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December 2, 2014

Mtg: Tools for Thermal Analysis: Thermal Test Chips

by @ 8:12 am. Filed under ALL, Electronics Design, Semiconductors
 

Wednesday December 10, 2014
SCV Components, Packaging and Manufacturing Technology Chapter, with the MEMS & Sensors Chapter
– chip/package/heatsink, sensing, gradients, unit-cells, package design …
Speaker: Tom Tarter, Package Science Services LLC
Time: Networking and optional dinner at 6:00 PM; Presentation at 6:45 PM
Cost: $25 for IEEE Members, $33 for non-members, $10 for fulltime students and currently unemployed (no cost for talk)
Place: Biltmore Hotel, 2151 Laurelwood Rd, Santa Clara
RSVP: from website
Web: www.cpmt.org/scv

Irrespective of if a device gets smaller, larger, hotter or cooler, some method is needed to determine the thermal behavior of a given chip/package/heatsink configuration. This is typically achieved by a combination of models and measurements and is useful in guiding the design team to the most (more…)

20141210scv

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