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Technology & Networking in Silicon Valley & the SF Bay Area: Upcoming Meetings, Courses and Conferences

April 3, 2017

Asilomar Conference on Signals, Systems, and Computers

by @ 7:32 pm. Filed under ALL, Computers/Software, Electronics Design, Semiconductors
 
 

CALL FOR PAPERS

51st Annual Asilomar Conference on Signals, Systems, and Computers at the Asilomar Hotel and Conference Grounds, Pacific Grove, on October 29 – November 1, 2017

Authors are invited to submit papers on or before May 1st, 2017, in the following areas:
Asilomar* Communications Systems 
* MIMO Communications and Signal Processing 
* Array Signal Processing 
* Biomedical Signal and Image Processing
* Speech, Image and Video Processing 
* Architecture and Implementation 
* Networks; Signal Processing and Adaptive Systems 
For detailed information see Call for Papers

 

20170501ALL

December 30, 2016

18th International Symposium on Quality Electronic Design ISQED 2017

by @ 11:00 pm. Filed under ALL, Computers/Software, Electronics Design, Semiconductors
 

ISQED2017

The 18th International Symposium on Quality Electronic Design ISQED 2017 is the premier interdisciplinary and multidisciplinary Electronic Design conference—bridges the gap among Electronic/Semiconductor ecosystem members providing electronic design tools, integrated circuit technologies, semiconductor technology, packaging, assembly & test to achieve total design quality.

With a theme of Security, IoT and Cyber-Physical systems, the conference will feature nearly 100 papers highlighting the latest trends in electronic circuit and system design & automation, test, verification, and semiconductor technologies

ISQED is being held in Santa Clara on March 15 – 17, 2017.  isqed.org

 

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December 21, 2016

The Technical Impossibilities of Autonomous Driving

by @ 2:14 pm. Filed under ALL, Computers/Software, Consumer Electronics, Electronics Design, Robotics and Automation
 

Tuesday, February 14th, 2017 
SCV Consultants Network of Silicon Valley (CNSV) 
Subject: The Technical Impossibilities of Autonomous Driving 
– engineering overview of autonomous driving, and will describe its greatest technical challenges, companies in this field, skill areas that these companies are searching for … 
Speaker: Dr. Mark J. Nitzberg of Caruma Technologies, Inc.
Time: 7:00 pm: Registration, networking, pizza and drinks; 7:30 pm to 9:00 pm: Presentation 
Cost: Free 
Location: NVIDIA, 2800 Scott Blvd., Building E, Santa Clara 
Event Details: https://californiaconsultants.org/event/the-technical-impossibilities-of-autonomous-driving/ 

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December 7, 2016

Advanced Engineering Courses 2017 at UC Santa Cruz

by @ 3:36 pm. Filed under ALL, Electrical/Power, Electronics Design, Semiconductors
 
ADVANCE YOUR CAREER WITH ADDITIONAL EDUCATION

Advanced Engineering Courses 2017 at UC Santa Cruz
Courses are organized by MEAD Microelectronics and held at UC Santa Cruz from March 27-31, 2017 
MEAD* Advanced Analog and Mixed-Signal Design 
Noise coupling, ESD &EMC, sensor interfaces, circuit design
* Continuous-Time Delta-Sigma Design 
Basics, modulators, dynamic element matching, VCO-based circuit nonlinearities
* Power Management
Converters, regulators, energy harvesting

Deadline for registration: February 20, 2017 
http://mead.ch/MEADNEW/advanced-engineering-courses-uc-santa-cruz-california/

 

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November 29, 2016

International Solid State Circuits Society (ISSCC) 2017 

by @ 1:58 pm. Filed under ALL, BioEngineering, Electronics Design, Semiconductors
 

The International Solid- State Circuits Conference (ISSCC) 2017 is held February 5-9 in San Francisco. ISSCC is the foremost global forum for presentation of advances in solid-state circuits and systems-on-a-chip, with papers, tutorials and sessions on:
ISSCC2017

* Deep Learning Processors * Frequency Generated Voltage Regulators 
* Wireless and Wireline Systems * SoC and Emerging IoT Systems 
* Sensors * Gigahertz Data Converters * Power Amplifiers 
* Memory * Transmittors * Analog Techniques 
* Intelligent Machines: Will the Technology Singularity Happen? 
* High-Speed DNA Sequencing: Jurassic Park, Neanderthal, Moore, and You

INTELLIGENT CHIPS FOR A SMART WORLD * ISSCC.ORG

2017 Advance Registration open through January 15, 2017. Early rates available through January 8, 2017

 

 

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November 14, 2016

On-Chip ESD Protection Design: Yesterday, Today, Tomorrow and Future

by @ 1:23 pm. Filed under ALL, Computers/Software, Electronics Design, Reliability, Semiconductors
 

Thursday, December 1, 2016 
SCV-SF Electron Device Society (EDS) 
Subject: On-Chip ESD Protection Design: Yesterday, Today, Tomorrow and Future
– ESD protection, killing factor to the time to market of new IC products, ESD protection basics and traditional ESD protection solutions, new CAD tool for full-chip ESD protection circuit design verification… 
Speaker: Prof. Albert Wang, Dept. of Electrical and Computer Engineering, University of California, Riverside 
Time: 6:00 pm: Registration, networking, and refreshments; 6:15 pm to 7:00 pm: Presentation
Cost: Free 
Location: Texas Instruments, 2900 Semiconductor Way, Bldg. E Auditorium, Santa Clara 
Event Details: http://sites.ieee.org/scv-eds/ 

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October 21, 2016

Annual Symposium; Device Circuit Interaction in Advanced Technology Nodes 

by @ 9:21 pm. Filed under ALL, Electrical/Power, Electronics Design
 

Friday, November 11, 2016 
SCV-SF Electron Devices Society (EDS) and Components, Packaging, and Manufacturing Technologies (CPMT) Annual Symposium 
Subject: Device Circuit Interaction in Advanced Technology Nodes 
– device, circuit and system/architecture level interactions and co-optimizations in advanced technology nodes… 
Speakers: Dr. William J. Dally, Chief Scientist and Sr. VP of Research, NVIDIA, and Stanford Professor; Dr. Victor Moroz, Scientist, Synopsys; Dr. John Hu, Director, Advanced Technology, Nvidia Corporation; Dr. Kevin Scoones, Fellow, Texas Instruments; Dr. Suresh Ramalingam, Fellow, Advanced Packaging, Xilinx
Time: 1:00 pm to 5:30 pm,
Cost: Student IEEE Member: $15; Student non-IEEE Member: $20; IEEE Member: $40; Non-IEEE Member: $60 
Location: Texas Instruments, 2900 Semiconductor Way, Bdg. E Auditorium, Santa Clara

Event Details: http://sites.ieee.org/scv-eds/ 

20161111ALL

October 11, 2016

ISPCE 2017 – IEEE Symposium on Product Compliance Engineering CALL FOR PAPERS

by @ 3:07 pm. Filed under ALL, Consumer Electronics, Electronics Design, Product Safety
 
CALL FOR PAPERS

ISPCE 2017

IEEE Symposium on Product Compliance Engineering, Holiday Inn San Jose on May 8-10, 2017, with papers due no later than December 1, 2016

The IEEE Product Safety Engineering Society seeks original and unpublished formal papers, presentations (without formal papers), workshops, and tutorials on all aspects of product safety and compliance engineering including, but not limited to:

* Global Market Access & Regulations * Hazard Based Safety Engineering & Safety Science * Compliance * Forensics, Failure & Risk Analysis, Assessment & Management * Management * Legal, Regulations, Directives & Consumer Protection * EMC & Wireless Compliance * Emerging Technologies & Innovations * Environmental & Energy Regulations * Batteries & Energy Storage Systems * Medical Devices * Compliance 101 

2017.psessymposium.org/
ispce2017

 

20161201ALL

Demystifying Linear Time Varying Circuits 

by @ 1:59 pm. Filed under ALL, Electronics Design, Semiconductors, Signal Processing
 

Thursday, October 20, 2016 
SCV Solid State Circuits Society (SSCS)
Subject: Demystifying Linear Time Varying Circuits 
– An analog/mixed-signal designer encounters time varying circuits everywhere – sample-and-holds, chopper stabilized amplifiers, mixers, switched-capacitor amplifiers and filters, discrete and continuous-time delta sigma modulators, N-path filters … 
Speaker: Shanthi Pavan, Professor, Indian Institute of Technology-Madras 
Time: 6:00 pm: Networking and refreshements, 6:30 pm to 8:00 pm: Presentation and Q&A
Cost: Free 
Location: Maxim Integrated, Inc., Jack Gifford Event Center, Building A, 160 Rio Robles, San Jose 
Event Details: https://www.eventbrite.com/e/distinguished-lecturer-seminar-demystifying-linear-time-varying-circuits-by-shanthi-pavan-iit-madras-tickets-28335803150 

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October 7, 2016

IEEE International 3D System Integration (3DIC) Conference 2016

by @ 3:13 pm. Filed under ALL, Computers/Software, Consumer Electronics, Electronics Design, Semiconductors
 
EEE International 3D System Integration (3DIC) Conference 2016

3DICon Nov. 9-11, 2016, San Francisco

The third International Conference on 3D System Integration (3D-IC) will be held in San Francisco in November, 2016. 3D-IC covers all the topics in 3DIC, including 3D process technology, materials, equipment, circuits technology, design methodology and applications. The conference invites authors and participants to submit and interact with 3D research from all around the world. This is the third conference in the series. The first two were held in Japan, the fourth will be held in Europe.

Highlights of the Conference Include the Following:
* Hear the latest in 3D process technology, design, applications and CAD during the main technical sessions.
* Special sessions will focus on (1) dielet processing and applications, and (2) Advances in Through Silicon Vias 
* On Friday afternoon, attend a tutorial on 3DIC technology design and CAD.
* Hear keynotes on Exascale computing and other topics.
Advanced registration can be found at 3dic-conf.org. Advanced registration closes October 15. The hotel room block closes October 10.

 

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September 16, 2016

Global Humanitarian Technology Conference (GHTC)

by @ 6:16 pm. Filed under ALL, BioEngineering, Communications, Consumer Electronics, Electrical/Power, Electronics Design, Green energy
 
BENEFITING HUMANITY THROUGH INNOVATION

GHTCAre you interested in learning about communications in jungles, or low cost aerial vehicle for crop analysis in emerging countries? Join us in Seattle, Washington on October 13-16, at the 6th IEEE Global Humanitarian Technology Conference (GHTC) and hear the presentations, view the posters, listen to panels and plenaries, speak with exhibitors and discuss how technology can:

* Enable healthcare delivery and provide power and communications in developing countries
* Provide clean water, provide sanitation and improve crop yields
* Improve the timeliness and effectiveness of disaster response
* Assist with training and build capacity needed to improve the standard of living

This year’s conference is dedicated to “Advancing Technology for Humanity”, focusing on key areas including energy, health, disaster management, connectivity, agriculture, and education. Register now at http://ieeeghtc.org/registration/.

 

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September 6, 2016

Strategic Materials Conference (SMC) 2016

by @ 5:19 pm. Filed under ALL, Consumer Electronics, Electronics Design, Reliability, Semiconductors
 
Scaling Challenges: The Future of Materials and Packaging
for the semiconductor and adjacent industries
Strategic Materials Conference (SMC) 2016

SMC16The focus of SMC 2016 is on emerging materials and packaging technology trends across the entire microelectronics supply chain and provide an insider’s outlook for the future. High-profile keynotes and industry leaders will deliver insights on the business drivers behind innovations in device manufacturing and scaling. Learn about:

* Disruptive Trends and Opportunities for New Materials
* Contamination and Metrology Challenges
* Advanced Packaging
* Future of Moore’s Law and Encounters of a 3D Kind
* Strategic Materials Challenges from the Fab Perspective
* Economic & Market Trends

SMC 2016, coming September 20-21, at the Computer History Museum in Mountain View

http://www.semi.org/en/node/41386/?=ieee

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August 30, 2016

CPI Stress Induced Carrier Mobility Shift in Advanced Silicon Nodes

by @ 10:26 pm. Filed under ALL, Electronics Design, Reliability, Semiconductors
 

Thursday, November 3, 2016
SCV Reliability Chapter, Electron Device Society (EDS), and Components, Packaging, and Manufacturing Technologies (CPMT) 
Subject: CPI Stress Induced Carrier Mobility Shift in Advanced Silicon Nodes
– mechanical stress and the consequent effects on device performance for advanced three-dimensional (3-D) IC technologies …
Speaker: Valeriy Sukharev, Technical Lead, Design to Silicon Division (Calibre) of Mentor Graphics Corporation
Time: 6:00 to 6:30 pm: Sign in, snacks and social; 6:30 to 7:30 pm: Presentation; 7:30 to 8:00 pm: Question and Answer Session
Cost: Free
Location: Qualcomm, Inc., 3165 Kifer Road, Santa Clara, in the cafeteria
Event Details: http://ewh.ieee.org/r6/scv/rl/
Please register so as to know how much food to purchase: https://www.eventbrite.com/e/cpi-stress-induced-carrier-mobility-shift-in-advanced-silicon-nodes-tickets-27427049042
Food sponsored by I.C.E. Labs, ISO 9001 & 17025 Reliability Test Lab, www.icenginc.com

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Reliability and The Self-Driving Car

by @ 10:15 pm. Filed under ALL, Electronics Design, Reliability
 

Thursday, October 6, 2016
SCV Reliability Chapter
Subject: Reliability and The Self-Driving Car
– 94% of traffic accidents involve human error, developing a self-driving vehicle from the ground up, and employing the best design for reliability and reliability test practices…
Speaker: Noah Lassar, Senior Manager of Reliability for the Google[X] Self-Driving Car
Time: 6:00 to 6:30 pm: Sign in, snacks and social; 6:30 to 7:30 pm: Presentation; 7:30 to 8:00 pm: Question and Answer Session
Cost: Free
Location: Qualcomm, Inc., 3165 Kifer Road, Santa Clara, in the cafeteria
Event Details: http://ewh.ieee.org/r6/scv/rl/
Please register so as to know how much food to purchase: https://www.eventbrite.com/e/reliability-and-the-self-driving-car-tickets-27426937709
Food sponsored by I.C.E. Labs, ISO 9001 & 17025 Reliability Test Lab, www.icenginc.com

20161006ALL

August 18, 2016

A Statistical FEA Method for Predicting Glass Fracture in Consumer Electronic Products

by @ 10:19 pm. Filed under ALL, Consumer Electronics, Electronics Design, Reliability
 

Thursday, August 25, 2016
SCV Signal Processing Society (SPS)
Subject: A Statistical FEA Method for Predicting Glass Fracture in Consumer Electronic Products
– probability of fracture for glass components during drop impact, size and rate effects on glass strength, the temporal and spatial nature of the stress results, and the combining of drop orientations to produce a probability of failure …
Speaker: Marc Zampino, Senior Design Analysis Engineer, Amazon/Lab126
Time: 6:00 pm: Registration, networking, and refreshments; 6:30 pm to 7:30 pm: Presentation; 7:30 to 8:00 pm: Question and answer session
Cost: Free, Donations accepted for food
Location: Qualcomm Inc., in the Cafeteria, 3165 Kifer Rd, Santa Clara
Event Details: http://ewh.ieee.org/r6/scv/rl/
RSVP to know how much food to purchase: https://www.eventbrite.com/e/a-statistical-fea-method-for-predicting-glass-fracture-in-consumer-electronic-products-tickets-27186020118
Food sponsored by I.C.E. Labs, ISO 9001 & 17025 Reliability Test Lab, http://www.icenginc.com

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