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October 28, 2011

Conf: 3D Architectures for Semiconductor Integration and Packaging

by @ 4:25 pm. Filed under ALL, Electronics Design, Engineering Mgmt, Semiconductors
 

Today’s Manufacturing Advances – Tomorrow’s Impact and Opportunity
3D Architectures for Semiconductor Integration and Packaging
– December 12-14, 2011 ? – Hyatt Regency S.F. Airport, Burlingame
3-D integration and packaging represents a paradigm shift for the semiconductor industry. ? ? Focus: ? – Market Impacts and Analysis ? – 3-D Integration & Packaging Technologies ? – Design Methodology and Tools ? – Manufacturing Issues and Solutions ? ? Sessions: ? – 3-D Integration ? – Shaping the Future ? – Techno-Market Views ? – Tooling and Processes ? – Design and Interposers ? – Application and User Perspectives ? – Shaping the Future ? – Leading Consortia and Sponsored Research
Reduced Fees through November 2nd — save $150.
Visit techventure.rti.org .

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