IEEE S.F. Bay Area Council e-GRID's
BayAreaTech

Technology & Networking in Silicon Valley & the SF Bay Area: Upcoming Meetings, Courses and Conferences

September 15, 2017

Financial and Managerial Accounting for Reliability – an Introduction

by @ 12:24 pm. Filed under ALL, Engineering Mgmt, Reliability
 

Thursday, October 5, 2017 
SCV Reliability Society 
Subject: Financial and Managerial Accounting for Reliability – an Introduction
– A product with poor reliability, basic principles behind the financial and managerial accounting process, how this applies to warranty expenses… 
Speaker: Wim Deweerd, Principal Engineer / Manager, Qualcomm Inc.
Time: 6:00 pm: Networking, registration, and refreshments; 6:30 pm to 8:00 pm: Presentation and Q&A
Cost: Free. Food sponsored by I.C.E. Labs, ISO 9001 & 17025 Reliability Test Lab, www.icenginc.com 
Location: Qualcomm, Inc., 3165 Kifer Road, Building-B Cafeteria Santa Clara 
Event Details: https://www.eventbrite.com/e/title-financial-and-managerial-accounting-for-reliability-an-introduction-tickets-37933130013

20171005ALL

August 14, 2017

Telemetry for IC Reliability

by @ 5:59 pm. Filed under ALL, Reliability
 

Thursday, September 7, 2017 
SCV Reliability Society 
Subject: Telemetry for IC Reliability
– acquisition of IC usage data remotely in the field, provides data about actual IC use conditions, reliability engineering, six stage framework for telemetry work which enables value to be derived … 
Speaker:  Robert Kwasnick, Intel Corp.
Time: 6:00 pm: Registration, networking, and refreshments; 6:30 pm to 8:00 pm: Presentation and Q&A 
Cost: Free
Location: Qualcomm, Building-B Cafeteria, 3165 Kifer Road Santa Clara
Event Details: https://www.eventbrite.com/e/telemetry-for-ic-reliability-tickets-37010193485 
Food sponsored by: ICE Labs, ISO 9001 & 17025 Reliability Test Lab. www.icenginc.com

20170907ALL

July 26, 2017

A Realistic and Useful ESD Test for Consumer Electronics

by @ 11:09 am. Filed under ALL, Reliability
 

Thursday, August 3, 2017 
SCV Reliability Society 
Subject: A Realistic and Useful ESD Test for Consumer Electronics
– new ESD test is being proposed for consumer electronics that is representative of field conditions and allows the prediction of field reliability…
Speaker: Michael Heaney, Principal Physicist, Amazon Lab126
Time: 6:00 pm: Registration, networking, and refreshments; 6:30 pm – 8:00 pm: Presentation and Q&A  
Cost: Free
Location: Qualcomm, Inc. (Building-B Cafeteria), 3165 Kifer Road, Santa Clara
Food sponsored by: ICE Labs, ISO 9001 & 17025 Reliability Test Lab. www.icenginc.com 
Eventbrite: https://www.eventbrite.com/e/a-realistic-and-useful-esd-test-for-consumer-electronics-tickets-36530947046

201710803ALL

May 15, 2017

Systematic Problem Solving in Reliability Engineering

by @ 11:41 am. Filed under ALL, Engineering Mgmt, Reliability
 

Thursday, June 1, 2017 
SCV Reliability Chapter 
Subject: Systematic Problem Solving in Reliability Engineering
– how to attack problems where there is data, no data, and where data must be generated, brainstorming, five whys, fault tree analysis, and fishbone diagram, TRIZ, HU, and quantitative methods… 
Speaker: John J. Flaig, Ph.D., Fellow, American Society for Quality (ASQ), Managing Director, Applied Technology 
Time: 6:00 pm: Check in, refreshments, and networking; 6:30 pm to 7:30 pm: Presentation; 7:30 pm to 8:00 pm: Questions 
Cost: Free; Food sponsored by I.C.E. Labs, ISO 9001 & 17025 Reliability Test Lab, www.icenginc.com 
Location: Qualcomm,
3165 Kifer Road, Building-B Cafeteria, Santa Clara 
Event Details: https://www.eventbrite.com/e/systematic-problem-solving-in-reliability-engineering-tickets-34614595186?ref=enivtefor001&utm_source=eb_email&utm_medium=email&utm_campaign=inviteformalv2&ref=enivtefor001&utm_term=attend

20170601ALL

April 21, 2017

The relationship between Reliability Testing and Failure Analysis 

by @ 5:25 pm. Filed under ALL, Reliability
 

Thursday, May 4, 2017 
SCV Reliability Society 
Subject: The relationship between Reliability Testing and Failure Analysis 
– variety of standard reliability test methods and the issues they stress, typical failures found and the methods used to find them … 
Speaker: Daniel Sullivan, EAG Lab
Time: 6:00 pm: Registration, networking, and refreshments; 7:30 pm to 8:00 pm: Presentation
Cost: Free
Location: Qualcomm, Inc., 3165 Kifer Road, Building-B Cafeteria, Santa Clara 
Event Details: https://www.eventbrite.com/e/the-relationship-between-reliability-testing-and-failure-analysis-tickets-33883619819?aff=eivtefrnd?utm_source=eb_email&utm_medium=email&utm_campaign=evitefrnd&utm_term=eventimage 

20170504ALL

April 13, 2017

Ten Years of Robustness Validation Applied to Power Electronics Components

by @ 11:27 am. Filed under ALL, Electrical/Power, Reliability, Semiconductors
 

Thursday, April 27, 2017
SCV Components, Packaging, and Manufacturing Technologies (CPMT), Reliability, and Power Electronics Chapters
Subject: Ten Years of Robustness Validation Applied to Power Electronics Components
– European car makers, physics of failure, “test to fail”, end-of-life testing, thick wire bonds, planar interconnects…
Speaker: Dr Eckhard Wolfgang, European Center for Power Electronics e.V. (retired from Siemens Research)
Time: 11:30 am: Registration, networking, and pizza & drinks; 12:00 pm to 1:00 pm: Presentation; If coming for presentation only: arrive at 11:45
Cost: IEEE members students, unemployed: $5; Non-members: $10; Add an additional $5 at door
Location: Texas Instruments Building E Conference Center, 2900 Semiconductor Dr, Santa Clara
Event Details: http://www.cpmt.org/scv/

20160427ALL

February 12, 2017

Data Analytics-Propelled Reliability Engineering 

by @ 11:13 pm. Filed under ALL, Reliability
 

Thursday, March 2nd, 2017 
SCV Reliability Society and Components, Packaging, and Manufacturing Technologies (CPMT) 
Subject: Data Analytics-Propelled Reliability Engineering 
-Parametric measurements and Machine Learning provide tools to propel reliability decision making to the next level in all phases of the product life cycle … 
Speakers: Bernhard Hiller, Leader of the Advanced Reliability Engineering team, Western Digital Corporation 
Time: 6:00 pm: Check in, networking, refreshments 6:30 pm: Presentation; 7:30 pm: Adjourn 
Cost: Free; Food sponsored by: ICE Labs, ISO 9001 & 17025 Reliability Test Lab www.icenginc.com 
Location:  Google, 2011 Stierlin Ct., Mountain View
Event Details: https://www.eventbrite.com/e/data-analytics-propelled-reliability-engineering-tickets-32342714931 

20170302ALL

January 26, 2017

Copper Pillar, ELK, and Solder: The Challenges of Assembly and Long-Term Reliability at 28nm and 16nm 

by @ 1:19 pm. Filed under ALL, Reliability, Semiconductors
 

Thursday, February 9th, 2017 
SCV Reliability Society and Components, Packaging, and Manufacturing Technologies (CPMT) 
Subject: Copper Pillar, ELK, and Solder: The Challenges of Assembly and Long-Term Reliability at 28nm and 16nm 
– increasing use of ELK and ULK, especially at higher metal layers, has allowed for lower RC constants and better performance, come at a cost… 
Speakers: Dr. Craig Hillman of DfR Solutions, CEO 
Time: 6:00 pm: Check in, networking, refreshments 6:30 pm: Presentation; 7:30 pm: Adjourn 
Cost: Free; Food sponsored by: ICE Labs, ISO 9001 & 17025 Reliability Test Lab. www.icenginc.com 
Location: Qualcomm, Inc. (Building-B Cafeteria), 3165 Kifer Road, Santa Clara
Event Details: https://scvrelfeb2017.eventbrite.com/ 

January 25, 2017

International Reliability Physics Symposium (IRPS) 2017

by @ 3:35 pm. Filed under ALL, Product Safety, Reliability, Semiconductors
 

Join us for International Reliability Physics Symposium (IRPS) 2017, the world’s pre-eminent forum for reporting technological breakthroughs in the area of microelectronics reliability. IRPS 2017 will be held on April 2-6 at the Hyatt Regency Monterey Hotel and Spa on Del Monte Golf Course in Monterey.
Keynote talks are:
* Reflections on the risk of human space exploration – lessons learned from past failures
* System Level Reliability Challenges with Technology Scaling
Conference topics include:
3D 2.5D / 3D / Packaging * Product Reliability * Back-End Dielectrics * Photovoltaics * Circuit Aging / Reliability * Reliability Testing * Electrostatic Discharge * Soft Errors * Failure Analysis * System Reliability * Front-End Dielectrics * Wide Band Gap * Metallization Reliability * Transistor Reliability * Memory Reliability * Transistors – Beyond CMOS * Process Integration
Plesae register at irps.org/

 

20170402ALL

November 14, 2016

On-Chip ESD Protection Design: Yesterday, Today, Tomorrow and Future

by @ 1:23 pm. Filed under ALL, Computers/Software, Electronics Design, Reliability, Semiconductors
 

Thursday, December 1, 2016 
SCV-SF Electron Device Society (EDS) 
Subject: On-Chip ESD Protection Design: Yesterday, Today, Tomorrow and Future
– ESD protection, killing factor to the time to market of new IC products, ESD protection basics and traditional ESD protection solutions, new CAD tool for full-chip ESD protection circuit design verification… 
Speaker: Prof. Albert Wang, Dept. of Electrical and Computer Engineering, University of California, Riverside 
Time: 6:00 pm: Registration, networking, and refreshments; 6:15 pm to 7:00 pm: Presentation
Cost: Free 
Location: Texas Instruments, 2900 Semiconductor Way, Bldg. E Auditorium, Santa Clara 
Event Details: http://sites.ieee.org/scv-eds/ 

20161201ALL

October 19, 2016

8th Annual IEEE CPMT SCV Soft Error Rate (SER) Workshop

by @ 9:58 pm. Filed under ALL, Computers/Software, Reliability, Semiconductors
 

Thursday, November 3, 2016
SCV Components, Packaging, and Manufacturing Technologies (CPMT) and Reliability Chapter
Subject: 8th Annual IEEE CPMT SCV Soft Error Rate (SER) Workshop
– three Tutorials, An Introduction to Single Event Effects (Xilinx), System Design Considerations for Soft Error Mitigation (iROC), Techniques and Challenges of Alpha Emissivity Measurements (XIA, IBM) …
Time: 9:30 am to 3:30 pm
Cost: Free; includes lunch
Location: Juniper Networks, Building 6, 1215 Borregas Ave, Sunnyvale or via Webex
Event Details: http://www.cpmt.org/scv/
Sponsors: IEEE CPMT Santa Clara Valley (SCV) Chapter, and Juniper Networks; Pure Technologies; Cisco Systems; XIA

20161103ALL

September 15, 2016

EMC in the Canadian Military – Hands-On and Practical Considerations

by @ 3:35 pm. Filed under ALL, Magnetics, Reliability
 

Tuesday, October 11, 2016
SCV Electromagnetic Compatibility (EMC)
Subject: EMC in the Canadian Military – Hands-On and Practical Considerations
– Military EMC includes aspects of electronic interoperability that are seldom or never considered in the commercial realm, includes first-hand experiences of work done in the Afghan theatre…
Speaker: Kris Hatashita, Consultant to the Canadian Department of National Defence for the Army Communications Group
Time: 5:30 pm: Registration, networking, light dinner; 6:30 pm to 8:00 pm: Presentation
Cost: Free
Location: 7layers, 1293 Anvilwood Ave, Sunnyvale
Event Details: http://ewh.ieee.org/r6/scv/emc/

20161011ALL

September 6, 2016

Strategic Materials Conference (SMC) 2016

by @ 5:19 pm. Filed under ALL, Consumer Electronics, Electronics Design, Reliability, Semiconductors
 
Scaling Challenges: The Future of Materials and Packaging
for the semiconductor and adjacent industries
Strategic Materials Conference (SMC) 2016

SMC16The focus of SMC 2016 is on emerging materials and packaging technology trends across the entire microelectronics supply chain and provide an insider’s outlook for the future. High-profile keynotes and industry leaders will deliver insights on the business drivers behind innovations in device manufacturing and scaling. Learn about:

* Disruptive Trends and Opportunities for New Materials
* Contamination and Metrology Challenges
* Advanced Packaging
* Future of Moore’s Law and Encounters of a 3D Kind
* Strategic Materials Challenges from the Fab Perspective
* Economic & Market Trends

SMC 2016, coming September 20-21, at the Computer History Museum in Mountain View

http://www.semi.org/en/node/41386/?=ieee

20160920ALL

August 30, 2016

Reliability and Performance of Carbon Nanotube Vias

by @ 10:38 pm. Filed under ALL, Reliability, Semiconductors
 

Thursday, December 1, 2016
SCV Reliability Chapter
Subject: Reliability and Performance of Carbon Nanotube Vias
– IC technology node continues to scale down to the sub-10 nm regime, new materials with higher current-carrying capacities than Cu and W such as carbon nanotubes (CNTs) and graphene are needed …
Speaker: Dr. Cary Y. Yang, Professor of Electrical Engineering and Director of TENT Laboratory, a SCU facility located inside NASA Ames
Time: 6:00 to 6:30 pm: Sign in, snacks and social; 6:30 to 7:30 pm: Presentation; 7:30 to 8:00 pm: Question and Answer Session
Cost: Free
Location: Qualcomm, Inc., 3165 Kifer Road, Santa Clara, in the cafeteria
Event Details: http://ewh.ieee.org/r6/scv/rl/
Please register so as to know how much food to purchase: https://www.eventbrite.com/e/cnt-reliability-tickets-27427113234
Food sponsored by I.C.E. Labs, ISO 9001 & 17025 Reliability Test Lab, www.icenginc.com

20161201ALL

CPI Stress Induced Carrier Mobility Shift in Advanced Silicon Nodes

by @ 10:26 pm. Filed under ALL, Electronics Design, Reliability, Semiconductors
 

Thursday, November 3, 2016
SCV Reliability Chapter, Electron Device Society (EDS), and Components, Packaging, and Manufacturing Technologies (CPMT) 
Subject: CPI Stress Induced Carrier Mobility Shift in Advanced Silicon Nodes
– mechanical stress and the consequent effects on device performance for advanced three-dimensional (3-D) IC technologies …
Speaker: Valeriy Sukharev, Technical Lead, Design to Silicon Division (Calibre) of Mentor Graphics Corporation
Time: 6:00 to 6:30 pm: Sign in, snacks and social; 6:30 to 7:30 pm: Presentation; 7:30 to 8:00 pm: Question and Answer Session
Cost: Free
Location: Qualcomm, Inc., 3165 Kifer Road, Santa Clara, in the cafeteria
Event Details: http://ewh.ieee.org/r6/scv/rl/
Please register so as to know how much food to purchase: https://www.eventbrite.com/e/cpi-stress-induced-carrier-mobility-shift-in-advanced-silicon-nodes-tickets-27427049042
Food sponsored by I.C.E. Labs, ISO 9001 & 17025 Reliability Test Lab, www.icenginc.com

20161103ALL

[IEEE S.F. Bay Area Council - www.e-grid.net] [powered by WordPress .]

SF Bay Area Council

Categories

  • ALL (4,535)
  • Antennas & Propagation (4)
  • BioEngineering (662)
  • Blogroll (33)
  • Circuits (11)
  • Communications (1,853)
  • Computers/Software (1,736)
  • Consumer Electronics (95)
  • Control Systems (17)
  • Electrical/Power (1,260)
  • Electronics Design (2,768)
  • Employment (4)
  • Employment opportunities (5)
  • Engineering Mgmt (1,803)
  • Green energy (39)
  • History (3)
  • Industrial Applications (73)
  • Information Theory (10)
  • Magnetics (22)
  • Microwave (8)
  • NanoEngineering (868)
  • Optics/Displays (968)
  • Photonics (23)
  • PhotoVoltaics (2)
  • Product Safety (20)
  • Reliability (33)
  • Robotics and Automation (15)
  • Semiconductors (1,823)
  • Signal Processing (130)
  • Vehicular Technology (8)
  • Women in Engineering (6)
  • Young Professionals (1)
  •  

    Support our advertisers:

    Visit our
    GRID MARKETPLACE

    Enabling Javascript allows us to show you upcoming conferences in this column.

    For the Firefox browser, select Tools/Options/Content and select "Enable Javascript".

    If you are using Microsoft Internet Explorer you may need to click on the yellow bar above and select 'Allow Blocked Content'. You must then click 'Yes' on the following security warning.

    archives:

    September 2017
    S M T W T F S
    « Aug    
     12
    3456789
    10111213141516
    17181920212223
    24252627282930

    View in Google Calendar

    search blog:


    SUBSCRIBE: Get the e-GRID twice a month by email - upcoming IEEE SF Bay Area meetings, conferences.

    RSS Feed Subscribe to our RSS Feed.

    PUBLICIZE your event to IEEE's membership.


    general links:

    24 queries. 0.734 seconds