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Technology & Networking in Silicon Valley & the SF Bay Area: Upcoming Meetings, Courses and Conferences

May 27, 2015

Will solar combined with storage hasten “grid defection?”

by @ 3:43 pm. Filed under ALL, Electrical/Power
 

Wednesday, June 10, 2015 
SCV PhotoVoltaic Chapter (PV) 
Subject: Will solar combined with storage hasten “grid defection?” 
– solar-generated power, forego a grid connection and cut the cord to the utility …
Speaker: Eric Wesoff, industry analyst, writer, consultant, speaker, expert witness in the renewable energy field 
Time: 6:30 pm: check in and networking 7:00 – 8:30 pm: presentation 
Cost: Free, sponsorship of refreshements welcome 
Venue: Palo Alto Research Center (PARC), G.E. Pake Auditorium, 3333 Coyote Hill Road, Palo Alto 
Event Details: http://ewh.ieee.org/r6/scv/pv/index.html

20150610ALL

Tour of Stanford Central Energy Facility

by @ 2:28 pm. Filed under ALL, Electrical/Power
 

Friday June 12, 2015 
SCV Power & Engergy Society (PES) and Industry Applications Society (IAS) 
Subject: Tour of Stanford Central Energy Facility 
– new Central Energy Facility replaces the Cardinal Co-gen Plant on Stanford University campus … 
Time: 1:30 pm arrival to allow time to pay for parking and check in, tour from 2 to 4 pm; no late arrivals 
Cost: Free for IEEE members. IEEE Membership, ID, and appropriate PPE are required for the tour, no walk-ins for this tour 
Location: Stanford University, 506 Oak Road, Stanford. The tour will start at the main entrance which is located on Fremont Road. 
Event Details: http://power.ieeesiliconvalley.org/events/ 
RSVP: Pre-registration required http://power.ieeesiliconvalley.org/events/

20150612ALL

Adhesion and Thermo-mechanical Reliability for Emerging Device, Energy and Bio-Technologies

by @ 1:45 pm. Filed under ALL, BioEngineering, Electronics Design, Semiconductors
 

Thursday, June 4th, 2015 
SCV Reliability Chapter 
Subject: Adhesion and Thermo-mechanical Reliability for Emerging Device, Energy and Bio-Technologies 
-Debonding and cohesive fracture are major challenges, characterizing thin-film thermomechanical properties, emerging device technologies, integrating new multi-functional hybrid films, underlying molecular structure … 
Speaker: Prof. Reinhold H. Dauskardt, Materials Science and Engineering, Stanford University 
Time: 6:00pm: Check-in, food & drinks; 6:30 to 7:30 pm: Presentation 
Cost: Free 
Location: Qualcomm Inc, 3165 Kifer Rd, Santa Clara, in the cafeteria in B building 
Event Registration: http://www.eventbrite.com/e/adhesion-and-thermomechanical-reliability-tickets-17148140550 
Food sponsored by ICE Labs, ISO 9001 & 17025 Reliability Test Lab, www.rel-test.com

20150604ALL

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