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September 24, 2012

Mtg: Cost Versus Reliability Tradeoffs for Stacked Devices

by @ 2:21 pm. Filed under ALL, Electronics Design, Engineering Mgmt, Semiconductors

WEDNESDAY November 14, 2012
SCV Components, Packaging and Manufacturing Technology Chapter
Speaker: Steve Steps, Senior Director of Wafer Level Burn-In & Test, Aehr Test Systems
Time: Optional dinner at 6:00 PM; Presentation at 6:45 PM
Cost: $20 for dinner ($10 for students, unemployed); no cost for presentation
Place: Biltmore Hotel, 2151 Laurelwood Rd, Santa Clara
RSVP: from website

The industry demand for high feature-sets in very small, light products such as digital cameras, smart phones, medical devices and automotive electronics has driven a variety of high density packaging techniques.? To achieve this high density, a wide variety of 3D packaging methods have been developed. The latest technique for stacking die is the Through Silicon Via (TSV) technology under development in many companies.
Although stacking has been very effective in improving the density of the resulting device, it has been decreasing the overall reliability of the device.? Many of the same markets that are driving for high density are also becoming more reliability sensitive.? It was easy to throw away a simple cell phone if it failed.? However, modern smart phones are both much more expensive and contain more content that the user does not want to lose.? Reliability demands are even higher if the device is being used for medial or automotive purposes.
This presentation will examine the reliability implications of stacked die.? It will cover why reliable die (“Known Good Die — KGD”) is becoming more critical, what are the conditions that affect both the reliability and the need for KGD, and close with a case study of a technique for producing KGD: Wafer-Level Burn-In (WLBI).

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