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January 9, 2010

Mtg: High-Reliability Through-Silicon Via (TSV) Solutions for Image Sensor Packaging

by @ 2:05 pm. Filed under ALL, Communications, Optics/Displays, Semiconductors
 

WEDNESDAY January 13, 2010
SCV Components, Packaging and Manufacturing Technology, with Photonics Chapters
Speaker: Belgacem Haba, Fellow and Chief Technology Officer, Interconnect, Components & Materials (ICM), Tessera
Time: Optional dinner at 6:30 PM; Presentation (no cost) at 7:30 PM
Cost: $25 if reserved by Jan. 11; $30 at door
Place: Biltmore Hotel, 2151 Laurelwood Rd (Fwy 101 at Montague Expressway), Santa Clara
RSVP: via our DoubleKnot reservation site
Web: www.cpmt.org/scv

There is no doubt that the potential of imaging is astronomical.? Current and potential markets include digital still cameras, business applications, Web-cams, cell phone cameras, security cameras, gaming, video, automotive and toys.? In 2009, the industry shipped 2.5 billion image sensor units with an average selling price of $5 รข?? providing a total addressable market of $12B.? This presentation will discuss image sensor and camera module trends and growth.? It will trace the growing movement in the image sensor market from chip-on-board to wafer-level packaging for cost savings and other advantages.? It also will trace the image sensor evolution toward wafer-level packaging and introduce through-silicon via (TSV) wafer-level chip-scale packaging, and how to address the barriers to adoption with a new approach.

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