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April 11, 2011

Mtg: Developments in MEMS Packaging

by @ 3:02 pm. Filed under ALL, Electronics Design, Engineering Mgmt, Optics/Displays, Semiconductors
 

WEDNESDAY April 13, 2011
SCV Components, Packaging and Manufacturing Technology Chapter
Speaker: Alissa Fitzgerald, Founder, AMFitzgerald and Associates
Time: Buffet dinner at 6:00 PM; Presentation (no cost) at 6:45 PM
Cost: $20; $10 for fulltime students and currently unemployed engineers
Place: Biltmore Hotel, 2151 Laurelwood Rd (Fwy 101 at Montague Expressway), Santa Clara
RSVP: from the website
Web: www.cpmt.org/scv

The MEMS industry was born nearly 40 years ago when mechanical engineers decided to use the tools in a semiconductor fab to make structures, not transistors, on silicon wafers.? Since then, MEMS has evolved into an industry of its own, and along the way, has developed new process and packaging capabilities.? Some of these capabilities, such as deep silicon etch, sacrificial material deposition/release and wafer-level bonding are finding their way back into the semiconductor world in applications such as through-silicon via (TSV), chip stacking and trench isolation.
In this talk, I will review some of the more interesting process and packaging technologies that have emerged from the field of MEMS.? Many of these innovations came about as a result of engineers trying to cope with the challenges of packaging MEMS devices — which are far more fragile than IC chips — and as sensors, must interact with their surrounding environment.

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