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January 8, 2011

Mtg: Putting Thin Copper on Flexible Materials

by @ 8:27 am. Filed under ALL, Electronics Design, Engineering Mgmt, Semiconductors
 

WEDNESDAY January 12, 2011
SCV Components, Packaging and Manufacturing Technology Chapter
Speaker: Alex N. Beavers, Jr., Ph.D., Executive Director, Ventures and Licenses, SRI International
Time: Networking and buffet dinner at 6:00 PM; Presentation at 6:45 PM
Cost: $20; $10 for fulltime students and currently unemployed; $5 more at door
Place: Biltmore Hotel, 2151 Laurelwood Rd (Fwy 101 at Montague Expressway), Santa Clara
RSVP: from website, by Jan. 10
Web: www.cpmt.org/scv

A novel approach for metalizing patterns and entire surfaces of flexible substrates is being commercialized by Averatek Corporation.? Emerging from the labs of SRI International (formerly Stanford Research Institute), this new (more…)

Mtg: HEMP, IEMI and Severe Geomagnetic Storm Effects on Critical Infrastructures

by @ 8:26 am. Filed under ALL, Communications, Electrical/Power
 

TUESDAY January 11, 2011
SCV Electromagnetic Compatibility Chapter
Speaker: Dr. William A. Radasky, President and Managing Engineer, Metatech Corporation; IEEE Fellow, P.E.
Time: Light dinner (fee) at 5:30 PM; Presentation at 6:30 PM
Cost: Yes
Place: Applied Materials Bowers Cafeteria, 3090 Bowers Ave., Santa Clara
RSVP: not required
Web: ewh.ieee.org/r6/scv/emc

Over the past 10 years there has been a growing awareness that the threat of high-altitude electromagnetic pulse (HEMP) from a nuclear detonation could be devastating to the commercial infrastructures of the (more…)

Mtg: Mechanical Computing Redux: Relays for Integrated Circuit Applications

by @ 8:25 am. Filed under ALL, Computers/Software, Electronics Design, Semiconductors
 

TUESDAY January 11, 2011
SCV Electron Devices Chapter
Speaker: Prof. Tsu-Jae King Liu, Dept. of EECS, UC Berkeley
Time: Pizza at 6:00 PM; Presentation at 6:15 PM
Cost: none
Place: National Semiconductor, Building E-1, Conference Center, 2900 Semiconductor Drive, Santa Clara
RSVP: not required
Web: www.ewh.ieee.org/r6/scv/eds

Power density has grown to be the dominant challenge for continued CMOS technology scaling.? As a result, there has been renewed interest in mechanical computing, particularly for very-low-power (more…)

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