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February 25, 2013

Int’l Reliability Innovations Conference

by @ 3:47 pm. Filed under ALL, Communications, Computers/Software, Electronics Design, Engineering Mgmt, Semiconductors

THURSDAY March 7, 2013
SCV Reliability, with Components, Packaging and Manufacturing Technology Chapter
Speakers: from Google, BAE Systems, Juniper, Western Digital, IROC Technologies, UCONN, Ilan University
Time: Light breakfast/registration at 8:00 AM; ends at 4:30 PM
Cost: None (includes breakfast and lunch)
Place: Cisco Systems, 560 MaCarthy Blvd, San Jose (and also live, over the Internet)
RSVP: from website

IRIC creates an environment where engineering professionals share their innovations for today’s and tomorrow’s challenges in the area of reliability that resulted in a robust product. It takes the current state of reliability concepts, design, methodologies, tools and applications to higher levels through innovations.? This is a joint event sponsored by Cisco Systems and the IEEE Santa Clara Valley Reliability chapter as the main sponsors and other chapters and organizations as technical co-sponsors.? You can attend the live presentations, or participate live over the Internet.
Paper Titles:
�  Physics Based Reliability Qualification
�   Subtleties of Single Event Upset Analysis and Mitigation in Sequential Cells
�  Whisker Growth in Low and High Stress Environments: Metallurgical Assessment and Statistical Analysis
�  Product Reliability Risk Mitigation through Broker Buy Analysis and Counterfeit Captures
�   Multi-Mechanism Approach to Integrated Circuit Reliability Prediction
�   Reliability Study of Network Element Design Architectures for Operating on a Remote Terminal Pole
�  Restart-ability Management in the Cisco Core Router CRS/NG
�  Workload as Usage Metric for Hard Disk Drives
�  A Soft Error Analysis Methodology For Networking System
�  The RABID Process
�  Efficient Skew Reduction for Clock Tree Design Considering NBTI and Process Variation
�  ATPG Learning BIST for Increasing Pattern Effectiveness

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