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January 27, 2008

Mtg: Ultra-thin Chips – a New Paradigm in Silicon Technology

by @ 6:08 pm. Filed under ALL, Computers/Software, Electronics Design, Engineering Mgmt, NanoEngineering, Optics/Displays, Semiconductors
 

FRIDAY February 8
SCV Electron Devices Chapter
Speaker: Dr. Joachim N. Burghartz, Institute for Microelectronics Stuttgart (IMS CHIPS)
Time: 5:15 PM (Social), 5:30 PM (Presentation)
Cost: none
Place: National Semiconductor Corp. Building E1, Conference Center, 2900 Semiconductor Drive, Santa Clara
RSVP: not required
Web: www.ewh.ieee.org/r6/scv/eds

In contrast to conventional thick silicon chips, ultra-thin chips will be the basis for new applications, such as 3D integrated circuits (3D-ICs) and plastic electronics. ? This talk will introduce and compare two generically different process technologies that can be exploited for the fabrication of ICs on extremely thin chips. ? Furthermore, several application results and demonstrations will be presented and discussed based on material that has been presented at the recent IEDM and ISSCC conferences.


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