IEEE S.F. Bay Area Council e-GRID's
BayAreaTech

TUESDAY November 13, 2012
SCV Electron Devices
Subject:
Speaker: Dr. Albert Bergemont, Vice President of Technology, Research & Development, Maxim Integrated Products
Time: Networking and pizza at 6:00 PM; Presentation at 6:15 PM
Cost: none
Place: Texas Instruments Building E Conference Center, 2900 Semiconductor Dr., Santa Clara
RSVP: not required
Web: www.e-grid.net/docs/1211-scv-eds.pdf

What is the technology roadmap for Analog Microelectronics?? From the major players, it seems that front end processes are not experiencing smaller features anymore.? This talk will review the state of the art analog BCD processes and highlight what are the major components (process, devices & design) required to pursue scaling.? We will also highlight the need (and its difficult implementation) for various embedded NVMs (costly floating gate versus new emerging universal memories) as well as the importance of emerging packaging technologies such as (e)WLP, embedded SIP and TSVs.
The emergence of smart systems in the consumer domain will force IC makers to gradually change their IC culture as the acquisition and merging of different skills (BCD design, Packaging, Sensors & Software) is coming on the horizon.