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March 6, 2011

Mtg: Low Cost, Small Footprint Die Stacking and Interconnect for 3D Package Integration

by @ 1:10 pm. Filed under ALL, Communications, Computers/Software, Electronics Design, Engineering Mgmt, Semiconductors

WEDNESDAY March 9, 2011
SCV Components, Packaging and Manufacturing Technology Chapter
Speaker: Marc Robinson, Vice President & CTO, Vertical Circuits Inc.
Time: Networking and buffet dinner at 6:00 PM; Presentation at 6:45 PM
Cost: $20; $10 for fulltime students and currently unemployed; $5 more at door
Place: Biltmore Hotel, 2151 Laurelwood Rd (Fwy 101 at Montague Expressway), Santa Clara
RSVP: from website, by March 7

By now, most of us have read about the promise of TSV (through silicon via) and the myriad of applications, mostly portable and low power, that are expected to benefit from 3D TSV solutions.? While TSV does have the potential to address and abate the relentless drive for continued feature size reduction, it still requires investment in significantly expensive capital equipment to achieve its promise of increased functionality in a smaller footprint.? Vertical Circuits (VCI) has developed an alternative packaging based solution to 3D integration that does not require significant capital expenditures, yet provides low cost, high volume manufacturing capabilities? The technology focuses on the ability to insulate critical die surfaces, and the formation of conformal conductors over those surfaces to interconnect multiple, stacked die.? VCIĆ¢??s core competency is the use of dispensable conductors for multi die packaging (flash, DRAM, MCP, MEMS, etc.), and the integration of materials to meet reliability and cost requirements for multi die high volume commercial applications.? Although VCI initially focused the technology on stacking memory die, it has broad applicability for multi die packaging.? Mr.? Robinson will review the path VCI took in the development of this technology as it sought to support the increasing breadth of applications for the technology, review the benefits of using an assembly based approach for high volume production, and update us on the latest work VCI is doing to maximize reliability and yield as it ramps this technology for large, commercial applications.

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