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April 21, 2010

Mtg: Thermal Management for the Design of Telecom and Server Systems (with Lab Tour)

by @ 10:01 am. Filed under ALL, Communications, Computers/Software, Electronics Design, Semiconductors

THURSDAY May 27, 2010
SCV Components, Packaging and Manufacturing Technology Chapter
Speakers: Marlin Vogel, Electronic Cooling Solutions and Bernie Siegal, President, Thermal Engineering Associates
Time: Registration, free pizza and soft drinks at 11:30 AM; Presentation at 12:00 Noon; Tour at 12:30 PM
Cost: none
Place: Thermal Design Center, 2915 Copper Road, Santa Clara
RSVP: Through the website link; limited to first 40 registrants.

A systematic approach will be provided for architecting and determining the feasibility of a system thermal design, along with presenting the necessary process steps required to validate and finalize a reliable system design.? The approach includes combining รข??back-of-the-envelope??? calculations with computational fluid dynamic (CFD) analysis to identify a preliminary system design; identify critical areas for long lead thermal component design, if applicable, such as heat pipe heat sinks or air movers; define thermal component and system testing in order to determine boundary conditions required by the CFD analysis for updating the system design, along with validating preliminary and final versions of the thermal design.? The role and impact of the thermal architect and design process on the overall system architecture and design will be presented.? Wind tunnel test methods will be demonstrated for validating the system airflow performance, along with validating air mover performance.
The facility tour will also include demonstrating CFD analysis prediction of airflow results for a system, depicting the steady state airflow trajectory path through the system.

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