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April 11, 2011

Mtg: Silicon Interposers for 2.5D and 3D Packaging

by @ 2:55 pm. Filed under ALL, Computers/Software, Electronics Design, Engineering Mgmt, Semiconductors

THURSDAY May 26, 2011
SCV Components, Packaging and Manufacturing Technology Chapter
Speaker: Phil Marcoux
Time: Registration at 11:30 AM; Buffet lunch at 11:45; Presentation (no cost) at 12:15 PM
Cost: $15 ($5 for full-time students, unemployed). $5 more at door
Place: Biltmore Hotel, 2151 Laurelwood Rd (Fwy 101 at Montague Expressway), Santa Clara
RSVP: from website

Skyscrapers are taking over skylines in virtually every major city in the world.? The same is occurring in semiconductor packaging.? Electronic product density requirements have driven semiconductor packaging to the point where the components are being assembled on top of each other.
There are a variety of skyscraper building technologies being evaluated and promoted.? The majority of these new technologies are being called “2.5D or 3D packages”.? The most commonly accepted 2.5D technology employs a “PCB” built on silicon and is called an interposer.? 3D technology doesn’t use silicon PCBs but incorporates newer, advanced die interconnection and solder reflow requirements.
This lunch talk will discuss the hows and whys of what some people call the “2.5D Evolution, but 3D Revolution” by someone who’s living in the midst of the turmoil.

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