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January 8, 2011

Mtg: Putting Thin Copper on Flexible Materials

by @ 8:27 am. Filed under ALL, Electronics Design, Engineering Mgmt, Semiconductors
 

WEDNESDAY January 12, 2011
SCV Components, Packaging and Manufacturing Technology Chapter
Speaker: Alex N. Beavers, Jr., Ph.D., Executive Director, Ventures and Licenses, SRI International
Time: Networking and buffet dinner at 6:00 PM; Presentation at 6:45 PM
Cost: $20; $10 for fulltime students and currently unemployed; $5 more at door
Place: Biltmore Hotel, 2151 Laurelwood Rd (Fwy 101 at Montague Expressway), Santa Clara
RSVP: from website, by Jan. 10
Web: www.cpmt.org/scv

A novel approach for metalizing patterns and entire surfaces of flexible substrates is being commercialized by Averatek Corporation.? Emerging from the labs of SRI International (formerly Stanford Research Institute), this new approach is a non-vacuum process that eliminates the need for expensive vacuum deposition, eliminates several expensive process steps normally associated with conventional copper-coating techniques, and produces superior adhesion without the need for a tie coat.? ? All of the process steps can be single or double sided, and have been implemented with a roll-to-roll manufacturing process.? This discussion will include current and future applications.

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