IEEE S.F. Bay Area Council e-GRID's

Technology & Networking in Silicon Valley & the SF Bay Area: Upcoming Meetings, Courses and Conferences

November 30, 2013

SCV-EMC: High-Speed Serial Link Design

by @ 2:11 pm. Filed under ALL, Communications, Electronics Design, Semiconductors

TUESDAY December 10, 2013
SCV Electromagnetic Compatibility
Subject: High-Speed Serial Link Design
Speaker: Joseph C. (Jay) Diepenbrock, Lorom America
Time: Networking and light dinner (small fee) at 5:30 PM; Presentation at 6:30 PM
Cost: none, for talk
Place: Agilent Technologies, Bldg. 5L, 5301 Stevens Creek Blvd, Santa Clara
RSVP: not required

This presentation discusses some of the key electrical properties that affect the performance of high speed serial channels and what affects them.  It covers insertion and return loss, loss mechanisms, and the influences of various packaging (more…)


November 25, 2013

Mtg: Life at the Intersection of the Smart Phone, Social Computing & Gamification: Loosing Weight

by @ 6:05 pm. Filed under ALL, BioEngineering, Communications, Computers/Software, Electrical/Power, Electronics Design, Engineering Mgmt

MONDAY December 9, 2013
SCV Circuits and Systems Chapter
Speaker: Jonathan David, Qualcomm, Inc.
Time: Networking and light dinner at 6:30 PM; Presentation at 7:00 PM
Cost: none
Place: QualComm, Building B, 3165 Kifer Road, Santa Clara
RSVP: from website

There is really no secret to how to lose weight: eat fewer calories and exercise more.  However, many of us find that actually making ourselves do this is quite difficult.  Using a variation on the methods documented in â??the Game-On Dietâ?, weight (more…)


Mtg: SocialMesh: Can Networks of Meshed Smartphones Ensure Public Access to Twitter During an Attack?

by @ 5:48 pm. Filed under Communications, Computers/Software

WEDNESDAY December 11, 2013
SCV Communications Chapter
Speaker: Devabhaktuni Srikrishna, founder and former CTO, Tropos Networks
Time: Networking and refreshments at 6:30 PM; Presentation at 7:00 PM
Cost: Refreshments are $5; no cost for presentation
Place: TI Building E Conference Center, 2900 Semiconductor Dr, Santa Clara
RSVP: from website

We explore whether public data networks called SocialMesh — formed automatically from smartphone radio-routers and adapting to changing RF propagation and interference without relying on managed cellular infrastructure — can also be (more…)


Mtg: Total System Innovation Management: An Overview with Applications to Ideation and Services

by @ 4:45 pm. Filed under ALL, Engineering Mgmt

THURSDAY December 5, 2013
SCV Technology Management Chapter
Speaker: Dr. Oliver Yu, President, STARS Group & Executive in Residence, College of Business, San Jose State University
Time: Networking and Forum at 6:00 PM; dinner at 7:00 PM; Presentation at 7:30 PM
Cost: $11 for IEEE members; $14 for non-members
Place: Ramada Silicon Valley, 1217 Wildwood Ave, Sunnyvale
RSVP: from website

This presentation will introduce the concept of Total-System Innovation Management, which emphasizes both a total-system perspective of the innovation management process and a disciplined systematic approach to the development (more…)


Mtg: HTML5: Programming the Compute Continuum

by @ 4:29 pm. Filed under ALL, Communications, Computers/Software, Engineering Mgmt

TUESDAY January 7, 2014
SCV Consultants’ Network of Silicon Valley
Speaker: Heidi Pan, Software and Services Group, Intel
Time: 7:00 PM
Cost: none
Place: Agilent Technologies, 5301 Stevens Creek Blvd., Santa Clara
RSVP: not required

HTML5 is emerging as a compelling programming platform by providing rich OS-like features, high developer productivity and cross-platform reach.  We are at an inflection point today, where the performance and feature advances in (more…)


November 18, 2013

3D Architectures for Semiconductor Integration & Packaging

by @ 9:40 am. Filed under ALL, Communications, Electronics Design, Engineering Mgmt, Semiconductors

Technology for Emerging Device and Systems Integration & Interconnect
3D Architectures for Semiconductor Integration & Packaging     – December 11-13, 2013   – Hyatt Regency SFO, Burlingame
3-D integration and packaging represents a paradigm shift for the semiconductor industry, opening entirely new pathways for performance advancement and new prospects for industry growth.     Focus:   – Market Impacts and Analysis   – End-user Perspectives   – 3-D Integration & Packaging Technologies   – Design Methodology and Tools   – Mfg Issues and Solutions     Sessions on:   – Emerging Pathways in Heterogeneous 3D   – Options for Memory-Logic Integration   – Interposers   – Thermal Challenges, Solutions, Impact   – Thin Wafer Handling and Direct Bonding   – Advances in 2.5D/3D Design and Test   … and more.
Reduced Fees through October 31 — save $150.   Visit .


Mtg: Remote Ground Fault Protection Issues

by @ 9:26 am. Filed under ALL, Electrical/Power

TUESDAY November 19, 2013
SF Industry Applications Chapter
Speaker: Sergio Panetta, Vice President of Engineering, I-Gard Corporation
Time: Networking and relaxation at 5:30 PM, Presentation at 6:00 PM, Dinner at 7:00 PM
Cost: $25 ($10 for IEEE Student members)
Place: Sinbad’s Restaurant, Pier 2 The Embarcadero, San Francisco
RSVP: Please email Byron Lee, for reservations and to qualify for the drawing

Power continuity is essential in wind power projects where a trip-out due to ground fault can have serious economic or operational consequences.  An arcing phase-to-ground fault can totally destroy the equipment.  Consequential downtime adds to (more…)


November 17, 2013

Mftg: Sign-based Zero-Forcing Adaptive Equalizer Control for High-Speed I/O

by @ 8:20 pm. Filed under ALL, Electronics Design, Semiconductors

MONDAY November 18, 2013
SCV Circuits and Systems Chapter
Speaker: Dr. Yasuo Hidaka, Fujitsu Laboratories of America
Time: Networking/Light Dinner at 6:30 PM; Presentation at 7:00 PM
Cost: $2 donation accepted for food
Place: QualComm, Building B, 3165 Kifer Road, Santa Clara
RSVP: from website

Equalizers are often used for wireline transceivers to cancel Inter-Symbol Interference (ISI) caused by frequency-dependent channel loss.  Adaptation of equalizer parameters is desired, because channel characteristics are generally unknown.  Least (more…)


Mtg: Benefits and Implementation of Modular Data Centers

by @ 5:02 pm. Filed under ALL, Communications, Electrical/Power, Electronics Design, Engineering Mgmt

WEDNESDAY November 20, 2013
SCV Power & Energy and Industry Applications Chapter
Speaker: James Alvers, Data Center Design Engineer, Hewlett Packard
Time: Dinner and networking at 6:00 PM; Presentation at 7:00 PM
Cost: $30 IEEE members, $40 non members ($5 more at door)
Place: Biltmore Hotel, 2151 Laurelwood Road, Santa Clara
RSVP: from the website

Information technology today is a world whose watchwords are volume, variety and velocity. We are awash in data from Facebook, Twitter, IMâ??s, internet searches, emails, video or mobile devices, etc. and updates are (more…)


Fall Symposium: Nanoengineered Biomedical Devices

by @ 4:46 pm. Filed under ALL, BioEngineering, NanoEngineering, Optics/Displays

TUESDAY November 19, 2013
SCV Nanotechnology Chapter
Speakers: Prof. Demir Akin, Stanford ; Prof. David Deamer, UC Santa Cruz; Prof. Erkin Seker, UC Davis; Dr. Adam Seger, MagArray, Inc.; Dr. Mehdi Javanmard, Stanford; Dr. Dominik Ziegler, LBNL; Dr. Tom Peyser, Dexcom
Time: 9:00 AM – 4:00 PM
Cost: IEEE Members: $30, Non-members:$40, Students/unemployed: $20 ($10 more, at door)
Place: TI Auditorium E-1, 2900 Semiconductor Drive, Santa Clara
RSVP: from website

Join colleagues from industry and academia to learn from speakers at the frontier of nanotechnology  enabled medical devices, diagnostics, and medical research. SPEAKERS/TOPICS:   (more…)


Mtg: Ground Fault Current Protection of a 480Y/277V Power System – Compliance with NEC Design Requirements

by @ 4:20 pm. Filed under ALL, Electrical/Power

THURSDAY November 21, 2013
OEB Power & Energy, with Industry Applications chapters
Speaker: Dev Paul, AECOM, Inc.
Time: Networking at 5:30 PM, Presentation at 6:15 PM; Dinner at 7:15 PM; Presentation continues at 8:00 PM
Cost: $25 for IEEE members, $30 for non-members, $15 for student and retired members
Place: Zio Fraedos, 611 Gregory Lane, Pleasant Hill
RSVP: by November 18 to Michael Nakamura,, 925-330-6595

Dev Paul will discuss his IEEE/PCIC 2013 Conference paper that he presented as the main author.  This paper is based upon an actual design of port facility buildings that required installation of solar power to meet the portâ??s green energy (more…)


Webinar: Mobile Backhaul for Small Cells

by @ 3:20 pm. Filed under ALL, Communications, Electronics Design

WEDNESDAY November 20, 2013
Communications Society
Speakers: Stefano Ruffini, R&D Expert, Ericsson, ITU-T Associate; Tim Pearson, Technology Strategist, Sprint, Principal MEF Representative
Time: 8:00 AM (PST)
Cost: none
Place: on the Internet
RSVP: from website

In order to maximize the mobile broadband end user experience, coordination between small cells and macro cells will be signaled across a mobile backhaul network. In this webinar we will discuss the challenges for integrating small (more…)


Mtg: Eastern Europe’s Semiconductor Technology – Recollections and Projections

by @ 2:40 pm. Filed under ALL, Electronics Design, Engineering Mgmt, Semiconductors

TUESDAY November 19, 2013
SCV Electron Devices Chapter
Speaker: Dr. Constantin Bulucea, IEEE Fellow, TI (retired)
Time: Networking and pizza at 6:00 PM, Presentation at 6:15 PM
Cost: none
Place: Texas Instruments Building E Conference Center, 2900 Semiconductor Dr., Santa Clara
RSVP: not required
Emerging from isolation in forced economic independence, the semiconductor industries in the Eastern block is seen as having recently gone through three decades of government-backed growth followed by economic (more…)


Mtg: Molten Salt and Thorium Nuclear Power (MSR)

by @ 12:30 pm. Filed under ALL, Electrical/Power, Engineering Mgmt

WEDNESDAY November 20, 2013
OEB Life Members Group
Speaker: Dr. Alexander Cannara, Cannara Consulting
Time: 6:00 PM
Cost: $15, includes buffet dinner
Place: Willow Tree Restaurant, 6513 Regional St, Dublin
RSVP: By Noon November 19, on website

Suppose someone told you there is a way of generating heat and electrical power on an industrial scale without the fuel emissions, nuclear materials, and waste we now produce, and do it for the whole world for thousands of years, using a (more…)


Printed Electronics USA Conference

by @ 9:43 am. Filed under ALL, Electronics Design, Engineering Mgmt, Optics/Displays, Semiconductors

The Application of Printed, Organic & Flexible Electronics
Tenth Annual
Printed Electronics USA Conference
– November 19-22, 2013   – Santa Clara Convention Center
Printed Electronics is one of the fastest growing technologies in the world — for use in places it has never been before, with new exciting form factors.   Over 100 world-class speakers cover components, materials and applications in the following areas:   – Printed Electronics Manufacturing   – Barrier Films   – OLED versus LED Lighting   – OLED Displays   – Graphene Energy Storage, Composites, Inks   – Flexible and Stretchable Electronics   – 3D Printing …   plus 16 Master Classes on Nov. 19, 22.   Co-located with OLEDs LIVE and Graphene LIVE — one registration includes all events. Earlybird rates through September 13.   Use code “IEEE-30” for a 30% discount.
For more information:


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