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December 24, 2012

Mtg: Packaging for the Cloud Computing Era

by @ 8:05 am. Filed under ALL, Computers/Software, Electronics Design, Engineering Mgmt, Semiconductors
 

THURSDAY January 24, 2013
SCV Components, Packaging and Manufacturing Technology Chapter
Speaker: Ilyas Mohammed, Principal Technologist, Invensas
Time: Registration at 11:30 AM; Buffet lunch at 11:45; Presentation at 12:15 PM
Cost: $15 for lunch ($5 for students, unemployed); no cost for presentation
Place: Biltmore Hotel, 2151 Laurelwood Rd, Santa Clara
RSVP: from website
Web: www.cpmt.org/scv

Computing is trending towards multi-core processors with multi-channel and high-bandwidth memory, low power and mobile devices, and centrally located and managed servers.? This trend has brought into focus — at least on the digital side — a need for a high performance processor-memory subsystem and an efficient and large-capacity memory solution.? There are many packaging solutions being put forward, ranging from processors with TSVs bonded to wide IO memory to stacked memory cells with TSVs.? Even though TSVs promise to offer a substantial increase in performance, there are many manufacturing, reliability and infrastructure issues.? It would be appropriate to consider how much of the promised TSV performance can be achieved through advances in conventionally manufactured 3D packages.
Two solutions, BVA PoP and xFD, are discussed that address the processor-memory bandwidth and memory density issues.? Bond Via Array (BVA) PoP consists of a processor package with free-standing wire-bonds that act as high aspect ratio and fine pitch interconnects offering 1000+ memory-logic IO in a conventional package footprint.? The design, assembly and reliability details will be discussed.? The xFD is a memory stacking scheme that offers multiple DRAM chips in a package while maintaining the high performance of a single chip package.? Designs and products ranging from high capacity DIMMs to DIMM-in-a-package modules will be shown in detail.? In summary, it will be shown that high performance can still be extracted utilizing conventional packaging infrastructure to meet the requirements of cloud computing.

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