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September 17, 2011

Mtg: Transfer-Printing Semiconductor Nanodevices on Arbitrary Substrates

by @ 8:20 am. Filed under ALL, BioEngineering, NanoEngineering, Semiconductors
 

TUESDAY September 20, 2011
SCV Nanotechnology Chapter
Speaker: Dr. M. Saif Islam, Department of Electrical & Computer Engineering, UC Davis
Time: Registration & light lunch at 11:30 AM; Presentation at 12:00 Noon
Cost: IEEE Members and Students $5; Non-Members $10
Place: National Semiconductor Bldg E-1 CMA Room, 2900 Semiconductor Drive, Santa Clara
RSVP: from the website
Web: www.ieee.org/nano

An experimental method will be presented for fabricating large area, high performance single crystal devices via both top-down and bottom-up techniques and transferring them to low cost carrier substrates while simultaneously preserving the integrity, order, shape and fidelity of the transferred device arrays.? The original substrates are repeatedly used for continual production of new devices and are minimally consumed.? This greatly decreases the cost of device fabrication by dramatically reducing the material consumption and making it an environmentally benign process while offering high performance, flexibility, ease of packaging and integration.? This heterogeneous integration technique offers the ability to integrate various single crystal nanodevices on a variety of substrates for large-scale applications in energy conversion, sensing, computing and micro/nanophotonics.

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