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September 28, 2010

Conf: 3D Architectures for Semiconductor Integration and Packaging

by @ 10:17 am. Filed under ALL, Electronics Design, Engineering Mgmt, Semiconductors
 

Keys to Design, Manufacturing, and Marketing
3D Architectures for Semiconductor Integration and Packaging
– December 8-10, 2010 ? – Hyatt Regency S.F. Airport, Burlingame
3-D integration and packaging represents a paradigm shift for the semiconductor industry, opening entirely new pathways for performance advancement and new prospects for industry growth. ? ? Focus: ? – Market Impacts and Analysis ? – End-user Perspectives ? – 3-D Integration & Packaging Technologies ? – Design Methodology and Tools ? – Manufacturing Issues and Solutions Sessions: ? – The IDM and Foundry Perspective ? – Growth Forecasts ? – Applications ? – Rethinking Design Approaches ? – The Packaging Foundry’s Vital Role ? – Industry and Government Funded 3-D Efforts ? รข?? Key Research Outcomes and Resources
Reduced Fees through November 24th — save $100.
Visit techventure.rti.org/Winter2010?

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