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December 22, 2011

Mtg: Nanocomposite Alloy Design for High-Frequency Power Conversion Applications

by @ 8:20 am. Filed under ALL, Electrical/Power, Electronics Design, NanoEngineering

FRIDAY January 20, 2012
OEB Magnetics Chapter
Speaker: Prof. Mike McHenry, Carnegie Mellon University
Time: 11:00 AM
Cost: none
Place: Lawrence Berkeley Natl Lab bldg 15-232, Berkeley
RSVP: Please respond by email with name, company to Peter Fischer, by Jan 18

Recent DOE workshops highlight the need for advanced soft magnetic materials leveraged in novel designs of power electronic components and systems for power conditioning and grid integration. Dramatic weight and size reductions are possible in these applications through operating at increased frequencies. This talk will discuss the technical framework for a recently funded ARPA-E program where we will study high frequency (f) magnetic materials for efficient, cost-effective, and reliable grid integration of solar photovoltaic renewable energy sources. We propose to bridge the gap between materials development, component design, and system/economic analysis through parallel efforts that focus a multidisciplinary team on this goal. I will describe integrated power electronics research with thrusts in (1) materials development, (2) processing and (3) transformer topology design and fabrication. Research is targeted to develop advanced magnetic technology for lightweight, solid-state, medium voltage (>13 kV) energy conversion for MW-scale power applications such as utility-scale inverters with direct grid connection. The project team combines participants from academia (Carnegie Mellon, Univ. of Pittsburgh), industry (Magnetics, A Division of Spang and Co.), and Los Alamos National Lab. Team core competencies lie in MW-scale power system analysis and circuit design (LANL), magnetic nanocomposite development (CMU, Mag), core and component design (LANL,Mag) and systems/economic analysis (Pitt). I will discuss the scientific framework for nanocomposite magnetic materials that make these high frequency components possible.

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