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July 25, 2011

Tour: SMT (Surface Mount Technology) Manufacturing and Engineering

by @ 10:36 am. Filed under ALL, Communications, Electronics Design, Engineering Mgmt, Semiconductors

TUESDAY July 26, 2011
SCV Communications, with Components, Packaging and Manufacturing Technology Chapters
Speaker: Affif Siddique, VP – Strategy & Business, Whizz Systems, and staff
Time: Intro at 4:00 PM; small-group tours from 4:15 – 6:15 PM; pizza and drinks at 6:00 PM
Cost: none
Place: Whizz Systems, Inc, 3240 Scott Blvd, Santa Clara
RSVP: from website

Tour participants will learn how the complete PCB (Printed Circuit Board) design and assembly process works today (which is quite different from what was done several years ago). They will experience an inside view of a complete design and manufacturing facility, learn about ISO best practices, how ESD and different packaging issues get handled in a state of the art product design and manufacturing environment.
Attendees will be able to interact with our Engineering Design and Product Development teams. We will reveal what product engineering tools are being used and how our teams select different approaches for different products and design methodologies. We’ll describe how original BGA (Ball Grid Array) work [as well as BGA re-work] is done and how itâ??s tested on 3DX, 5DX and AOI (Automated Optical Inspection) machines.
In summary, we’ll demonstrate the complete product engineering and manufacturing process from BOM (Bill of Material) procurement to finished product assembly on SMT machines. Attendees will also learn how feeders work, the difference between Lead base and RoHS (Restriction of Hazardous Substance or Lead-Free), testing and other technical issues.
If you are interested in packaging, contemporary product engineering design, assembly and/or state of the art manufacturing processes, this tour is for you!

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