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April 2, 2012

Mtg: New Drivers and Strategies for Multi-Die Packaging

by @ 6:31 pm. Filed under ALL, Electronics Design, Engineering Mgmt, Semiconductors
 

WEDNESDAY June 13, 2012
SCV Components, Packaging and Manufacturing Technology Chapter
Speaker: Ivor Barber, Director, Package Design and Characterization, LSI Corporation
Time: Buffet dinner at 6:00 PM, Presentation at 6:45 PM
Cost: $20 if reserved by June 11; $10 for fulltime students and currently unemployed engineers; $5 more at the door
Place: Biltmore Hotel, 2151 Laurelwood Rd (Fwy 101 at Montague Expressway), Santa Clara
RSVP: from website
Web: www.cpmt.org/scv/meetings/cpmt1206.html

Several forces are driving a resurgence of interest in Multi-Die Packaging.? While foundries hit increasing NRE, product cost and technical barriers, the Packaging Community has produced a plethora of Multi-Die solutions (more…)

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