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Technology & Networking in Silicon Valley & the SF Bay Area: Upcoming Meetings, Courses and Conferences

October 7, 2016

IEEE International 3D System Integration (3DIC) Conference 2016

by @ 3:13 pm. Filed under ALL, Computers/Software, Consumer Electronics, Electronics Design, Semiconductors
 
EEE International 3D System Integration (3DIC) Conference 2016

3DICon Nov. 9-11, 2016, San Francisco

The third International Conference on 3D System Integration (3D-IC) will be held in San Francisco in November, 2016. 3D-IC covers all the topics in 3DIC, including 3D process technology, materials, equipment, circuits technology, design methodology and applications. The conference invites authors and participants to submit and interact with 3D research from all around the world. This is the third conference in the series. The first two were held in Japan, the fourth will be held in Europe.

Highlights of the Conference Include the Following:
* Hear the latest in 3D process technology, design, applications and CAD during the main technical sessions.
* Special sessions will focus on (1) dielet processing and applications, and (2) Advances in Through Silicon Vias 
* On Friday afternoon, attend a tutorial on 3DIC technology design and CAD.
* Hear keynotes on Exascale computing and other topics.
Advanced registration can be found at 3dic-conf.org. Advanced registration closes October 15. The hotel room block closes October 10.

 

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September 16, 2016

Global Humanitarian Technology Conference (GHTC)

by @ 6:16 pm. Filed under ALL, BioEngineering, Communications, Consumer Electronics, Electrical/Power, Electronics Design, Green energy
 
BENEFITING HUMANITY THROUGH INNOVATION

GHTCAre you interested in learning about communications in jungles, or low cost aerial vehicle for crop analysis in emerging countries? Join us in Seattle, Washington on October 13-16, at the 6th IEEE Global Humanitarian Technology Conference (GHTC) and hear the presentations, view the posters, listen to panels and plenaries, speak with exhibitors and discuss how technology can:

* Enable healthcare delivery and provide power and communications in developing countries
* Provide clean water, provide sanitation and improve crop yields
* Improve the timeliness and effectiveness of disaster response
* Assist with training and build capacity needed to improve the standard of living

This year’s conference is dedicated to “Advancing Technology for Humanity”, focusing on key areas including energy, health, disaster management, connectivity, agriculture, and education. Register now at http://ieeeghtc.org/registration/.

 

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September 6, 2016

Strategic Materials Conference (SMC) 2016

by @ 5:19 pm. Filed under ALL, Consumer Electronics, Electronics Design, Reliability, Semiconductors
 
Scaling Challenges: The Future of Materials and Packaging
for the semiconductor and adjacent industries
Strategic Materials Conference (SMC) 2016

SMC16The focus of SMC 2016 is on emerging materials and packaging technology trends across the entire microelectronics supply chain and provide an insider’s outlook for the future. High-profile keynotes and industry leaders will deliver insights on the business drivers behind innovations in device manufacturing and scaling. Learn about:

* Disruptive Trends and Opportunities for New Materials
* Contamination and Metrology Challenges
* Advanced Packaging
* Future of Moore’s Law and Encounters of a 3D Kind
* Strategic Materials Challenges from the Fab Perspective
* Economic & Market Trends

SMC 2016, coming September 20-21, at the Computer History Museum in Mountain View

http://www.semi.org/en/node/41386/?=ieee

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August 30, 2016

CPI Stress Induced Carrier Mobility Shift in Advanced Silicon Nodes

by @ 10:26 pm. Filed under ALL, Electronics Design, Reliability, Semiconductors
 

Thursday, November 3, 2016
SCV Reliability Chapter, Electron Device Society (EDS), and Components, Packaging, and Manufacturing Technologies (CPMT) 
Subject: CPI Stress Induced Carrier Mobility Shift in Advanced Silicon Nodes
– mechanical stress and the consequent effects on device performance for advanced three-dimensional (3-D) IC technologies …
Speaker: Valeriy Sukharev, Technical Lead, Design to Silicon Division (Calibre) of Mentor Graphics Corporation
Time: 6:00 to 6:30 pm: Sign in, snacks and social; 6:30 to 7:30 pm: Presentation; 7:30 to 8:00 pm: Question and Answer Session
Cost: Free
Location: Qualcomm, Inc., 3165 Kifer Road, Santa Clara, in the cafeteria
Event Details: http://ewh.ieee.org/r6/scv/rl/
Please register so as to know how much food to purchase: https://www.eventbrite.com/e/cpi-stress-induced-carrier-mobility-shift-in-advanced-silicon-nodes-tickets-27427049042
Food sponsored by I.C.E. Labs, ISO 9001 & 17025 Reliability Test Lab, www.icenginc.com

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Reliability and The Self-Driving Car

by @ 10:15 pm. Filed under ALL, Electronics Design, Reliability
 

Thursday, October 6, 2016
SCV Reliability Chapter
Subject: Reliability and The Self-Driving Car
– 94% of traffic accidents involve human error, developing a self-driving vehicle from the ground up, and employing the best design for reliability and reliability test practices…
Speaker: Noah Lassar, Senior Manager of Reliability for the Google[X] Self-Driving Car
Time: 6:00 to 6:30 pm: Sign in, snacks and social; 6:30 to 7:30 pm: Presentation; 7:30 to 8:00 pm: Question and Answer Session
Cost: Free
Location: Qualcomm, Inc., 3165 Kifer Road, Santa Clara, in the cafeteria
Event Details: http://ewh.ieee.org/r6/scv/rl/
Please register so as to know how much food to purchase: https://www.eventbrite.com/e/reliability-and-the-self-driving-car-tickets-27426937709
Food sponsored by I.C.E. Labs, ISO 9001 & 17025 Reliability Test Lab, www.icenginc.com

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August 18, 2016

A Statistical FEA Method for Predicting Glass Fracture in Consumer Electronic Products

by @ 10:19 pm. Filed under ALL, Consumer Electronics, Electronics Design, Reliability
 

Thursday, August 25, 2016
SCV Signal Processing Society (SPS)
Subject: A Statistical FEA Method for Predicting Glass Fracture in Consumer Electronic Products
– probability of fracture for glass components during drop impact, size and rate effects on glass strength, the temporal and spatial nature of the stress results, and the combining of drop orientations to produce a probability of failure …
Speaker: Marc Zampino, Senior Design Analysis Engineer, Amazon/Lab126
Time: 6:00 pm: Registration, networking, and refreshments; 6:30 pm to 7:30 pm: Presentation; 7:30 to 8:00 pm: Question and answer session
Cost: Free, Donations accepted for food
Location: Qualcomm Inc., in the Cafeteria, 3165 Kifer Rd, Santa Clara
Event Details: http://ewh.ieee.org/r6/scv/rl/
RSVP to know how much food to purchase: https://www.eventbrite.com/e/a-statistical-fea-method-for-predicting-glass-fracture-in-consumer-electronic-products-tickets-27186020118
Food sponsored by I.C.E. Labs, ISO 9001 & 17025 Reliability Test Lab, http://www.icenginc.com

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August 15, 2016

Workshop & Tabletop Expo: Flexible Hybrid Electronics – Opportunities and Challenges

by @ 10:47 pm. Filed under ALL, Consumer Electronics, Electronics Design, Semiconductors
 

Wednesday, September 21, 2016
SCV Components, Packaging, and Manufacturing Technologies (CPMT)
Subject: Workshop & Tabletop Expo: Flexible Hybrid Electronics – Opportunities and Challenges
– an overview of polymers, interconnects, sensors and energy sources along with producibility challenges for commercialization, feature product demos …
Time: 8:00 am: Registration and continental breakfast; 8:50 am: Call to Order and Welcome; 9:00 am: First presentation; 12:00 pm – 1:00 pm: Lunch, demonstrations; 1:00 pm – 3:15 pm: Afternoon presentations; 3:15 pm – 4:15 pm: Reception/Networking
Cost: $40 IEEE members; $50 non-members; $20 students, unemployed, through Sept. 19th (at door: $45 / $55 / $30)
Location: Texas Instruments Building E Conference Center, 2900 Semiconductor Dr. (off Kifer Rd), Santa Clara
Event Details: http://www.cpmt.org/scv/?p=170
Register at: https://1609wcpmt.eventbrite.com

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August 9, 2016

Call for Papers – IoT Summit to be held on March 16-17, 2017, to be held at the Santa Clara Convention Center

by @ 4:45 pm. Filed under ALL, Computers/Software, Consumer Electronics, Electronics Design, Industrial Applications, Semiconductors
 
Call for Papers – IoT Summit to be held on March 16-17, 2017, to be held at the Santa Clara Convention Center


IoTSummit2017
Topics will include, although not be limited to:
* IoT Applications: Wearables, health & fitness, automotive, energy, smart power grid, environmental monitoring, consumer, security, military, nautical, aeronautical and space, robotics automation
* IoT enabling technologies such as sensors, cloud, low power and energy harvesting, sensor networks, machine-type communication, resource-constrained networks, real-time systems, IoT data analytics, in situ processing, and embedded software.
* IoT architectures such as things-centric, data-centric, service-centric architecture, platforms, cloud-based IoT, system security and manageability.
* IoT services, applications, standards, and test-beds such as streaming data management and mining platforms, service middleware, open service platform, semantic service management, security and privacy-preserving protocols, design examples of smart services and applications, and IoT application support.

Please complete and return this form by October 12, 2016:http://www.sensorscon.org/English/Collaterals/Documents/IOT-Summit-Speaker-Proposal-Form.pdf

 

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Look Ma, No Bluetooth! Introducing the New Innovative Cassia Hub Bluetooth Router

by @ 3:08 pm. Filed under ALL, Communications, Consumer Electronics, Electronics Design, Semiconductors
 

Tuesday, September 27, 2016
SCV Consumer Electronics Society (CES)
Subject: Look Ma, No Bluetooth! Introducing the New Innovative Cassia Hub Bluetooth Router

– overcomes the limitation of distance and the number concurrent connected devices, make any changes to extend range, for music/entertainment, smart home, health / medical, fitness / sports, education, industrial, and future applications…
Speaker: Felix Zhao, founder and CEO, Cassia Networks, Inc.
Time: 6:30 pm: Registration, networking, pizza and drinks; 7:00 pm to 8:30 pm: Presentation
Cost: Non-IEEE members = $10, IEEE members – $5, IEEE CES and IEEE Student members – Free
Location: NVIDIA, 2800 Scott Blvd., Building E, Santa Clara
Event Details: https://www.eventbrite.com/e/ieee-consumer-electronics-society-sept-meeting-tickets-27034701520

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August 4, 2016

Inaugural IEEE International Conference on Rebooting Computing (ICRC 2016)

by @ 3:13 pm. Filed under ALL, Computers/Software, Electronics Design
 

The end of Moore’s Law is near; IEEE Rebooting Computing is re-imagining the entire computing enterprise to continue performance improvements into the future. Come and join your peers in industry, academia, and funding agencies to reinvent computing technology!
Inaugural IEEE International Conference on Rebooting Computing (ICRC 2016)

RebootingComputing     Areas of focus will include
* New materials and physics
* Devices and circuits
* System and network architectures
* Algorithms and software

Meet the grand challenge of future computing at ICRC on October 17-19 at the Hilton San Diego/Del Mar. Register before September 1 at http://icrc.ieee.org/ to receive discounted rates.

 

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July 15, 2016

Circuit Device Interactions and Co-Optimizations, from System and Chip Design to Process Integration â?? The Secret Sauce for Complex SOC Chips and SIPs in Advanced Technology Nodes

by @ 4:36 pm. Filed under ALL, Electronics Design, Semiconductors
 

Tuesday, August 9, 2016
SCV Electronic Device Society (EDS)
Circuit Device Interactions and Co-Optimizations, from System and Chip Design to Process Integration â?? The Secret Sauce for Complex SOC Chips and SIPs in Advanced Technology Nodes
– Design for manufacturing/reliability and design process co-optimizations, optimize for performance, power, area, cost and time to market…
Speaker: Dr. John Hu, Director of Advanced Technology, Nvidia Corporation
Time: 6:00 pm: Registration, refreshments, and networking: 6:15 to 7:00 pm: Presentation
Cost: Free
Location: Texas Instruments, Building E Conference Center, 2900 Semiconductor Dr., Santa Clara
Event Details: http://sites.ieee.org/scv-eds/

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June 22, 2016

Company tour of Jabil Blue Sky

by @ 1:32 pm. Filed under ALL, Consumer Electronics, Electronics Design, Industrial Applications, Semiconductors
 

Thursday, August 25, 2016
SCV Components, Packaging, and Manufacturing Technologies (CPMT)
Subject: Company tour of Jabil Blue Sky
– cultivating and incubating new ideas from vision to digital prototype to global manufacturing, 3D Printing, Internet of Things, Embedded Sensors, Adhesives, Visual Materials, Precision Mechanics, Control Panel, UX Design, Printed Electronics …
Speaker: Hien Ly, Jabil Blue Sky
Time: 11:30 am to 12:00 noon: Registration, lunch, and networking: 12:00 to 1:00 pm: Company Tour
Cost: $5 for IEEE Members, students, and retired, $10 for non-members
Location: Jabil Blue Sky, 6375 San Ignacio Ave., San Jose
Event Details: http://www.cpmt.org/scv/
Please sign up by August 11th

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June 21, 2016

Casino Chip Sorter Project – Devry’s IEEE Student Branch Prize Winning Project Presentation

by @ 12:55 pm. Filed under ALL, Electronics Design, Industrial Applications
 

Thursday, August 18, 2016
OEB Industrial Applications Society (IAS)
Subject: Casino Chip Sorter Project – Devry’s IEEE Student Branch Prize Winning Project Presentation
– small gambling venues, using a low cost Arduino microcontroller, which gives access to open source code repositories, one can further lower development costs, smaller form factors …
Speaker: Jason White, Andrew Sunde, and Prof. Mostafa Mortezaie, IEEE Region 6 PACE Chair
Time: 5:30 pm: No-host social; 6:15 pm: Presentation; 7:15 pm: Dinner; 8:00 pm: Presentation continues; 8:30 pm: Adjourn
Cost: $25 for IEEE members, $15 for student and retired members, $30 for non-members
Location: Zio Fraedoâ??s Restaurant 611 Gregory Lane, Pleasant Hill. Call 925-933- 9091 if you need directions.
Event Details: https://meetings.vtools.ieee.org/m/40273

T

 

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June 17, 2016

Hot Chips 28: A Symposium on High Performance Chips

by @ 4:16 pm. Filed under ALL, Computers/Software, Electrical/Power, Electronics Design, Product Safety, Reliability, Semiconductors
 

Hot Chips 28: A Symposium on High Performance Chips will be held at the Flint Center in Cupertino on Sunday, August 21 through Tuesday, August, 23 , with tutorials on Sunday.

HotChipsPerformance, innovation, and advanced technology; come to the symposium which specializes in processors, mobile and embedded devices, communications and networking, FPGAs, memory, chipsets, high integrity computation, and power chips. Software, packaging and test, displays, optical and sensors, and other novel devices will also be showcased.

For more information, go to http://www.hotchips.org. Also see the Hot Chips 2016 Advance Program.pdf

 

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Hot Interconnects Symposium

by @ 4:14 pm. Filed under ALL, Computers/Software, Electrical/Power, Electronics Design, Product Safety, Reliability, Semiconductors
 

Calling the Data-Center Networking and the Supercomputing communities! Come to the Hot Interconnects Symposium at the Huawei North America Headquarters in Santa Clara on August 24-25.

Hot Interconnects
IEEE Hot Interconnects is the premier international forum for researchers and developers of state-of-the-art hardware and software architectures and implementations for interconnection networks of all scales, ranging from multi-core on-chip interconnects to those within systems, clusters, and data centers. Leaders in industry and academia attend the conference to interact with individuals at the forefront of this field. http://www.hoti.org

 

 

 

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