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October 9, 2010

Seminar: Moore’s Law for System Integration

by @ 11:05 am. Filed under ALL, Communications, Computers/Software, Electronics Design, Engineering Mgmt, Optics/Displays, Semiconductors

TUESDAY October 12, 2010
SCV Components, Packaging and Manufacturing Technology Chapter
Speaker: Prof. Rao Tummala, Founding Director, NSF Packaging Research Center, Georgia Tech, past President of CPMT Society & IEEE Fellow
Time: Preregistration at 2:45 PM; Seminar from 3:00 – 5:00 PM; Optional dinner at 6:00 PM (see below)
Cost: $25 for IEEE members, $35 for non-members, $10 for full-time students/unemployed
Place: Biltmore Hotel, 2151 Laurelwood Rd (Fwy 101 at Montague Expressway), Santa Clara
RSVP: From the website

Electronics has been and continues to be one of the largest global industries, with $1.4T market value.? It has been the driving engine for science, engineering and manufacturing, leading to the global prosperity in those parts of the world that invested and participated in it.? The first electronics wave, which started with the invention of the transistor, has been largely due to Moore’s Law based on CMOS, or the First Law of Electronics, and the associated hybrid and discrete component-based approach to system integration using 100s of discrete components made of ceramics, organics, silicon, metals, solders and alloys.? This CMOS-based era is beginning to pose major barriers beyond 22 nm due to design complexity, minimal performance gain and escalating wafer costs.
A new era has begun to emerge, the focus of which is on 3D ICs instead of monolithic integration of heterogeneous functions.? While the impact of this approach is profound, it addresses a small part of the system.? What is necessary is another paradigm shift to MooreĆ¢??s Law for System Integration leading to unparalleled miniaturization, functionality and cost at system level.? This is the focus of this presentation with with nanoscale components for actives, passives, thermal interfaces, System interconnections, and batteries at micro and nano-scales.

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