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Technology & Networking in Silicon Valley & the SF Bay Area: Upcoming Meetings, Courses and Conferences

May 14, 2014

Mtg: Inkjet Printing for Advanced Semiconductor Packaging, & Improved PoP Package Competes with 2.5/3D Packages using TSVs

by @ 2:22 pm. Filed under ALL, Communications, Computers/Software, Electronics Design, Engineering Mgmt, NanoEngineering, Semiconductors
 

WEDNESDAY June 11, 2014
SCV Components, Packaging and Manufacturing Technology Chapter
– materials, nanoparticles, die stacking, process, yield …
Speakers: Jake Sadie, Ph.D. Candidate, EECS, UC-Berkeley; and Dev Gupta, PhD, CTO, APSTL LLC
Time: Networking and buffet dinner at 6:00 PM; Presentation (no cost) at 6:45 PM
Cost: $30; $25 for IEEE members; $10 for full-time students and unemployed ($5 more at door)
Place: Biltmore Hotel, 2151 Laurelwood Rd, Santa Clara
RSVP: from website
Web: www.cpmt.org/scv/meetings/cpmt1405.html

As integrated circuits continue to scale and interest in new, thin form factors continues to grow, electrical interconnects and back-end-of-line (BEOL) packaging technologies are becoming an increasingly critical factor in overall chip (more…)

20140611scv

Mtg: Perspectives on Development and Commercialization of Early-Stage Distributed Energy Technologies

by @ 2:04 pm. Filed under ALL, Electrical/Power, Engineering Mgmt, NanoEngineering, Optics/Displays
 

WEDNESDAY June 11, 2014
SCV Photovoltaics Chapter
– ARPA-E, generation, storage, efficiency, reliability …
Speaker: Dr. John Tuttle, ARPA-e
Time: Networking and refreshments at 6:30 PM; Presentation at 7:00 PM
Cost: none
Place: Palo Alto Research Center (G.E. Pake Auditorium), 3333 Coyote Hill Road, Palo Alto
RSVP: not required
Web: www.ewh.ieee.org/r6/scv/pv

The Advanced Research Projects Agency-Energy (ARPA-E) advances high-potential, high-impact energy technologies that are too early for private-sector investment.  A significant portion of ARPA-e funding focuses on distributed energy resources (more…)

20140611scv

Webinar: Embracing Complexity: Products for a Hyperconnected World

by @ 7:38 am. Filed under ALL, Communications, Computers/Software, Engineering Mgmt
 

THURSDAY May 22, 2014
Computer Society
– webinar: agile methods, lean processes, automation, innovation …
Speakers: Erich Meier, chief architect, Method Park; and Bret Greenstein, VP Complex & Embedded Systems, IBM Rational Software
Time: 8:00 AM
Cost: none
Place: on the Internet
RSVP: from website
Web: www.computer.org/webinars

Hyperconnectivity is increasing digital interconnection between people and things — anytime and anyplace.  By 2020 there will be 50 billion networked devices.  Developing products for such an increasingly complex (more…)

20140522all

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