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Technology & Networking in Silicon Valley & the SF Bay Area: Upcoming Meetings, Courses and Conferences

June 26, 2013

Flash Memory Summit

by @ 7:13 am. Filed under ALL, Communications, Computers/Software, Electronics Design, Engineering Mgmt, Semiconductors
 

8th Annual Flash Memory Summit
– August 13-15, 2013   – Santa Clara Convention Center
– Tutorials   – Exhibits   – Keynotes   – Sessions
This power-packed 3-day event covers the latest topics in flash memory — flash in embedded systems, laptop/tablet design, flash in enterprise storage systems, green flash, solid state drives, flash performance, flash-based design, flash in computers, mobile applications, software, new non-volatile memory technologies, reliability, security, and much more!
Pre-conference Seminars and Tutorials:   – Intro to SSDs   – Intro to NVM Express   – Creating Storage-Class Persistent Memory   – Universal Flash Storage … and more.
Save $100 – use Priority Code “IEEE”.   Earlybird rates through August 11th.   Visit the website: www.flashmemorysummit.com

Mtg: Low-Power Design Essentials

by @ 7:11 am. Filed under ALL, Electronics Design, Semiconductors
 

IEEE-SCV-PACE Evening Short Course
Low-Power Design Essentials
– Monday, July 15, 2013     – Maxim, San Jose
This 3-hour short course presents an overview of the basics and advanced techniques in low-power design: fundamentals of low-power design and well-established techniques; recent trends and applications;techniques to reduce energy even more aggressively over the next decade. For full information, visit the website: pace-course2013.eventbrite.com

Conf on Packaging and Integration of Electronic and Photonic MicroSystems

by @ 7:09 am. Filed under ALL, Electronics Design, Semiconductors
 

ASME InterPACK 2013
Conference and Exhibition on Packaging and Integration of Electronic and Photonic MicroSystems
– July 16-18, 2013     – Hyatt Regency, San Francisco Airport
Focus of InterPACK:   � Advanced Packaging   � Electro-Thermal-Mechanical Issues in Packaging (Multi-Physics)   � Materials and Processes   � MEMS and MEMS Packaging   � Manufacturing and Test   � Modeling and Simulation   � Nanotechnology and NEMS   � Photonics and Optics   � Reliability   � Thermal Management   � Emerging Technologies
IEEE Members get the ASME rates.   For full information, visit the website: www.asmeconferences.org/InterPACK13

Besser Associates Summer/Fall Classes (RF, Wireless)

by @ 7:03 am. Filed under ALL, Communications, Electronics Design
 

The worldwide leader in RF and Wireless Training
Besser Associates Summer/Fall Classes
Headquartered in Mountain View since 1985, we have delivered theory with hands-on practical training to professionals working with analog, RF, wireless, digital, and networking technologies — to over 45,000 people. Get more information on these upcoming local courses:
Applied RF Techniques I (Aug 12-Aug 16)   –DSP: Understanding Digital Signal Processing (Aug 12-Aug 14)   –Practical Digital Wireless Signals: Measurements and Characteristics (Aug 12-Aug 16)   –Behavioural Modeling & Digital Pre-Distortion of RF Power Amplifiers (Aug 12-Aug 14)   –Intro to Data Converters (Aug 15-Aug 16)   –Power Conversion & Regulation Circuits for VLSI Systems (Aug 19-Aug 22)
For these and other classes, or customized/private courses at your facility, download our Schedule/Flyer (PDF) or visit the website: www.besserassociates.com

Position: Program Director of Engineering & Technology

by @ 7:02 am. Filed under ALL, Communications, Computers/Software, Electronics Design, Semiconductors
 

UC Berkeley Extension POSITION ANNOUNCEMENT
Program Director of Engineering & Technology
— Salary: $65,736 – $79,176     — Closing Date: July 8, 2013
UC Berkeley Extension’s Dept. of Engineering and Technology manages courses, contracts and curricula serving 2300 enrollments in 200 programs/courses. You will provide academic leadership and fiscal management, be responsible for academic quality, develop new courses and curricula, and do strategic planning.   Requires a graduate degree in Engineering, Information Systems or Technology or the equivalent; at least 3 years of recent experience; excellent organizational skills; and ability to form successful relations with instructors.
For full details and submission information, download our description: extension.berkeley.edu/work/pdf/ce2-ET.pdf (PDF).

PICMET/SV: Management of Engineering and Technology

by @ 7:01 am. Filed under ALL, Engineering Mgmt
 

Theme: “Technology Management in the IT-Driven Services”
PICMET/SV: Management of Engineering and Technology
— July 28 – Aug 1, 2013     — Marriott Hotel, San Jose
This high-impact conference sets the stage for technology management for decades to come.
Short Courses:   – Organizational Project Management in Practice   – New Trends and Practices in Silicon Valley’s Innovation System   – A Brief Introduction to Social Network Analyses, with Examples in the Study of Innovation   – Entrepreneurship and Innovation: Some Basic Concepts   – Global Business Incubation and Development for Technology Startups   – Total System Innovation Management
Plus 9 Keynote speakers, sessions, panels, social events.   Discount of 20% for 5 or more;   IEEE Members save $300.   Visit our website for details: www.picmet.org

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