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November 27, 2012

Mtg: Performance Characterization of a 450mm Wafer Handling System: Test Methods & Analysis

by @ 10:13 am. Filed under ALL, Electronics Design, Engineering Mgmt, Semiconductors
 

WEDNESDAY November 28, 2012
SCV Control Systems Chapter
Speaker: Ghulam Mustafa, Ph.D., Crossing Automation, Inc.
Time: Presentation at 6:30 PM
Cost: none
Place: Intersil Corp., 1001 Murphy Ranch Road, Milpitas
RSVP: from website
Web: sites.ieee.org/scv-css

The transition to 450mm is required if the semiconductor industry is to keep up with the historic annual growth in wafer fab capacity. Since the 450mm wafers have 2.25x the surface area compared to the 300mm, the number of ICs per wafer almost double, and hence it is more economical to build a single 450mm fab rather than two 300mm fabs.? The increase in wafer size comes with the increase in tool size hence fewer tools in a given fab area.? This requires that the 450mm tools be more reliable and perform better than their 300mm counterparts as the impact on uptime and availability is more pronounced for the 450mm tool set.? This talk will focus on the methodologies applied in performance testing of a 450mm wafer handling system during the alpha design phase of the product development. Key performance characteristics are defined for each module and tests are developed to verify the spec.? Lastly, system level testing is conducted to complete the performance validation; these are then used as the final tests for shipment.

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