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January 23, 2015

From Development to Manufacturing: Insights into the Latest Activities of the Advanced Packaging Market

by @ 6:58 pm. Filed under ALL, Blogroll, Communications, Computers/Software, Electrical/Power, Electronics Design, Engineering Mgmt
 

Wednesday, March 10, 2015
Component, Packaging, and Manufacturing Technologies (CPMT)
Subject: From Development to Manufacturing: Insights into the Latest Activities of the Advanced Packaging Market
– 3DIC, substrates, flip chip, embedded technologies …
Speaker: Rozalia G. Beica is the Chief Technology Officer at Yole Developpement
Time: Networking and pizza at 5:45 pm; Presentation at 6:30 pm (be there 6:15 pm)
Cost: $5 donation for food
Place: Texas Instruments Building E Conference Center, 2900 Semiconductor Dr., Santa Clara
RSVP: http://www.cpmt.org/scv/meetings/cpmt1503.html/

20150310ALL

Advanced Stacked Die Packaging Technology: More than 2D

by @ 6:37 pm. Filed under ALL, Blogroll, Communications, Electrical/Power, Electronics Design, Engineering Mgmt
 

Thursday February 26, 2015
Component, Packaging, and Manufacturing Technologies (CPMT)
Subject: Advanced Stacked Die Packaging Technology: More than 2D
– 3DIC, 2.5D, 2.1D, 2.01D, F2F (3D-), Glass interposer …
Speaker: Dr. John Y. Xie, Director, Packaging Technology Research and Development, Altera Corp
Time: Networking and pizza at 11:30 am; Presentation at noon
Cost: $5 donation for food
Place: Texas Instruments Building E Conference Center, 2900 Semiconductor Dr., Santa Clara
RSVP: http://www.cpmt.org/scv/meetings/cpmt1502l.html

20150226ALL

Education Awards / scholarships for high school and undergraduate students

by @ 5:40 pm. Filed under ALL
 

SCV-SVEC Education Awards Deadline is February 7, 2015. For awards eligibility and criteria http://www.svec.org/scholarship-awards.html

20150207ALL

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