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September 21, 2015

Chips ‘Face-Up’ Panelization Approach for Fan-Out Packaging

by @ 9:33 pm. Filed under ALL, Semiconductors
 

Wednesday, October 14, 2015 
SCV Components, Packaging, and Manufacturing Technologies (CPMT) 
Subject: Chips ‘Face-Up’ Panelization Approach for Fan-Out Packaging 
– die with preformed Cu studs are placed face-up on a carrier, high density RDL wiring, Adaptive Patterning strategies …
Speaker: Boyd Rogers, Deca Technologies, Inc.
Time: 11:30 am: lunch; 12 noon to 1:00 pm: presentation 
Cost: $5 for IEEE members, students, and unemployed; no cost for talk-only at noon. Please register in advance so we know how much food to purchase, but pay at the door. 
Location: Texas Instruments (TI), Building E Conference Center, 2900 Semiconductor Dr., Santa Clara 
Event Details and registration: http://www.cpmt.org/scv/meetings/cpmt1510.html

20151014ALL

AnDevCon

by @ 2:58 pm. Filed under ALL, Computers/Software
 

AnDevCon, December 1-3 in Santa Clara, is the technical conference for software developers building or selling Android apps. It will offer one day of intensive tutorials, followed by two days of technical classes. More than 1,000 software developers, engineers and entrepreneurs will attend AnDevCon and choose from 70+ classes. Visit more than 35 exhibitors! Receive a $200 discount off the prevailing rate of the 3 day pass by inserting the code IEEE when prompted atwww.andevcon.com

20151201ALL

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