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Technology & Networking in Silicon Valley & the SF Bay Area: Upcoming Meetings, Courses and Conferences

April 13, 2013

Energy Conversion Engineering Conference (IECEC)

by @ 7:36 pm. Filed under ALL, Electrical/Power, Electronics Design, Engineering Mgmt
 

AIAA 11th International
Energy Conversion Engineering Conference (IECEC) 
— July 15-17, 2013     — San Jose Convention Center
A forum to present engineering aspects of energy conversion technology, and advanced energy and power systems,
Sessions:   – Sustainable Energy Solutions   – Energy Storage   – Wind Energy   – Cooling   – Sustainable Energy Conversion Systems     – Heating and Cooling of Buildings   – Stirling System Components, Testing   – Hybrid Power Systems   – Energy Harvesting   – Spacecraft Solar Power & Solar Array Designs   – Energetic Devices and Materials   – Spacecraft Power Systems and Electronics Design   – Hollow Cathodes   – Thermoelectric Devices and Systems   … and more.     In conjunction with AIAA 49th Joint Propulsion Conference and Expo.     Save $100, through June 17th.   Information: www.aiaa.org/EventDetail.aspx?id=16855

Seminar: Emerging Nano-Bio & Nano-Ionic Technologies and Applications

by @ 7:36 pm. Filed under ALL, NanoEngineering
 

One-Day Nanotechnology Chapter Symposium
Emerging Nano-Bio & Nano-Ionic Technologies and Applications
– Wed, May 15, 2013, 8:30 AM – 4:30 PM   – at TI, Santa Clara
– $50 IEEE members; $65 non-members; $35 students (higher after May 10)
10 talks from IBM Almaden, Rambus Labs, University of Michigan, Adesto, ONE Nanotechnologies, Graphene Technologies, Lux Research and more. Includes breakfast and lunch.
For further information: www.ieee.org/nano

IEEE Radio Frequency Integrated Circuits (RFIC) Symposium

by @ 7:34 pm. Filed under ALL, Communications, Electronics Design, Semiconductors
 

IEEE Radio Frequency Integrated Circuits (RFIC) Symposium
— June 2-4, 2013     — Seattle Convention Center
Sunday and Monday Workshops, including:   – High Efficiency Supply-Modulated RF Power Amplifier   – Radio Frequency Systems for Indoor Localization   – Interference Robust Radio Receiver Techniques   – RF-Assisted Medicine   – Near Field Communication (NFC)   – Software-Defined-Radio Frequency Transmitters   – Technologies for THZ Integrated Systems     Technical Sessions, including   – Low-Power Pulse-Based Radios   – Low-Power Transceivers for Wireless Applications   – Advances in RF Data Converter Circuits   – High-Speed Data Transceiver Circuits   – Millimeter and Sub-Millimeter Wave Transceivers
Save through May 6. Full program and registration details on the website: www.rfic-ieee.org

Seminar: Social Network Analysis: It’s Who You Know

by @ 7:33 pm. Filed under ALL, Communications, Engineering Mgmt
 

New Frontiers in Computing (NFIC) Conference
Social Network Analysis: It’s Who You Know 
— Saturday, May 11, 2013     — Braun Auditorium, Stanford
— Panels, Discussions     — $25 IEEE members, $20 students, $50 others
Panels:   “Extracting Meaning and Dynamics from Social Network Data” (Ian Hersey, Shivakumar Vaithyanathan, Michael Wu, Rong Yan);   “Social Computing Languages and Tools” (Zahan Malkani, Shivakuma Vaithyanathan);   “Privacy Implications of Social Network Analysis” (Laura Jacob, John Rehling).     Speakers from Facebook, Attensity, IBM Almaden, reputation.com, Lithium, plus IEEE-SSIT.
Register by April 11, for best pricing: www.nfic-us.org

IEEE Educational Activities Award Nominations

by @ 7:29 pm. Filed under ALL, Electronics Design
 

3D immersive, lifelike, interactive technologies
IEEE Educational Activities Award Nominations
– Nomination Submission Deadline May 15, 2013
Nominations are now being accepted. Help find eligible candidates for these prestigious awards supported by the IEEE Educational Activities Board.   – Meritorious Achievement Award in Accreditation Activities   – Meritorious Achievement Award in Continuing Education   – Meritorious Achievement Award in Informal Education   – Major Educational Innovation Award   – Pre-University Educator Award   – Meritorious Service Citation   – Standards Education Award   – Employer Professional Development Award   – Society/Council Professional Development Award   – Section Professional Development Award
Descriptions for each of the awards and the applicable nomination forms are found at the following site: www.ieee.org/eab-awards

Mtg: Magneto-Optic Analysis of Magnetic Microstructures

by @ 8:27 am. Filed under ALL, Computers/Software, NanoEngineering
 

WEDNESDAY May 29, 2013
OEB Magnetics Chapter
Speaker:Rudolf Schaefer, Leibniz Institute for Solid State and Materials Research, Dresden
Time: Presentation at 3:00 PM
Cost: none
Place: Lawrence Berkeley Natl Lab, Berkeley
RSVP: by May 27 with name, company to Peter Fischer, peter.fischer@ieee.org
Web: ewh.ieee.org/r6/oeb/mag

The rich world of magnetic microstructure or magnetic domains, extending from visible dimensions down to the nano-scale, forms the mesoscopic link between the fundamental physical properties of a magnetic material and its macroscopic properties and technical (more…)

Mtg: 3D Printing – Prototype to Pilot Line in Your Office

by @ 8:25 am. Filed under ALL, Electronics Design, Engineering Mgmt, NanoEngineering
 

TUESDAY May 28, 2013
SCV Consumer Electronics Chapter
Speaker: Erick P. Wolf, President, Airwolf 3D
Time: Networking and food at 6:30 PM; Presentation at 7:00 PM
Cost: none
Place: Microsoft Silicon Valley, 1085 La Avenida St., Mountain View
RSVP: from website
Web: www.ieee.org/scvce

The availability of the desktop and office located 3D printer has revolutionized the prototyping and pilot line worlds. We will present the capabilities and tradeoff of the the different materials that can be used in 3D printers, and uses in prototypes, mechanical samples, 3D (more…)

Tour of SIEMIC Test Labs

by @ 8:23 am. Filed under ALL, Electronics Design, Engineering Mgmt
 

TUESDAY May 28, 2013
SCV Product Safety Engineering Chapter
Time: Gathering at 6:00 PM; tour and talks following
Cost: none
Place: SIEMIC Labs, 775 Montague Expressway, Milpitas
RSVP: from website
Web: www.ewh.ieee.org/r6/scv/pses
Letâ??s join our friends at SIEMIC in their newly renovated facility to help them celebrated their 10th Anniversary in business. Free gift bags from SIEMIC for all that attend this meeting!    Brief presentation from some of the Staff at SIEMIC as well as a tour of their (more…)

Mtg: Modern Instantaneous Selectivity, The Code, Arc Flash and System Reliability

by @ 8:22 am. Filed under ALL, Electrical/Power
 

TUESDAY May 28, 2013
SF Industry Applications Chapter
Speaker: Marcelo E. Valdez, GE Energy Industrial Solutions
Time: Networking and social at 5:30 PM; Presentation at 6:00 PM; Dinner at 7:00 PM
Cost: $25 (at the door); $10 for IEEE student members
Place: Sinbad’s Restaurant, Pier 2 The Embarcadero, San Francisco
RSVP: by email to Brandon Yee, byee@yeiengineers.com for reservations and to qualify for the drawing.
Web: www.e-grid.net/docs/1305-sf-ias.pdf

Designing safe and reliable electrical distribution systems consistent with the mission of the system and conscious of budgetary and schedule limitations has always been the intent of the good electrical systems designer.  However, in recent years, increasing focus (more…)

Mtg: Cognitive Memory: Human Memory, Machine Memory

by @ 8:21 am. Filed under ALL, Computers/Software, Engineering Mgmt
 

THURSDAY May 23, 2013
SCV Education Chapter
Speaker: Dr. Bernard Widrow, Professor of Electrical Engineering, Stanford University
Time: Presentation at 7:00 PM
Cost: none
Place: Stanford University, Packard Bldg, Stanford
RSVP: not required
Web: www.ewh.ieee.org/r6/scv/es

Regarding the workings of the human mind, memory and pattern recognition seem to be intertwined.  You generally do not have one without the other.  Taking inspiration from life experience, a new form of computer memory has been devised. Certain conjectures about (more…)

Mtg: Patenting Antennas and Wireless Technology

by @ 8:20 am. Filed under ALL, Communications, Electronics Design, Engineering Mgmt
 

THURSDAY May 23, 2013
SCV Antennas and Propagation Chapter
Speaker: Steve Bachmann, Intellectual Property, Lewis Roca LLP
Time: Networking and food at 6:30 PM; Presentation at 7:00 PM
Cost: none
Place: Cogswell College, 1175 Bordeaux Drive, Sunnyvale
RSVP: not required
Web: sites.ieee.org/scv-aps

A look at the top issues to consider when attempting to obtain patent protection for antennas and other wireless technologies.  Points covered will include the do’s and don’ts for antenna patents and antenna patenting strategies.  Tips for protecting everything from (more…)

Mtg: Adapting Failure Modes and Effects Analysis (FMEA) to Select Hazard Mitigation Measures

by @ 8:19 am. Filed under ALL, Electrical/Power
 

THURSDAY May 23, 2013
OEB Industry Applications Chapter
Speaker: Marcelo E. Valdez, GE Energy Industrial Solutions
Time: Networking at 5:30 PM; Presentation at 6:15 PM; Dinner at 7:15 PM; Presentation continues at 8:00 PM
Cost: $25 for IEEE members; $30 for non-members; $15 for student and retired members
Place: Zio Fraedos, 611 Gregory Lane, Pleasant Hill
RSVP: by May 20 to Michael Nakamura, michael@mkireps.com (925) 330-6595
Web: www.e-grid.net/docs/1305-oeb-ias.pdf

FMEA is a common analytical tool used in product development, manufacturing and operations management to understand potential failure modes inclusive of the severity and likelihood of those failures.  FMEA helps a practitioner identify potential (more…)

Mtg: A Comparison of Low-Cost Interposer Technologies

by @ 8:15 am. Filed under ALL, Electronics Design, Semiconductors
 

THURSDAY May 23, 2013
SCV Components, Packaging and Manufacturing Technology  Chapter
Speaker: Terry Kang, Sr. Packaging Development Manager, Nvidia
Time: Networking and lunch at 11:30 AM; Presentation at 12:15 PM
Cost: $15 for lunch ($5 for students, unemployed); no cost for presentation
Place: Biltmore Hotel, 2151 Laurelwood Rd, Santa Clara
RSVP: from website
Web: www.cpmt.org/scv/meetings/cpmt1305l.html

The 2.5D through-silicon-via interposer is the key enabling technology for integrating multi-functional dies to achieve higher electrical performance and smaller package form factors.  One of the key challenges for high-volume production is high cost.  This (more…)

Webinar: Programming Heterogeneous X64+GPU Systems Using OpenACC

by @ 8:14 am. Filed under ALL, Computers/Software
 

THURSDAY May 23, 2013
Computer Society
Speaker: Dr. Michael Wolfe, compiler engineer, The Portland Group
Time: Webinar at 11:00 AM (PDT)
Cost: none
Place: on the Internet
RSVP: from website
Web: news.computer.org/ef1/preview_campaign.php?lf1=393430761f200716059669a7848176

Mtg: The Real Reasons We Must Have a Smart Grid for the 21st Century

by @ 8:12 am. Filed under ALL, Communications, Electrical/Power
 

WEDNESDAY May 22, 2013
SF Power & Energy Chapter
Speaker: Merwin Brown, PhD, Co-Director, Electric Grid Research, California Institute for Energy and Environment, University of California
Time: Networking and dinner at 6:00 PM; Presentation following
Cost: IEEE members $25; Non-members $35; Students $15 ($5 more after May 8)
Place: Sinbad’s Pier 2 Restaurant, Embarcadero, San Francisco
RSVP: by May 15 to Charles Mee, charles.mee@cpuc.ca.gov Phone: 415-703-1147
Web: www.e-grid.net/docs/1305-sf-pes.pdf

Attempts to sell the smart grid to electricity consumers and taxpayers have understandably leaned toward promoting the â??carrotâ? of customer-side applications and their benefits, the â??stickâ? being a mandate.  Unfortunately, these promised benefits, while valuable, are (more…)

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