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BayAreaTech

PCB WEST, the Silicon Valley’s largest event for the PCB supply chain, brings together engineers, designers, fabricators, assemblers and managers to take advantage of unique opportunities to improve skills, increase knowledge and network with peers, colleagues and experts. 

75+ presentations on the hottest topics, including:

* 3D via modeling
* Fine pitch BGA design
* Flex design & parts placement
* Manufacturing IoT PCBs
* Noise control
* Package design
* PCB assembly troubleshooting
* PLUS 100+ exhibitors on the show floor!

Register today to attend PCB WEST, https://goo.gl/6f3nnL, at the Santa Clara Convention Center, featuring a three-day conference 9/12 -14 (https://goo.gl/Suu3eT) and a FREE one-day exhibition 9/13 (https://goo.gl/EHAPBu).  Register for the conference by August 14 to receive a $100 discount.

51st Annual Asilomar Conference on Signals, Systems, and Computers at the Asilomar Hotel and Conference Grounds, Pacific Grove, on October 29 – November 1, 2017

Authors are invited to submit papers on or before May 1st, 2017, in the following areas:
* Communications Systems 
* MIMO Communications and Signal Processing 
* Array Signal Processing 
* Biomedical Signal and Image Processing
* Speech, Image and Video Processing 
* Architecture and Implementation 
* Networks; Signal Processing and Adaptive Systems 
For detailed information see Call for Papers

The 18th International Symposium on Quality Electronic Design ISQED 2017 is the premier interdisciplinary and multidisciplinary Electronic Design conference—bridges the gap among Electronic/Semiconductor ecosystem members providing electronic design tools, integrated circuit technologies, semiconductor technology, packaging, assembly & test to achieve total design quality.

With a theme of Security, IoT and Cyber-Physical systems, the conference will feature nearly 100 papers highlighting the latest trends in electronic circuit and system design & automation, test, verification, and semiconductor technologies

ISQED is being held in Santa Clara on March 15 – 17, 2017.  isqed.org

Tuesday, February 14th, 2017 
SCV Consultants Network of Silicon Valley (CNSV) 
Subject: The Technical Impossibilities of Autonomous Driving 
– engineering overview of autonomous driving, and will describe its greatest technical challenges, companies in this field, skill areas that these companies are searching for … 
Speaker: Dr. Mark J. Nitzberg of Caruma Technologies, Inc.
Time: 7:00 pm: Registration, networking, pizza and drinks; 7:30 pm to 9:00 pm: Presentation 
Cost: Free 
Location: NVIDIA, 2800 Scott Blvd., Building E, Santa Clara 
Event Details: https://californiaconsultants.org/event/the-technical-impossibilities-of-autonomous-driving/ 

Advanced Engineering Courses 2017 at UC Santa Cruz
Courses are organized by MEAD Microelectronics and held at UC Santa Cruz from March 27-31, 2017 
* Advanced Analog and Mixed-Signal Design 
Noise coupling, ESD &EMC, sensor interfaces, circuit design
* Continuous-Time Delta-Sigma Design 
Basics, modulators, dynamic element matching, VCO-based circuit nonlinearities
* Power Management
Converters, regulators, energy harvesting

Deadline for registration: February 20, 2017 
http://mead.ch/MEADNEW/advanced-engineering-courses-uc-santa-cruz-california/

The International Solid- State Circuits Conference (ISSCC) 2017 is held February 5-9 in San Francisco. ISSCC is the foremost global forum for presentation of advances in solid-state circuits and systems-on-a-chip, with papers, tutorials and sessions on:

* Deep Learning Processors * Frequency Generated Voltage Regulators 
* Wireless and Wireline Systems * SoC and Emerging IoT Systems 
* Sensors * Gigahertz Data Converters * Power Amplifiers 
* Memory * Transmittors * Analog Techniques 
* Intelligent Machines: Will the Technology Singularity Happen? 
* High-Speed DNA Sequencing: Jurassic Park, Neanderthal, Moore, and You

INTELLIGENT CHIPS FOR A SMART WORLD * ISSCC.ORG

2017 Advance Registration open through January 15, 2017. Early rates available through January 8, 2017

Thursday, December 1, 2016 
SCV-SF Electron Device Society (EDS) 
Subject: On-Chip ESD Protection Design: Yesterday, Today, Tomorrow and Future
– ESD protection, killing factor to the time to market of new IC products, ESD protection basics and traditional ESD protection solutions, new CAD tool for full-chip ESD protection circuit design verification… 
Speaker: Prof. Albert Wang, Dept. of Electrical and Computer Engineering, University of California, Riverside 
Time: 6:00 pm: Registration, networking, and refreshments; 6:15 pm to 7:00 pm: Presentation
Cost: Free 
Location: Texas Instruments, 2900 Semiconductor Way, Bldg. E Auditorium, Santa Clara 
Event Details: http://sites.ieee.org/scv-eds/ 

Friday, November 11, 2016 
SCV-SF Electron Devices Society (EDS) and Components, Packaging, and Manufacturing Technologies (CPMT) Annual Symposium 
Subject: Device Circuit Interaction in Advanced Technology Nodes 
– device, circuit and system/architecture level interactions and co-optimizations in advanced technology nodes… 
Speakers: Dr. William J. Dally, Chief Scientist and Sr. VP of Research, NVIDIA, and Stanford Professor; Dr. Victor Moroz, Scientist, Synopsys; Dr. John Hu, Director, Advanced Technology, Nvidia Corporation; Dr. Kevin Scoones, Fellow, Texas Instruments; Dr. Suresh Ramalingam, Fellow, Advanced Packaging, Xilinx
Time: 1:00 pm to 5:30 pm,
Cost: Student IEEE Member: $15; Student non-IEEE Member: $20; IEEE Member: $40; Non-IEEE Member: $60 
Location: Texas Instruments, 2900 Semiconductor Way, Bdg. E Auditorium, Santa Clara

Event Details: http://sites.ieee.org/scv-eds/ 

IEEE Symposium on Product Compliance Engineering, Holiday Inn San Jose on May 8-10, 2017, with papers due no later than December 1, 2016

The IEEE Product Safety Engineering Society seeks original and unpublished formal papers, presentations (without formal papers), workshops, and tutorials on all aspects of product safety and compliance engineering including, but not limited to:

* Global Market Access & Regulations * Hazard Based Safety Engineering & Safety Science * Compliance * Forensics, Failure & Risk Analysis, Assessment & Management * Management * Legal, Regulations, Directives & Consumer Protection * EMC & Wireless Compliance * Emerging Technologies & Innovations * Environmental & Energy Regulations * Batteries & Energy Storage Systems * Medical Devices * Compliance 101 

Thursday, October 20, 2016 
SCV Solid State Circuits Society (SSCS)
Subject: Demystifying Linear Time Varying Circuits 
– An analog/mixed-signal designer encounters time varying circuits everywhere – sample-and-holds, chopper stabilized amplifiers, mixers, switched-capacitor amplifiers and filters, discrete and continuous-time delta sigma modulators, N-path filters … 
Speaker: Shanthi Pavan, Professor, Indian Institute of Technology-Madras 
Time: 6:00 pm: Networking and refreshements, 6:30 pm to 8:00 pm: Presentation and Q&A
Cost: Free 
Location: Maxim Integrated, Inc., Jack Gifford Event Center, Building A, 160 Rio Robles, San Jose 
Event Details: https://www.eventbrite.com/e/distinguished-lecturer-seminar-demystifying-linear-time-varying-circuits-by-shanthi-pavan-iit-madras-tickets-28335803150 

on Nov. 9-11, 2016, San Francisco

The third International Conference on 3D System Integration (3D-IC) will be held in San Francisco in November, 2016. 3D-IC covers all the topics in 3DIC, including 3D process technology, materials, equipment, circuits technology, design methodology and applications. The conference invites authors and participants to submit and interact with 3D research from all around the world. This is the third conference in the series. The first two were held in Japan, the fourth will be held in Europe.

Highlights of the Conference Include the Following:
* Hear the latest in 3D process technology, design, applications and CAD during the main technical sessions.
* Special sessions will focus on (1) dielet processing and applications, and (2) Advances in Through Silicon Vias 
* On Friday afternoon, attend a tutorial on 3DIC technology design and CAD.
* Hear keynotes on Exascale computing and other topics.
Advanced registration can be found at 3dic-conf.org. Advanced registration closes October 15. The hotel room block closes October 10.

Are you interested in learning about communications in jungles, or low cost aerial vehicle for crop analysis in emerging countries? Join us in Seattle, Washington on October 13-16, at the 6th IEEE Global Humanitarian Technology Conference (GHTC) and hear the presentations, view the posters, listen to panels and plenaries, speak with exhibitors and discuss how technology can:

* Enable healthcare delivery and provide power and communications in developing countries
* Provide clean water, provide sanitation and improve crop yields
* Improve the timeliness and effectiveness of disaster response
* Assist with training and build capacity needed to improve the standard of living

This year’s conference is dedicated to “Advancing Technology for Humanity”, focusing on key areas including energy, health, disaster management, connectivity, agriculture, and education. Register now at http://ieeeghtc.org/registration/.

The focus of SMC 2016 is on emerging materials and packaging technology trends across the entire microelectronics supply chain and provide an insider’s outlook for the future. High-profile keynotes and industry leaders will deliver insights on the business drivers behind innovations in device manufacturing and scaling. Learn about:

* Disruptive Trends and Opportunities for New Materials
* Contamination and Metrology Challenges
* Advanced Packaging
* Future of Moore’s Law and Encounters of a 3D Kind
* Strategic Materials Challenges from the Fab Perspective
* Economic & Market Trends

SMC 2016, coming September 20-21, at the Computer History Museum in Mountain View

http://www.semi.org/en/node/41386/?=ieee

Thursday, November 3, 2016
SCV Reliability Chapter, Electron Device Society (EDS), and Components, Packaging, and Manufacturing Technologies (CPMT) 
Subject: CPI Stress Induced Carrier Mobility Shift in Advanced Silicon Nodes
– mechanical stress and the consequent effects on device performance for advanced three-dimensional (3-D) IC technologies …
Speaker: Valeriy Sukharev, Technical Lead, Design to Silicon Division (Calibre) of Mentor Graphics Corporation
Time: 6:00 to 6:30 pm: Sign in, snacks and social; 6:30 to 7:30 pm: Presentation; 7:30 to 8:00 pm: Question and Answer Session
Cost: Free
Location: Qualcomm, Inc., 3165 Kifer Road, Santa Clara, in the cafeteria
Event Details: http://ewh.ieee.org/r6/scv/rl/
Please register so as to know how much food to purchase: https://www.eventbrite.com/e/cpi-stress-induced-carrier-mobility-shift-in-advanced-silicon-nodes-tickets-27427049042
Food sponsored by I.C.E. Labs, ISO 9001 & 17025 Reliability Test Lab, www.icenginc.com