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July 18, 2011

Mtg: Design and Implementation of Ethernet Magnetics and Power Magnetics using Planar PCB-Based Embedded Ferrite Technology

by @ 9:08 am. Filed under ALL, Electronics Design

WEDNESDAY July 20, 2011
SCV Power Electronics Chapter
Speaker: Dr. Sidharth Dalmia, Senior Manager, Development Engineering, TE Connectivity
Time: Networking & Pizza at 6:00 PM; Presentation at 6:30 PM
Cost: none
Place: National Semiconductor Building E Auditorium 2900 Semiconductor Drive, Santa Clara
RSVP: not required

Miniaturization, increased throughput and functionality are key drivers in the deployment of Ethernet switches/routers, mobile handheld devices and laptops.? Isolation transformers, common mode chokes, power chokes and power inductors are key components used in these applications.? This presentation presents a novel multilayer PCB-based substrate technology for such components that provides for large economies of scale and a lower cost alternative to hand-wound or machine-wound devices.
The presentation will show novel design, implementation, measurements, reliability data and integration of multiple ferrite components such as 1:1 Ethernet transformers for IEEE 802.3 at electromagnetic interference (EMI) chokes, 4 Amp to 6 Amp power EMI chokes for laptops, and 1 Amp to 25 Amp power inductors for laptops.? These components and process technologies are being targeted as a cost-effective, high-performance, miniaturized alternative to hand-wound and machine-wound technologies.
The first example of this technology is 10/100 discrete magnetics, which integrate the required magnetics for two Ethernet channels.? These components can be mounted on either side of a host PCB using lead-free reflow processes with a thousand components manufacturable on one PCB.? Each of the two channels consists of a 1:1 transformer with an open circuit inductance of 500 uH at 100 KHz while meeting an isolation voltage of 2250V DC.? These transformers are constructed based on cross-section and design rules that allow for a pair of 100 Ohm differential lines to be wrapped around the ferrite with tight precision.? The metal layers are connected from top to bottom using differential through vias.? The spacing/line width of the differential lines are uniquely chosen so that they can provide 2250V isolation while providing stable impedance over 100 KHz to multi-GHz.? Chokes are mounted on the top side of transformers and can also be embedded in the substrate.? A combination of these transformers and chokes are placed in integrated connector modules (ICMs).? Finally, this technology is also capable of integrating power inductors and power chokes for DC-Dc applications.

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