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January 14, 2010

Mtg: Integrated RF-CMOS MEMS Solutions for Mobile Terminals

by @ 11:02 am. Filed under ALL, Communications, Electronics Design, Engineering Mgmt, NanoEngineering, Optics/Displays, Semiconductors
 

THURSDAY March 25, 2010
SCV Components, Packaging and Manufacturing Technology Chapter
Speaker: Jeffrey L. Hilbert, President, WiSpry, Inc. (Irvine, CA)
Time: Buffet Lunch at 11:30 AM; Presentation at 12:00 PM Noon
Cost: $15 if reserved by March 23 ($5 for full-time student, unemployed); $20 after & at door; vegetarian available; no cost for presentation only
Place: Biltmore Hotel, 2151 Laurelwood Rd (Fwy 101 at Montague Expressway), Santa Clara
RSVP: Through the website link
Web: www.cpmt.org/scv

The mobile terminal market is characterized by very large volumes, very short product development cycles, decreasing product life times, and very low and rapidly declining product prices.? These market characteristics make adoption of a new technology a risky proposition particularly when there is little to no high volume manufacturing and field performance data to demonstrate the technology is proven and truly ready for insertion.
Emerging 3G and soon, 4G, applications have intensified the requirements for a new, disruptive technology to implement next generation mobile terminal hardware particularly in the RF front-end of these devices.? RF micro-electro-mechanical systems (RF-MEMS) is one such technology.? Deep integration of RF-MEMS with high volume industry mainstream CMOS technology provides a novel approach to accessing the numerous benefits enabled by micro-mechanical devices while achieving the cost points and scalability required for success in the mobile terminal market.
State-of-the-art results from the implementation of software tunable, digital, RF-MEMS circuits in 180nm CMOS will be discussed from the perspectives of process, device, and product technology integration.? Future research directions and product applications will also be presented to highlight areas of the greatest challenges and opportunities.

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