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June 23, 2015

Embedding Passive and Active Devices in Substrates

by @ 1:04 pm. Filed under ALL, Electronics Design, Semiconductors
 

Thursday, July 23, 2015 
SCV Components, Packaging, and Manufacturing Technologies (CPMT) 
Subject: Embedding Passive and Active Devices in Substrates 
– Embedded Component Packaging (ECP), embedding of passive and active components in an organic substrate …
Speaker: Michael Tschandl, Advanced Packaging Business Unit, AT&S Americas LLC 
Time: 11:30 am, check-in, light food, networking; 12 noon: presentation 
Cost: $5 non-IEEE members, Free for members (please use code IEEE2015); Talk-Only: FREE 
Location: Biltmore Hotel, 2151 Laurelwood Road (at 101), Santa Clara
Event Details: http://www.cpmt.org/scv/meetings/cpmt1507l.html 
RSVP by the end of July 21

20150723ALL

Anisotropic Conductive Film (ACF) Interconnection Technology for Wearable Electronics Applications

by @ 1:02 pm. Filed under ALL, Electronics Design, Semiconductors
 

Wednesday, September 9, 2015 
SCV Components, Packaging, and Manufacturing Technologies (CPMT) 
Subject: Anisotropic Conductive Film (ACF) Interconnection Technology for Wearable Electronics Applications 
– flexible printed circuits (FPCs) substrates, COF (Chip On Flex)/ CIF (Chip In Flex), FOF (Flex On Flex) and FOF (Flex On Fabric) technologies …
Speaker: Prof. Kyung W. Paik, Korea Advanced Institute of Science and Technology (KAIST) 
Time: 11:30 am: check-in, light food, networking; 12 noon: presentation 
Cost: $5 non-IEEE members, Free for members (please use code IEEE2015) if preregistered, $5 at the door; Talk-Only: Free 
Location: Texas Instruments (TI), Building E Conference Center, 2900 Semiconductor Dr., Santa Clara 
RSVP by September 6: http://www.cpmt.org/scv/meetings/cpmt1509l.html

20150909ALL

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