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January 1, 2010

Course: Design of Air and Water Cooled Heat Exchangers for Electronics Cooling

by @ 9:00 pm. Filed under ALL, Communications, Computers/Software, Electronics Design, Engineering Mgmt

Design of Air and Water Cooled Heat Exchangers for Electronics Cooling: A Critical Review of Data and Analysis Methods for Heat Sinks and Cold Plates
Alfonso (Al) Ortega, Ph.D., Professor of Energy Technology, Associate Dean for Graduate Studies and Research, College of Engineering, Villanova University
Date: Sunday, Feb. 21, 2010
AT: SEMI-THERM Symposium, Santa Clara Conv’n Ctr
In the current era in which computational fluid dynamics is increasingly used as a primary simulation tool in thermal fluid design in electronic system, it is easy to forget that such tools generate design data but not design solutions. Over the past twenty years, understanding of the thermal-fluid behavior of air and liquid cooled heat exchangers / heat sinks has increased dramatically. This understanding has lead to significant advances in the modeling of the thermofluid phenomena using analytical and semi-analytical approaches that are embeddable in simple design tools and that are essential in understanding and scaling the data that are produced from computational simulation and benchtop experimentation.
This one-day short course is intended for the engineer who wants to:
– Better understand the mechanisms of fluid flow and heat transfer
– Become better acquainted with the theory of compact heat exchangers and how it applies to heat sink and cold plate design
– Know where to find reliable design and validation data
– Learn about the generally accepted methodologies, models and correlations useful for conventional and advanced air-cooled heat sinks
– Become familiar with generally accepted principles for liquid-cooled cold plate design at conventional scales and emerging principles and data for micro-scale heat sink design
– The course will be taught using a classroom format aimed at practicing engineers, emphasizing fundamental principles and sound physics-based design and modeling approaches, illustrated by many examples.
MORE INFORMATION: (see Advance Program)

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