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December 11, 2011

Mtg: Developments in Low-Temperature MEMS Manufacturing

by @ 4:32 pm. Filed under ALL, Electronics Design, Engineering Mgmt, NanoEngineering, Optics/Displays, Semiconductors
 

WEDNESDAY December 14, 2011
SCV Components, Packaging and Manufacturing Technology Chapter
Speaker: Jiyoung Chang, Ph.D. candidate, Mechanical Engineering, UC-Berkeley
Time: Optional buffet dinner at 6:00 PM; Presentation (no charge) at 6:45 PM
Cost: $20 per person; $10 for fulltime students and currently unemployed engineers; $5 more at the door
Place: Biltmore Hotel, 2151 Laurelwood Rd (Fwy 101 at Montague Expressway), Santa Clara
RSVP: from website
Web: www.cpmt.org/scv/meetings/cpmt1112.html

Commercialization of MEMS packaging has become a major manufacturing issue. This talk will cover several processes developed for low-temperature MEMS packaging.? The key development in low-temperature solder bonding processing will be the focus of the talk.? Using metals as MEMS packaging materials can overcome limitations of glass frit bonding.? Two bonding methods including the pre-reflow of solder and the introduction of a thin metal layer are presented.

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