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January 24, 2010

Mtg: Thin is In: Thinning of IC Chips

by @ 2:01 pm. Filed under ALL, Communications, Electronics Design, Engineering Mgmt, Optics/Displays, Semiconductors
 

THURSDAY January 28, 2010
SCV Components, Packaging and Manufacturing Technology Chapter
Speaker: Annette Teng, Ph.D., Corwil Technology Corp.
Time: Registration at 11:30 AM; Buffet lunch at 11:45 AM; presentation (no cost) at 12:15 PM
Cost: $15 if reserved by Jan 26; $20 at door; vegetarian available
Place: Biltmore Hotel, 2151 Laurelwood Rd (Fwy 101 at Montague Expressway), Santa Clara
RSVP: Through the website link
Web: www.cpmt.org/scv

Silicon chips as thin as 0.050um are becoming common.? Many manufacturers have achieved success in their development of thin die.? This talk will focus on singulation and thinning techniques to create silicon crystal slices which can withstand the assembly, packaging and field service.? The talk will? discuss? using die attach films (DAF) to support the ultra-thin dies and to stack dies vertically.? The speaker will also address the shifting landscape of the component manufacturing industry, such as the increased use of laser cutting and the outlook for DAF films replacing traditional die attach epoxy.

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