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August 13, 2014

IEEE Mtg: The “Invisible” IC Package

by @ 1:56 pm. Filed under ALL, Electronics Design, Semiconductors
 

THURSDAY September 25, 2014
SCV Components, Packaging and Manufacturing Technology Chapter
– chip-package-PCB design, form-factor, thermal, SI, cost …
Speaker: Sam Karikalan, Senior Manager of Package Engineering, Broadcom Corporation
Time: Networking and buffet lunch at 11:30 AM; Presentation (no cost) at 12:15 PM
Cost: $25 for IEEE Members, $30 for non-members, $10 for studens/unemployed
Place: Biltmore Hotel, 2151 Laurelwood Rd, Santa Clara
RSVP: from website
Web: www.cpmt.org/scv

The never-ending demand for improved electrical performance and cost reduction in IC packages has spawned many Chip-Package-PCB co-design innovations in the industry.  On the one end, need for higher memory bandwidth and (more…)

20140925scv

Mtg: Build Your Influence to Get Things Done

by @ 7:36 am. Filed under ALL, Engineering Mgmt
 

THURSDAY September 4, 2014
SCV Technology Management Chapter
– across teams, departments, disciplines, key pointers …
Speaker: Lucy Freedman, Syntax for Change
Time: Registration and networking at 6:00 PM; Mgmt Forum at 6:30 PM; Dinner at 7:00 PM; Presentation at 7:30 PM
Cost: $11 for IEEE members; $14 for non-members
Place: Ramada, 1217 Wildwood Ave, Sunnyvale
RSVP: from website
Web: www.ieee-scv-tmc.org

As a technical leader in a complex organization, you depend on a lot of people to get the crucial things done.  A huge part of your success comes from your ability to influence others, both within your team and across departments and (more…)

20140904scv

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