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January 24, 2008

Mtg: Using a Spatial View to Understand and Solve Common Power Bypass Problems

by @ 8:26 pm. Filed under ALL, Communications, Computers/Software, Electronics Design, Engineering Mgmt, Semiconductors
 

TUESDAY February 12
SCV Electromagnetic Compatibility Chapter
Speaker: Steve Weir, Teraspeed Consulting Group LLC
Time: Social at 5:30 PM, Presentation at 6:30 PM
Cost: none
Place: Applied Materials Bowers Cafeteria, 3090 Bowers Ave., Santa Clara
RSVP: not required
Web: www.scvemc.org

? An ideal power delivery system exhibits a flat impedance at a low enough value across the load frequency. ? In practice this is not practical: as ICs routinely depend on a specific minimum real power supply impedance, interconnects make the power distribution system appear inductive at relatively low frequencies. ? Analysis of the power system from a spatial standpoint affords both an intuitive and analytically correct view that leads to effective designs at low cost.

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