–University Freiburg, Germany
  31. Richard Ruby, Avago Technologies, USA
  32. Clemens Ruppel, TDK Corporation, Germany
  33. Takahiro Sato, Samsung, Japan
  34. Marc Solal, Triquint Semiconductor, USA
  35. Florian Thalmayr, Sand 9, Inc., USA
  36. Masanori Ueda, Taiyo Yuden, Japan
  37. Robert Weigel, Friedrich–Alexander University Erlangen–Nuernberg, Germany
  38. Sergei Zhgoon, Moscow Power Engineering Institute, Russia

Group 5: Transducers & Transducer Materials

Vice Chair:

Paul Reynolds, Transformatix Technologies Inc, USA

Members:

  1. Scott Smith, GE Global Research, USA
  2. Sandy Cochran, University of Dundee, UK
  3. Christopher, Daft Cephasonics Inc, USA
  4. Levent Degertekin, Georgia Institute of Technology, USA
  5. Charles Emery, Mirabilis Medical, USA
  6. John Fraser, John Fraser Consulting, USA
  7. Jean– Francois Gelly,GE Healthcare, France
  8. Reinhard Lerch, Friedrich–Alexander–Universitaet Erlangen–Nuremberg, Germany
  9. Geoff Lockwood, Queen's University, Canada
  10. Omer Oralkan, North Carolina State University, USA
  11. Paul Reynolds, Paul Reynolds Consulting, USA
  12. Yongrae Roh, Kyungpook National University, Korea
  13. Ahmad Safari, Rutgers University, USA
  14. Mark Schafer, Sonic Tech Inc., USA
  15. Stephen Smith, Duke University, USA
  16. Wallace Smith, Office of Naval Research, USA
  17. Yasuhito Takeuchi, Kagoshima University, Japan
  18. Jian Yuan, Philips Shanghai Apex, USA
  19. Qiming Zhang, Pennsylvania State University, USA
  20. Qifa Zhou, University of Southern California, USA
  21. Steven Freear, University of Leeds, UK
  22. Richard O'Leary, University of Strathclyde, UK
  23. Sorah Rhee, Ethicon Endo–Surgery, USA
  24. Loriann Davidsen, Philips Healthcare, USA
  25. Wei Ren, Xi’an Jiaotong University, China
  26. Jean–Francois, Saillant, Areva, France