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April 7, 2010

Mtg: Novel Fine Pitch, Low Profile, Low Cost Connector Technology

by @ 7:22 am. Filed under ALL, Electronics Design, Engineering Mgmt, Optics/Displays, Semiconductors

WEDNESDAY June 9, 2010
SCV Components, Packaging and Manufacturing Technology Chapter, with Electromagnetic Compatibility Chapter
Speaker: David Light, VP Technology, Neoconix, Inc.
Time: Dinner at 6:00 PM; Presentation at 6:45 PM
Cost: $20 if reserved by June 7 ($10 for students, unemployed); $25 after & at door; vegetarian available; no cost for presentation only
Place: Biltmore Hotel, 2151 Laurelwood Rd (Fwy 101 at Montague Expressway), Santa Clara
RSVP: Through the website link

This talk will present a revolutionary connector technology providing unparalleled design flexibility at low cost. A photolithographic approach to connector definition coupled with batch, printed circuit manufacturing methods allows highly configurable designs. Pin-out modifications, electrical performance tuning, tailoring of mechanical characteristics, and even adjustment of connector thickness can be accomplished quickly and easily with CAD modifications to low cost photo-masks and/or by modifications to the bill of materials. Connectors can be custom designed and fully optimized for each revision or generation of a product, with minimal tooling costs and lead time. Lithographically defined contact arrays also enable high levels of integration and miniaturization รข?? pitch is no longer limited by the practical limitations of injection molding connector housings into which free standing spring contacts are subsequently stitched. Neoconix utilizes a MEMS process model, implemented using the low-cost printed circuit substrate infrastructure, to fabricate contact arrays that can scale with advances in photo-lithography and HDI printed circuit substrate technology.
The connector fabrication process starts by defining arrays of copper alloy beams, in sheet format, in their ultimate configuration using large format, batch lithography and etch methods. The arrays of beams, still in sheet format, are then formed into three dimensional, ‘S’-shaped cantilever beams, using low cost, programmable dies. The sheets of contact arrays are subsequently integrated into connector ‘interposer’ structures using standard printed circuit fabrication processes, including lamination, plating, and etching. The resulting one or two sided contact arrays can function as freestanding interposers or are readily integrated into standardized, low cost connector housings that provide alignment, attachment and actuation.
This talk will review basic elements of the Neoconix PCBeam technology, and will use real-world applications as well as simulations to describe recent learning on the relative impact of the flexible design elements on signal integrity and bandwidth, mechanical characteristics, durability, contact resistance, and reliability, and will describe applications where system level designs have been improved from a functional, form factor and/or cost perspective by implementing Neoconix interconnect structures.

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