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Technology & Networking in Silicon Valley & the SF Bay Area: Upcoming Meetings, Courses and Conferences

May 14, 2018

1+1=3:The Power of Groups: From Tiny Chips to Space Super-Structures

by @ 9:53 pm. Filed under ALL, Circuits, Computers/Software, Electronics Design, Optics/Displays, Semiconductors
 

Thursday, May 17, 2018 
SCV Solid State Circuits Society (SSCS) 
Subject: 1+1=3:The Power of Groups: From Tiny Chips to Space Super-Structures
– low-cost tera-hertz imagers, nano-photonic coherent cameras capable of forming 3D images, optical phased arrays, space-based solar power transfer, self-healing circuits that repair themselves, and medical diagnostic and therapeutic devices solutions …
Speaker: Prof. Hajimiri, CalTech
Time: 6:00 pm: Networking and refreshments; 6:30 pm to 8:00 pm: Presentation
Cost: SSCS members: free; IEEE members: $2 non-members: $5 
Location: Texas Instruments Building E Conference Center, 2900 Semiconductor Dr., Santa Clara 
Event Details: sites.ieee.org/scv-sscs/upcoming-events/ 

20180517ALL

April 18, 2018

2D to 3D Package Architectures: Back to the Future

by @ 1:55 pm. Filed under ALL, Semiconductors
 

Thursday, May 3, 2018
SFBA Electronics Packaging Society (EPS)
Subject: 2D to 3D Package Architectures: Back to the Future
– scaling, heterogeneous integration, impact on power, performance, latency, nomenclature for package architectures, current metrics, projections …
Speaker:
Time: 11:30 am: Registration, sandwiches, and networking; 12:00 noon to 1:00 pm: Presentation
Presentation-only: 12:00 noon (come at 11:45) – Free
Cost: IEEE Members, students, unemployed: $5; Non-Members: $10
Location: Texas Instruments Building E Conference Center, 2900 Semiconductor Dr., Santa Clara
Event Details: cpmt.org/scv

20180503ALL

March 29, 2018

Sensors, Expo, and Conference

by @ 8:41 pm. Filed under ALL, Computers/Software, Electronics Design, Green energy, Industrial Applications, Semiconductors
 
SENSORS

Sensors, Expo, and Conference

The industry’s largest event dedicated to sensors, connectivity, and systems. Early bird registration is now open!

Sensors18Held June 26-28, 2018, at the San Jose Convention Center. For more information, to go sensorsexpo.com/ Use promo code IEEESF for $100 off pass.

THE ONLY TECHNICAL PROGRAM COVERING 100% SENSORS

* Embedded Systems               * IoT, Machine Learning 
* 3D Vision, Optical                * AI, 3D LiDAR Solid State
* Nano power, MEMS            * Air quality measurement
* Energy Harvesting              * Printed flexible, stretchable fabric

 

20180626ALL

March 13, 2018

50 Years of Computer Architecture: From Mainframe CPUs to Neural-Network TPUs and Open RISC-V

by @ 9:29 pm. Filed under Circuits, Computers/Software, Semiconductors, Signal Processing
 

Thursday, March 15, 2018 
SCV Solid State Circuits Society (SSCS), Computer Society (CS), and Signal Processing Society (SPS) 
Subject: 50 Years of Computer Architecture: From Mainframe CPUs to Neural-Network TPUs and Open RISC-V
– Since the ending of Moore’s Law and Dennard scaling has stalled performance of general-purpose microprocessors, domain-specific computer architectures are the only option left. An early example of this trend introduced by Google in 2015 is the Tensor Processing Unit (TPU) for cloud-based deep neural networking …
Speaker: Prof. David Patterson, Google and University of California, Berkeley 
Time: 6:00 pm: Registration, refreshments, and networking; 6:30 pm: Presentation: 7:45 pm: Q&A; 8:00 pm: Adjourn 
Cost: IEEE SSCS/CAS/CS/SPS/CIS society members: Free: Students: $3 (Register at Door $3): IEEE (non-society) members:$7 (Register at Door $10); Non-members: $10 (Register at Door $15)
Location: Texas Instruments Building E Conference Center, 2900 Semiconductor Dr., Santa Clara 
Event Details: sites.ieee.org/scv-sscs/ 

20180315ALL

Bringing True Medical-grade Data to your Fingertips through a Next Generation Wearable

by @ 3:17 pm. Filed under ALL, BioEngineering, Consumer Electronics, Semiconductors
 

Tuesday, March 27, 2018 
SCV Consumer Electronics Society (CES), SCV Engineering in Medicine and Biology Society (EMBS), and SFBA MEMS and Sensors Chapter
Subject: Bringing True Medical-grade Data to your Fingertips through a Next Generation Wearable
– sensors that continually and wirelessly report health status to a mobile device from within our body, fluorescent, soft, biomaterials, experience in bringing pioneering medical sensor technology to market …
Speaker: Kevin Zhao, Cloud and Software Engineer, Profusa
Time: 6:30 pm: Registration, Food, Networking; 7:00 pm: Presentation; 8:00 pm: Q&A and Networkingl 8:30 pm: Adjourn 
Cost: CES and IEEE Student members: Free; IEEE members: $4 prepaid, $5 at door; Non-members: $9 prepaid, $10 at door
Location: NVIDIA, 2800 Scott Blvd, Building E, Santa Clara 
Event Details: sites.ieee.org/scv-ces/event/bringing-true-medical-grade-data-to-your-fingertips-through-a-next-generation-wearable/ 
Eventbrite: eventbrite.com/e/bringing-true-medical-grade-data-to-your-fingertips-through-a-next-generation-wearable-tickets-44013014110

20180327ALL

February 26, 2018

Reliability for the 21st Century: Meeting Challenges of New Packaging Technologies and New Markets

by @ 2:17 pm. Filed under ALL, Semiconductors
 

Wednesday, April 25, 2018 

SFBA Electronics Packaging Society (EPS), Reliability Chapter, and the MEMS and Sensors Chapter 
Subject: Reliability for the 21st Century: Meeting Challenges of New Packaging Technologies and New Markets 
– complexity, feature sizes, physics of failure, damage metrics, packaging design, qualification, proposed methodologies… 
Speaker: Dr. Milena Vujosevic, TDK-InvenSense
Time: 11:30 am: Registration, sandwiches, and networking; 12:00 noon to 1:00 pm: Presentation
Presentation-only: 12:00 noon (come at 11:45) – Free
Cost: IEEE Members, students, unemployed: $5; Non-Members: $10
Location: Texas Instruments Building E Conference Center, 2900 Semiconductor Dr., Santa Clara 
Event Details: cpmt.org/scv/ 

20180425ALL

February 21, 2018

ASIC 2018

by @ 2:23 pm. Filed under ALL, Semiconductors, Vehicular Technology
 
AUTOMOTIVE

ASIC2018Learn about all things Automotive at ASIC 2018.

* Design for Reliability (DFR) and Design for Safety (DFS) techniques
* Quality and reliability verification and validation solutions 
* Devices and system reliability test and certification techniques 
* Advanced packaging and manufacturing process for automotive applications

The Automotive Safety Innovative Conference 2018 will be on March 14th, at the Biltmore Hotel off 101 in Santa Clara. See asic2018.qrtkr.com/ for more information.

 

20180314ALL

January 31, 2018

Bringing Advanced MEMS Technologies from Concept to Market

by @ 10:20 pm. Filed under ALL, Semiconductors
 

Wednesday, February 28, 2018 
SCV MEMS and Sensors Chapter 
Subject: Bringing Advanced MEMS Technologies from Concept to Market
– low cost, small size, low power consumption, overall system performance, build competitive products through connectivity, user experience and system integration activities, accelerating IoT’s promise to improve our world… 
Speaker: Marcellino Gemelli, Business Development for MEMS product portfolio, Bosch Sensortec 
Time: 6:30 pm: Registration, refreshments, and networking; 7:00 pm: Presentation and Q&A; 8:00 pm to 8:30 pm: ExCom Meeting
Cost: $5 donation
Location: Texas Instruments Building E Conference Center, 2900 Semiconductor Dr., Santa Clara 
Event Details: eventbrite.com/e/bringing-advanced-mems-technologies-from-concept-to-market-tickets-42692262707 

20180228ALL

January 29, 2018

International Conference and Exhibition on DEVICE PACKAGING

by @ 6:50 pm. Filed under ALL, Semiconductors
 
01011100    COMPUTING AND SEMICONDUCTORS    10100101

The International Conference and Exhibition on DEVICE PACKAGING

is the largest 2018 conference dedicated to interposers, 3D IC & packaging, fan-out WLP, flip chip, MEMS & sensors, and 3D printing. The Device Packaging Conference and Exhibition will be the one FOWLP/3D conference you will not want to miss. It features:iMAPS* 60 presentations on FOWLP, 3D, Microsystems
* Poster Session featuring 20+ presentations & Happy Hour!
* 5 Keynotes on 3DIC, Heterogeneous Integ., SiP, Automotive
* 13 short courses on: 3D, Fanout, High Density Pkg, Cu Pillars, & more
* A sold-out exhibition of 66 booths…the companies you need to see

The iMAPS Device Packaging Conference is from March 5-7, outside of Phoenix, and set among Arizona’s captivating Sonoran Desert, with spectacular views of Arizona’s majestic Four Peaks and iconic Red Mountains alongside the free-flowing Verde River. Go to imaps.org/devicepackaging for more information. Early bird registration and hotel deadline is February 7th.


 

20180305ALL

December 29, 2017

Advanced engineering short courses by MEAD at UCSC

by @ 9:09 pm. Filed under ALL, Computers/Software, Semiconductors
 
ADVANCE YOUR CAREER WITH ADDITIONAL EDUCATION

Advanced engineering short courses are organized by MEAD Microelectronics and are held at UC Santa Cruz from March 26-30, 2018

UCSCmeadMEAD education short courses are taught by both academic and industrial instructors, which allows the coverage of the theoretical as well as practical aspects of every topic in all courses. The following courses are offered:

Advanced Analog IC Design
Time Assisted Analog Design, Circuit Techniques for OpAmp Speed and Accuracy Improvements, CMOS Switched-Capacitor Circuit Design

Delta-Sigma Data Converters
Delta Sigma Converter Basics, CTDS Modulators, Dynamic Element Matching, Design of Building Blocks for CTDS Modulators

Deadline for registration: February 19, 2018. See mead.ch/MEADNEW/advanced-engineering-courses-uc-santa-cruz-california

 

20180219ALL

December 23, 2017

Silicon Photonics System-on-Chip: Past, Present & Future

by @ 2:56 pm. Filed under ALL, Photonics, Semiconductors
 

Tuesday, January 9, 2017 
SCV Photonics 
Subject: Silicon Photonics System-on-Chip: Past, Present & Future

In this talk, we’ll discuss the history, current technology, and future of Silicon Photonics

Speaker: Michael Hochberg, Elenion Technologies
Time: 5:30p m: Networking/Light Dinner; 6:30 pm to 8 pm: Presentation
Cost: Free
Location: INTEL,Building SC-12, 3600 Juliette Lane, Santa Clara 
Event Details: http://ewh.ieee.org/r6/scv/leos/ 

20180109ALL

December 14, 2017

Trends and Transitions in Semiconductor Packaging

by @ 8:59 pm. Filed under ALL, Semiconductors
 

Wednesday, February 14, 2018 
SFBA Electronic Packaging Society (EPS) 
Subject: Trends and Transitions in Semiconductor Packaging
– business models, supply chain, technology requirements, forecast for 2018 and 2019… 
Speaker: Dr. Dan Tracy, Senior Director Industry Research & Statistics, SEMI
Time: 11:30 am: Registration, refreshments, and networking; 12:00 pm noon: Presentation and Q&A
Cost: IEEE Members, students, unemployed: $5; Non-Members: $10; Presentation-only (no cost): 12:00 noon (come at 11:45)
Location: Texas Instruments Building E Conference Center, 2900 Semiconductor Dr., Santa Clara 
Event Details: cpmt.org/scv/ 

20180214ALL

December 5, 2017

Puny Sensors in a Big Data World

by @ 11:39 am. Filed under ALL, Semiconductors
 

Wednesday, January 17th 2018 
SFBA MEMS and Sensors Chapter 
Subject: Puny Sensors in a Big Data World
– identify unmet needs and major societal challenges in personal mobility and transportation, AI, complex systems operation and optimization, robotics, portable renewable energy, and materials design and manufacturing.. 
Speaker: Dr. John Suh, Hyundai Ventures
Time: 6:30 pm to 8:00 pm, followed by an Adcom meeting 
Cost: Free 
Location: Texas Instruments Building E Conference Center, 2900 Semiconductor Dr., Santa Clara 
Event Details: sites.ieee.org/scv-mems/meetings/ 
Register: goo.gl/dP6ZnJ 

20180117ALL

Workshop on Heterogeneous Integration for Future Devices and Materials

by @ 11:22 am. Filed under ALL, Semiconductors
 

Thursday, February 22, 2018 
SFBA Electronics Packaging Society (EPS)
Subject: Heterogeneous Integration Roadmap Symposium
– end of CMOS scaling, difficult challenges, future vision, research, academia, labs, collaboration…
Speaker: Dr.William Chen, ASE; Dr. Bill Bottoms, 3MTS; plus 20 Working Group chairs
Time: 5:30 am to 5:30 pm
Cost: IEEE Members, students, unemployed: $40; Non-Members: $50
Location: Texas Instruments Building E Conference Center, 2900 Semiconductor Dr., Santa Clara
Event Details: cpmt.org/scv/ 

20180222ALL

Heterogeneous Packaging Integration for Electronics Systems

by @ 11:21 am. Filed under ALL, Semiconductors
 

Thursday, January 25, 2018 
SFBA Electronic Packaging Society 
EPSSubject: Heterogeneous Packaging Integration for Electronics Systems
– mobile products, system-on-chip, dissimilar chips, performance, cost, SiP, TSV, interposers, forecast … 
Speaker: Dr. John H Lau, ASM Pacific Technology
Time: 11:30 am: Registration, refreshments, and networking; 12:00 pm noon: Presentation and Q&A
Cost: IEEE Members, students, unemployed: $5; Non-Members: $10; Presentation-only (no cost): 12:00 noon (come at 11:45)
Location: Texas Instruments Building E Conference Center, 2900 Semiconductor Dr., Santa Clara 
Event Details: cpmt.org/scv/ 

20180125ALL

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