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December 19, 2010

Mtg: An Evolutionary Leadless Package

by @ 5:05 pm. Filed under ALL, Communications, Electronics Design, Semiconductors

THURSDAY February 24, 2011
SCV Components, Packaging and Manufacturing Technology Chapter
Speaker: Kelly R. McKendrick Sr., UTAC UGS America Sales Inc.
Time: Buffet lunch at 11:30 AM; Presentation at 12:15 PM
Cost: $15; $5 for fulltime students and currently unemployed; $5 more at door
Place: Biltmore Hotel, 2151 Laurelwood Rd (Fwy 101 at Montague Expressway), Santa Clara
RSVP: from website, by Feb 22

In the semiconductor packaging world, we want it all. Of course it does not always work that way. If we could somehow incorporate and integrate the advantages of QFN, fpBGA, CSP, TAPP/TLA, FC, TQFP, TSOP and other assembly technologies into a single package, we would be getting close. With assembly and packaging now more of an integral part of the whole semiconductor design solution, more flexibility in the actual package design has evolved into a requirement. The bottom line is that the semiconductor industry wants a package that is extremely flexible to the die design as well as the PCB board design; has higher I/O in relation to body size; has the largest die-to-package body size ratio; reduces the board level footprint; is green, reliable, thin; and of course is manufacturable. Oh, and don’t forget high yields, cost-competitive, and with excellent thermal and electrical performance. Sounds easy enough.
A leadframe-based technology offered at UTAC called HLAâ?¢ (Hi-Density Leadframe Array) has truly made a breakthrough in taking advantage of many of the best attributes of the aforementioned packages and incorporating them into a package that is truly evolutionary. The result is the industry’s highest I/O solution for a lead-frame-based package (e.g. 5×5 mm with 100 leads with 0.5 mm pitch). It can replace many types of QFN, TQFP, FC, CSP and even fpBGA products. Basically, HLA allows the designer to design the package around the chip as well as the PCB board.

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