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February 17, 2016

A Flexible Manufacturing Platform for High-Volume TCB and High Density FOWLP

by @ 1:35 pm. Filed under ALL, Semiconductors
 

Thursday, February 25, 2016 
SCV Components, Packaging, and Manufacturing Technologies (CPMT) 
Subject: A Flexible Manufacturing Platform for High-Volume TCB and High Density FOWLP 
– Thermocompression bonding enables the next generation fine pitch 2.5D and 3D products using Cu pillar interconnects, memory market and stacked DRAM packages, highly accurate die placement in Fan-out Wafer Level Packages (FOWLP), pitches as low as 30um… 
Speaker: Tom Strothmann, Director Advanced Packaging Next-Generation Products, Kulicke & Soffa Industries, Inc. 
Time: 11:30 am: Networking, sandwiches & drinks; 12:00 noon to 1 pm: Presentation 
Cost: $5 for IEEE members, students, and unemployed; $10 for non-IEEE members 
Location: Texas Instruments, Building E Conference Center, 2900 Semiconductor Dr., Santa Clara 
Event Details and Registration: http://www.cpmt.org/scv/

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