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Technology & Networking in Silicon Valley & the SF Bay Area: Upcoming Meetings, Courses and Conferences

May 11, 2009

Mtg: License to Speed: Extreme-Bandwidth Packaging (plus tour)

by @ 3:56 pm. Filed under ALL, Communications, Computers/Software, Electronics Design, Optics/Displays, Semiconductors

THURSDAY June 25, 2009
SCV Components, Packaging and Manufacturing Technology Chapter, with EMC Chapter
Speaker: Sean Cahill, VP-Technology, BridgeWave Communications
Time: Pizza/drinks at 11:30 AM; Presentation at 12:00 noon; tours from 12:45 – 1:15 PM
Cost: none (includes pizza/drinks and tour)
Place: Bridgewave, 3350 Thomas Road (about two blocks from the Biltmore Hotel), Santa Clara
RSVP: via the DoubleKnot registration page, from website; limited to first 50

As device operating frequencies increase, packaging engineers look to interconnection methods that provide better signal transmission properties for high-volume applications.? Next-generation interconnect approaches such as wireless (more…)

Seminar: Energy Efficiency â?? Green Design Considerations

by @ 6:15 am. Filed under Electrical/Power, Electronics Design

FRIDAY May 15, 2009
SF Industry Applications Chapter
Speakers: Seven topical experts
Time: Breakfast at 8:00 AM; seminar from 8:45 AM – 4:40 PM
Cost: $225 (discount for multiples from same company)
Place: Marriott Hotel, Pleasanton
RSVP: see web link for flyer

Mtg: SmartGrid Evolution and the Role Standards will Play

by @ 6:14 am. Filed under ALL, Electrical/Power, Engineering Mgmt

THURSDAY May 14, 2009
SF Power & Energy
Speaker: Chris Knudsen, Director, Technology Innovation Center, PG&E
Time: Presentation at Noon
Cost: none
Place: Pacific Gas & Electric Office, 77 Beale St., Room 305, San Francisco
RSVP: by May 11 by email to John Joven, JRJJ@PGE.COM, 415-973-4873

The Obama administration is intending to invest close to 45 billion dollars to address renewable energy and a future “Smart Energy Grid” that will reduce our dependence on foreign oil.? An automated, widely distributed energy delivery (more…)

Mtg: Problems and Challenges in Robotic Relay Networks

by @ 6:13 am. Filed under ALL, Communications, Electronics Design, Optics/Displays, Semiconductors

THURSDAY May 14, 2009
SCV Robotics and Automation Chapter
Speaker: Dr. Ying Zhang, Palo Alto Research Center (PARC)
Time: Presentation at 7:00 PM
Cost: none
Place: Carnegie Mellon Silicon Valley, NASA Research Park, Bldg. 23, Moffett Field
RSVP: not required

LANdroids is a DARPA (Defense Advanced Research Program Agency) funded project.? The goal is to create small, inexpensive, smart robotic relay nodes that autonomously establish and manage mesh networks when deployed in a (more…)

Mtg: 3G and 4G Semiconductor Evolution: Mobile WiMAX, LTE, other 4G Technologies

by @ 6:12 am. Filed under ALL, Communications, Engineering Mgmt, Semiconductors

WEDNESDAY May 13, 2009
SCV Communications Chapter
Speakers: Ambroise Popper, Sequans Communications; Alex Sum, GCT Semi; Raj Singh, WaveSat; Lars Johnsson, Beceem
Time: Pizza and networking at 6:00 PM; Presentations at 6:30 PM
Cost: none
Place: National Semiconductor, Building E, Conference Room, 2900 Semiconductor Dr, Santa Clara
RSVP: not required

Fourth Generation (4G) broadband wireless technology offers a significant benefit to existing wireless networks and users.? The emergence of multiple standards along with innovative devices and business models will require (more…)

Mtg: Through-Silicon Vias (TSVs): Design and Reliability

by @ 6:11 am. Filed under ALL, Electronics Design, Engineering Mgmt, Optics/Displays, Semiconductors

WEDNESDAY May 13, 2009
SCV Components, Packaging & Manufacturing Technology, with Electron Devices, Circuis & Systems, Reliability Chapters
Speaker: Sergey Savastiouk, ALLVIA, Inc.
Time: Optional dinner at 6:30 PM; Presentation at 7:30 PM
Cost: $25 if reserved by May 11; $30 at door (no cost for presentation)
Place: Biltmore Hotel, 2151 Laurelwood Rd (Fwy 101 at Montague Expressway), Santa Clara
RSVP: via the DoubleKnot registration page, from website

Thinned wafers with through-silicon isolated metal vias (TSVs) open a valuable new design opportunity for both IC and package engineers.? Through-silicon metal connectivity enables electrical and thermal performance advantages, back-side (more…)

Mtg: Power and Variability: Challenges and Solutions

by @ 6:10 am. Filed under ALL, Electronics Design, Semiconductors

TUESDAY May 12, 2009
SCV Electron Devices Chapter
Speaker: Dr. Subramanian “Shiva” Ramesh, GreenSys Technologies
Time: Social/pizza at 6:00 PM, Presentation at 6:15 PM
Cost: none
Place: National Semiconductor, Building E1, Conference Center, 2900 Semiconductor Dr, Santa Clara
RSVP: not required

Using his extensive industry knowledge and experience, Dr. Ramesh will discuss the? power and variability challenges facing the industry and some of the approaches to quantitatively understand and solve the problems.? The original (more…)

Mtg: Green Power & the Modern Grid

by @ 6:09 am. Filed under ALL, Electrical/Power, Electronics Design

TUESDAY May 12, 2009
SCV Electromagnetic Compatibility Chapter
Speaker: Jerry Ramie, ARC Technical Resources, Inc.
Time: Social at 5:30 PM, Presentation at 6:30 PM
Cost: none
Place: Applied Materials Bowers Café, 3090 Bowers Ave., Santa Clara
RSVP: not required

The existing power grid is aging, overloaded, unstable and incapable of meeting the power quality needs of an Information Economy.? This fast-moving overview of the modern grid â?? and renewable energy’s place in it â?? details the (more…)

Mtg: It’s a New Economy – Get a New Perspective on Your Finances

by @ 6:08 am. Filed under ALL, BioEngineering, Communications, Electrical/Power, Electronics Design

TUESDAY May 12, 2009
SF Grads of the Last Decade (GOLD)
Speaker: Kathie Chappell, CRPC, Ameriprise Financial
Time: Pizza/drinks and Presentation at 6:30 PM
Cost: none
Place: Ameriprise Financial, 180 Montgomery St. Suite 1700 (17th floor), San Francisco
RSVP: by email to Frank Oppong,

Like many people today, you may be concerned about the safety of your money and protecting the life youâ??ve made.? You need a fresh look at your financial picture so you can make the decisions that are right for you.
All IEEE members (more…)

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